Search

Peniel M. Gumedzoe

Examiner (ID: 15826)

Most Active Art Unit
2899
Art Unit(s)
2891, 2899
Total Applications
1565
Issued Applications
1275
Pending Applications
89
Abandoned Applications
248

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19221536 [patent_doc_number] => 20240186240 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-06 [patent_title] => SERIES INDUCTORS [patent_app_type] => utility [patent_app_number] => 18/438916 [patent_app_country] => US [patent_app_date] => 2024-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3242 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18438916 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/438916
Series inductors Feb 11, 2024 Issued
Array ( [id] => 19206192 [patent_doc_number] => 20240178091 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => Integrated Circuit Package and Method [patent_app_type] => utility [patent_app_number] => 18/435362 [patent_app_country] => US [patent_app_date] => 2024-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11638 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18435362 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/435362
Integrated circuit package and method Feb 6, 2024 Issued
Array ( [id] => 19206197 [patent_doc_number] => 20240178096 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STANCHION [patent_app_type] => utility [patent_app_number] => 18/432852 [patent_app_country] => US [patent_app_date] => 2024-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12874 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18432852 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/432852
System in package with flip chip die over multi-layer heatsink stanchion Feb 4, 2024 Issued
Array ( [id] => 19176129 [patent_doc_number] => 20240162103 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module [patent_app_type] => utility [patent_app_number] => 18/422759 [patent_app_country] => US [patent_app_date] => 2024-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4240 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18422759 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/422759
Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip module Jan 24, 2024 Issued
Array ( [id] => 20267083 [patent_doc_number] => 12438082 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-07 [patent_title] => Package structures and method of forming the same [patent_app_type] => utility [patent_app_number] => 18/411930 [patent_app_country] => US [patent_app_date] => 2024-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 52 [patent_figures_cnt] => 52 [patent_no_of_words] => 4449 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18411930 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/411930
Package structures and method of forming the same Jan 11, 2024 Issued
Array ( [id] => 19269517 [patent_doc_number] => 20240213221 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS [patent_app_type] => utility [patent_app_number] => 18/400219 [patent_app_country] => US [patent_app_date] => 2023-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9554 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18400219 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/400219
THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS Dec 28, 2023 Pending
Array ( [id] => 19130891 [patent_doc_number] => 20240136244 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-25 [patent_title] => IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS [patent_app_type] => utility [patent_app_number] => 18/395351 [patent_app_country] => US [patent_app_date] => 2023-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18785 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18395351 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/395351
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects Dec 21, 2023 Issued
Array ( [id] => 19071264 [patent_doc_number] => 20240105690 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE [patent_app_type] => utility [patent_app_number] => 18/531711 [patent_app_country] => US [patent_app_date] => 2023-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12544 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -24 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18531711 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/531711
Power supply system and power supply module Dec 6, 2023 Issued
Array ( [id] => 20276661 [patent_doc_number] => 12446451 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Electronic device with reduced non-device edge area [patent_app_type] => utility [patent_app_number] => 18/522582 [patent_app_country] => US [patent_app_date] => 2023-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 21 [patent_no_of_words] => 22132 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18522582 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/522582
Electronic device with reduced non-device edge area Nov 28, 2023 Issued
Array ( [id] => 19038210 [patent_doc_number] => 20240088025 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/519516 [patent_app_country] => US [patent_app_date] => 2023-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5874 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18519516 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/519516
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME Nov 26, 2023 Pending
Array ( [id] => 19038210 [patent_doc_number] => 20240088025 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/519516 [patent_app_country] => US [patent_app_date] => 2023-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5874 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18519516 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/519516
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME Nov 26, 2023 Pending
Array ( [id] => 20274880 [patent_doc_number] => 12444665 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/510599 [patent_app_country] => US [patent_app_date] => 2023-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 39 [patent_no_of_words] => 11295 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18510599 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/510599
Semiconductor device Nov 14, 2023 Issued
Array ( [id] => 20274880 [patent_doc_number] => 12444665 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/510599 [patent_app_country] => US [patent_app_date] => 2023-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 39 [patent_no_of_words] => 11295 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18510599 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/510599
Semiconductor device Nov 14, 2023 Issued
Array ( [id] => 19494311 [patent_doc_number] => 12113035 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-08 [patent_title] => Semiconductor device and method for fabricating thereof [patent_app_type] => utility [patent_app_number] => 18/499527 [patent_app_country] => US [patent_app_date] => 2023-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 34 [patent_no_of_words] => 12890 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18499527 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/499527
Semiconductor device and method for fabricating thereof Oct 31, 2023 Issued
Array ( [id] => 19007950 [patent_doc_number] => 20240072021 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/494784 [patent_app_country] => US [patent_app_date] => 2023-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13022 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18494784 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/494784
Package structure and manufacturing method thereof Oct 25, 2023 Issued
Array ( [id] => 19138032 [patent_doc_number] => 11973007 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold [patent_app_type] => utility [patent_app_number] => 18/491223 [patent_app_country] => US [patent_app_date] => 2023-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 75 [patent_figures_cnt] => 103 [patent_no_of_words] => 19498 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 293 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18491223 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/491223
Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold Oct 19, 2023 Issued
Array ( [id] => 19654492 [patent_doc_number] => 12176292 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-24 [patent_title] => Microelectronic component having molded regions with through-mold vias [patent_app_type] => utility [patent_app_number] => 18/375867 [patent_app_country] => US [patent_app_date] => 2023-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 27 [patent_no_of_words] => 14956 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 491 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18375867 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/375867
Microelectronic component having molded regions with through-mold vias Oct 1, 2023 Issued
Array ( [id] => 20167908 [patent_doc_number] => 20250259955 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-08-14 [patent_title] => METHOD FOR CHIP PACKAGING WITH HIGH-DENSITY CONNECTION LAYER, AND CHIP PACKAGING STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/997405 [patent_app_country] => US [patent_app_date] => 2023-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2303 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 465 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18997405 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/997405
METHOD FOR CHIP PACKAGING WITH HIGH-DENSITY CONNECTION LAYER, AND CHIP PACKAGING STRUCTURE Sep 19, 2023 Issued
Array ( [id] => 18883058 [patent_doc_number] => 20240006427 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => IMAGING DEVICE AND IMAGING SYSTEM [patent_app_type] => utility [patent_app_number] => 18/468933 [patent_app_country] => US [patent_app_date] => 2023-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5023 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18468933 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/468933
IMAGING DEVICE AND IMAGING SYSTEM Sep 17, 2023 Pending
Array ( [id] => 19208081 [patent_doc_number] => 20240179980 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/468376 [patent_app_country] => US [patent_app_date] => 2023-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13654 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18468376 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/468376
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME Sep 14, 2023 Pending
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