Search

Paul B. Prebilic

Examiner (ID: 10323, Phone: (571)272-4758 , Office: P/3774 )

Most Active Art Unit
3774
Art Unit(s)
3302, 1801, 3774, 3738, 2899, 3308
Total Applications
2387
Issued Applications
1530
Pending Applications
179
Abandoned Applications
684

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1391683 [patent_doc_number] => 06552419 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-04-22 [patent_title] => 'Semiconductor device and liquid crystal module using the same' [patent_app_type] => B2 [patent_app_number] => 10/022498 [patent_app_country] => US [patent_app_date] => 2001-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4374 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/552/06552419.pdf [firstpage_image] =>[orig_patent_app_number] => 10022498 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/022498
Semiconductor device and liquid crystal module using the same Dec 19, 2001 Issued
Array ( [id] => 1218160 [patent_doc_number] => 06707167 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-16 [patent_title] => 'Semiconductor package with crack-preventing member' [patent_app_type] => B2 [patent_app_number] => 10/026594 [patent_app_country] => US [patent_app_date] => 2001-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 2214 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/707/06707167.pdf [firstpage_image] =>[orig_patent_app_number] => 10026594 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/026594
Semiconductor package with crack-preventing member Dec 19, 2001 Issued
Array ( [id] => 1159904 [patent_doc_number] => 06762505 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-07-13 [patent_title] => '150 degree bump placement layout for an integrated circuit power grid' [patent_app_type] => B2 [patent_app_number] => 09/997438 [patent_app_country] => US [patent_app_date] => 2001-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 4696 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/762/06762505.pdf [firstpage_image] =>[orig_patent_app_number] => 09997438 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/997438
150 degree bump placement layout for an integrated circuit power grid Nov 28, 2001 Issued
Array ( [id] => 1249151 [patent_doc_number] => 06674174 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-01-06 [patent_title] => 'Controlled impedance transmission lines in a redistribution layer' [patent_app_type] => B2 [patent_app_number] => 10/012812 [patent_app_country] => US [patent_app_date] => 2001-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 0 [patent_no_of_words] => 4500 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/674/06674174.pdf [firstpage_image] =>[orig_patent_app_number] => 10012812 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/012812
Controlled impedance transmission lines in a redistribution layer Nov 12, 2001 Issued
Array ( [id] => 1293452 [patent_doc_number] => 06630726 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-10-07 [patent_title] => 'Power semiconductor package with strap' [patent_app_type] => B1 [patent_app_number] => 10/008048 [patent_app_country] => US [patent_app_date] => 2001-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 4318 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/630/06630726.pdf [firstpage_image] =>[orig_patent_app_number] => 10008048 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/008048
Power semiconductor package with strap Nov 6, 2001 Issued
Array ( [id] => 6790120 [patent_doc_number] => 20030085464 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-08 [patent_title] => 'Semiconductor packages for semiconductor devices' [patent_app_type] => new [patent_app_number] => 10/052945 [patent_app_country] => US [patent_app_date] => 2001-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3668 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0085/20030085464.pdf [firstpage_image] =>[orig_patent_app_number] => 10052945 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/052945
Semiconductor package comprising vertical power transistor Nov 1, 2001 Issued
Array ( [id] => 1207167 [patent_doc_number] => 06717255 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-04-06 [patent_title] => 'Chip carrier for a high-frequency electronic package' [patent_app_type] => B2 [patent_app_number] => 10/032675 [patent_app_country] => US [patent_app_date] => 2001-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3537 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/717/06717255.pdf [firstpage_image] =>[orig_patent_app_number] => 10032675 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/032675
Chip carrier for a high-frequency electronic package Oct 22, 2001 Issued
Array ( [id] => 1182264 [patent_doc_number] => 06740970 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-25 [patent_title] => 'Semiconductor device with stack of semiconductor chips' [patent_app_type] => B2 [patent_app_number] => 09/973002 [patent_app_country] => US [patent_app_date] => 2001-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3964 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/740/06740970.pdf [firstpage_image] =>[orig_patent_app_number] => 09973002 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/973002
Semiconductor device with stack of semiconductor chips Oct 9, 2001 Issued
Array ( [id] => 1319202 [patent_doc_number] => 06608373 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-08-19 [patent_title] => 'Support structure for power element' [patent_app_type] => B2 [patent_app_number] => 09/968902 [patent_app_country] => US [patent_app_date] => 2001-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1825 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 242 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/608/06608373.pdf [firstpage_image] =>[orig_patent_app_number] => 09968902 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/968902
Support structure for power element Oct 2, 2001 Issued
Array ( [id] => 1300342 [patent_doc_number] => 06628002 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-09-30 [patent_title] => 'Heat transfer system with supracritical fluid' [patent_app_type] => B2 [patent_app_number] => 09/969252 [patent_app_country] => US [patent_app_date] => 2001-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 4208 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/628/06628002.pdf [firstpage_image] =>[orig_patent_app_number] => 09969252 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/969252
Heat transfer system with supracritical fluid Oct 1, 2001 Issued
Array ( [id] => 7643530 [patent_doc_number] => 06429511 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-08-06 [patent_title] => 'Microcap wafer-level package' [patent_app_type] => B2 [patent_app_number] => 09/969432 [patent_app_country] => US [patent_app_date] => 2001-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 18 [patent_no_of_words] => 5919 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/429/06429511.pdf [firstpage_image] =>[orig_patent_app_number] => 09969432 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/969432
Microcap wafer-level package Sep 30, 2001 Issued
Array ( [id] => 6269692 [patent_doc_number] => 20020105073 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-08 [patent_title] => 'Low cost and compliant microelectronic packages for high i/o and fine pitch' [patent_app_type] => new [patent_app_number] => 09/968199 [patent_app_country] => US [patent_app_date] => 2001-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6227 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0105/20020105073.pdf [firstpage_image] =>[orig_patent_app_number] => 09968199 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/968199
Low cost and compliant microelectronic packages for high i/o and fine pitch Sep 30, 2001 Issued
Array ( [id] => 6748101 [patent_doc_number] => 20030042621 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-06 [patent_title] => 'Wire stitch bond on an integrated circuit bond pad and method of making the same' [patent_app_type] => new [patent_app_number] => 09/947064 [patent_app_country] => US [patent_app_date] => 2001-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5878 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20030042621.pdf [firstpage_image] =>[orig_patent_app_number] => 09947064 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/947064
Wire stitch bond on an integrated circuit bond pad and method of making the same Sep 4, 2001 Issued
Array ( [id] => 1218095 [patent_doc_number] => 06707139 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-16 [patent_title] => 'Semiconductor device with plural unit regions in which one or more MOSFETs are formed' [patent_app_type] => B2 [patent_app_number] => 09/928497 [patent_app_country] => US [patent_app_date] => 2001-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 15906 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/707/06707139.pdf [firstpage_image] =>[orig_patent_app_number] => 09928497 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/928497
Semiconductor device with plural unit regions in which one or more MOSFETs are formed Aug 13, 2001 Issued
Array ( [id] => 1214293 [patent_doc_number] => 06710433 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-23 [patent_title] => 'Leadless chip carrier with embedded inductor' [patent_app_type] => B2 [patent_app_number] => 09/930747 [patent_app_country] => US [patent_app_date] => 2001-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 10297 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/710/06710433.pdf [firstpage_image] =>[orig_patent_app_number] => 09930747 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/930747
Leadless chip carrier with embedded inductor Aug 13, 2001 Issued
Array ( [id] => 6577649 [patent_doc_number] => 20020041014 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-11 [patent_title] => 'Semiconductor component having a chip carrier with openings for making contact' [patent_app_type] => new [patent_app_number] => 09/925171 [patent_app_country] => US [patent_app_date] => 2001-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4474 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0041/20020041014.pdf [firstpage_image] =>[orig_patent_app_number] => 09925171 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/925171
Semiconductor component having a chip carrier with openings for making contact Aug 7, 2001 Issued
Array ( [id] => 6881681 [patent_doc_number] => 20010048153 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-06 [patent_title] => 'Method and apparatus for testing bumped die' [patent_app_type] => new [patent_app_number] => 09/923688 [patent_app_country] => US [patent_app_date] => 2001-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2741 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0048/20010048153.pdf [firstpage_image] =>[orig_patent_app_number] => 09923688 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/923688
Method and apparatus for testing bumped die Aug 5, 2001 Issued
Array ( [id] => 1218162 [patent_doc_number] => 06707168 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-16 [patent_title] => 'Shielded semiconductor package with single-sided substrate and method for making the same' [patent_app_type] => B1 [patent_app_number] => 09/848932 [patent_app_country] => US [patent_app_date] => 2001-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 1723 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/707/06707168.pdf [firstpage_image] =>[orig_patent_app_number] => 09848932 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/848932
Shielded semiconductor package with single-sided substrate and method for making the same May 3, 2001 Issued
Array ( [id] => 5933435 [patent_doc_number] => 20020060356 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-23 [patent_title] => 'Power semiconductor device' [patent_app_type] => new [patent_app_number] => 09/845272 [patent_app_country] => US [patent_app_date] => 2001-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3310 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0060/20020060356.pdf [firstpage_image] =>[orig_patent_app_number] => 09845272 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/845272
Power semiconductor device Apr 30, 2001 Abandoned
Array ( [id] => 6895232 [patent_doc_number] => 20010026022 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-04 [patent_title] => 'Method and apparatus for implementing selected functionality on an integrated circuit device' [patent_app_type] => new [patent_app_number] => 09/846005 [patent_app_country] => US [patent_app_date] => 2001-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2952 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0026/20010026022.pdf [firstpage_image] =>[orig_patent_app_number] => 09846005 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/846005
Apparatus for implementing selected functionality on an integrated circuit device Apr 29, 2001 Issued
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