Search

Peniel M. Gumedzoe

Examiner (ID: 15826)

Most Active Art Unit
2899
Art Unit(s)
2891, 2899
Total Applications
1565
Issued Applications
1275
Pending Applications
89
Abandoned Applications
248

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19093935 [patent_doc_number] => 11955400 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-09 [patent_title] => Heat distribution device with flow channels [patent_app_type] => utility [patent_app_number] => 17/687142 [patent_app_country] => US [patent_app_date] => 2022-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 21 [patent_no_of_words] => 8796 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17687142 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/687142
Heat distribution device with flow channels Mar 3, 2022 Issued
Array ( [id] => 18379925 [patent_doc_number] => 20230155014 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => Ultra-Thin Super Junction IGBT Device and Manufacturing Method Thereof [patent_app_type] => utility [patent_app_number] => 17/683300 [patent_app_country] => US [patent_app_date] => 2022-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2899 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17683300 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/683300
Ultra-thin super junction IGBT device and manufacturing method thereof Feb 27, 2022 Issued
Array ( [id] => 19183785 [patent_doc_number] => 11990385 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Electronic device [patent_app_type] => utility [patent_app_number] => 17/681694 [patent_app_country] => US [patent_app_date] => 2022-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 9200 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17681694 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/681694
Electronic device Feb 24, 2022 Issued
Array ( [id] => 17660797 [patent_doc_number] => 20220181262 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS [patent_app_type] => utility [patent_app_number] => 17/677130 [patent_app_country] => US [patent_app_date] => 2022-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14934 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17677130 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/677130
Microelectronic component having molded regions with through-mold vias Feb 21, 2022 Issued
Array ( [id] => 19038169 [patent_doc_number] => 20240087984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => SEMICONDUCTOR MODULE ASSEMBLY HAVING A COOLING BODY AND AT LEAST ONE SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 18/284751 [patent_app_country] => US [patent_app_date] => 2022-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4811 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18284751 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/284751
Semiconductor module assembly having a cooling body and at least one semiconductor module Feb 20, 2022 Issued
Array ( [id] => 17645278 [patent_doc_number] => 20220173017 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/675741 [patent_app_country] => US [patent_app_date] => 2022-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8409 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17675741 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/675741
Semiconductor device Feb 17, 2022 Issued
Array ( [id] => 18570656 [patent_doc_number] => 20230260993 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/672216 [patent_app_country] => US [patent_app_date] => 2022-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10896 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17672216 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/672216
Semiconductor device structure and methods of forming the same Feb 14, 2022 Issued
Array ( [id] => 17645617 [patent_doc_number] => 20220173356 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND FABRICATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/672652 [patent_app_country] => US [patent_app_date] => 2022-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9013 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17672652 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/672652
Organic light-emitting display apparatus and fabrication method thereof Feb 14, 2022 Issued
Array ( [id] => 18555288 [patent_doc_number] => 20230253305 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => ELECTRONIC PACKAGE [patent_app_type] => utility [patent_app_number] => 17/668237 [patent_app_country] => US [patent_app_date] => 2022-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7325 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17668237 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/668237
Electronic package Feb 8, 2022 Issued
Array ( [id] => 17900730 [patent_doc_number] => 20220310392 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-29 [patent_title] => METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/650241 [patent_app_country] => US [patent_app_date] => 2022-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3646 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17650241 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/650241
Method for manufacturing semiconductor structure, and semiconductor structure Feb 6, 2022 Issued
Array ( [id] => 18704780 [patent_doc_number] => 11791297 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-17 [patent_title] => Molded semiconductor package and related methods [patent_app_type] => utility [patent_app_number] => 17/649943 [patent_app_country] => US [patent_app_date] => 2022-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2573 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17649943 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/649943
Molded semiconductor package and related methods Feb 3, 2022 Issued
Array ( [id] => 19935122 [patent_doc_number] => 12308330 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-20 [patent_title] => Chip to chip interconnect beyond sealring boundary [patent_app_type] => utility [patent_app_number] => 17/588767 [patent_app_country] => US [patent_app_date] => 2022-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 20 [patent_no_of_words] => 0 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 193 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17588767 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/588767
Chip to chip interconnect beyond sealring boundary Jan 30, 2022 Issued
Array ( [id] => 17615369 [patent_doc_number] => 20220157649 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF [patent_app_type] => utility [patent_app_number] => 17/649503 [patent_app_country] => US [patent_app_date] => 2022-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7691 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17649503 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/649503
Source/drain isolation structure and methods thereof Jan 30, 2022 Issued
Array ( [id] => 19046680 [patent_doc_number] => 11935800 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Compound metal lid for semiconductor chip package [patent_app_type] => utility [patent_app_number] => 17/585556 [patent_app_country] => US [patent_app_date] => 2022-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 2588 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 239 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17585556 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/585556
Compound metal lid for semiconductor chip package Jan 26, 2022 Issued
Array ( [id] => 18122310 [patent_doc_number] => 20230007912 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-12 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACE STRUCTURES AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/577069 [patent_app_country] => US [patent_app_date] => 2022-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5613 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17577069 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/577069
Semiconductor package including thermal interface structures and methods of forming the same Jan 16, 2022 Issued
Array ( [id] => 18373350 [patent_doc_number] => 11653542 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-16 [patent_title] => Display apparatus [patent_app_type] => utility [patent_app_number] => 17/572922 [patent_app_country] => US [patent_app_date] => 2022-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 13382 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17572922 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/572922
Display apparatus Jan 10, 2022 Issued
Array ( [id] => 17566659 [patent_doc_number] => 20220130808 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-28 [patent_title] => Electronic Power Module [patent_app_type] => utility [patent_app_number] => 17/571931 [patent_app_country] => US [patent_app_date] => 2022-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8679 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17571931 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/571931
Electronic power module Jan 9, 2022 Issued
Array ( [id] => 19704933 [patent_doc_number] => 12198980 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-14 [patent_title] => Metal interconnection structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/570563 [patent_app_country] => US [patent_app_date] => 2022-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 3998 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17570563 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/570563
Metal interconnection structure and manufacturing method thereof Jan 6, 2022 Issued
Array ( [id] => 18394827 [patent_doc_number] => 20230163048 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => Temperature Control Element Utilized in Device Die Packages [patent_app_type] => utility [patent_app_number] => 17/570647 [patent_app_country] => US [patent_app_date] => 2022-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4022 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17570647 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/570647
Temperature control element utilized in device die packages Jan 6, 2022 Issued
Array ( [id] => 17551724 [patent_doc_number] => 20220123066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => PIXEL ARRANGEMENT STRUCTURE, ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL, DISPLAY DEVICE AND MASK PLATE ASSEMBLY [patent_app_type] => utility [patent_app_number] => 17/568073 [patent_app_country] => US [patent_app_date] => 2022-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7773 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17568073 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/568073
Pixel arrangement structure, organic light emitting diode display panel, display device and mask plate assembly Jan 3, 2022 Issued
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