Search

Peniel M. Gumedzoe

Examiner (ID: 6124, Phone: (571)270-3041 , Office: P/2899 )

Most Active Art Unit
2899
Art Unit(s)
2899, 2891
Total Applications
1595
Issued Applications
1303
Pending Applications
83
Abandoned Applications
248

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 16699907 [patent_doc_number] => 10950515 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-03-16 [patent_title] => Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus [patent_app_type] => utility [patent_app_number] => 16/838892 [patent_app_country] => US [patent_app_date] => 2020-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 8510 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16838892 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/838892
Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus Apr 1, 2020 Issued
Array ( [id] => 17130350 [patent_doc_number] => 20210305119 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-30 [patent_title] => IC DIE WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS [patent_app_type] => utility [patent_app_number] => 16/831076 [patent_app_country] => US [patent_app_date] => 2020-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18743 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16831076 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/831076
IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects Mar 25, 2020 Issued
Array ( [id] => 17130351 [patent_doc_number] => 20210305120 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-30 [patent_title] => IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS [patent_app_type] => utility [patent_app_number] => 16/831078 [patent_app_country] => US [patent_app_date] => 2020-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18739 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16831078 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/831078
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects Mar 25, 2020 Issued
Array ( [id] => 18796974 [patent_doc_number] => 11830809 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-28 [patent_title] => Magnetic structures in integrated circuit package supports [patent_app_type] => utility [patent_app_number] => 16/829336 [patent_app_country] => US [patent_app_date] => 2020-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 21 [patent_no_of_words] => 11913 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16829336 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/829336
Magnetic structures in integrated circuit package supports Mar 24, 2020 Issued
Array ( [id] => 17529943 [patent_doc_number] => 11302643 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-12 [patent_title] => Microelectronic component having molded regions with through-mold vias [patent_app_type] => utility [patent_app_number] => 16/829396 [patent_app_country] => US [patent_app_date] => 2020-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 27 [patent_no_of_words] => 14871 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16829396 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/829396
Microelectronic component having molded regions with through-mold vias Mar 24, 2020 Issued
Array ( [id] => 17730799 [patent_doc_number] => 11387200 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-12 [patent_title] => Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric [patent_app_type] => utility [patent_app_number] => 16/827296 [patent_app_country] => US [patent_app_date] => 2020-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4862 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16827296 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/827296
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric Mar 22, 2020 Issued
Array ( [id] => 17700208 [patent_doc_number] => 11373942 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-06-28 [patent_title] => Semiconductor devices [patent_app_type] => utility [patent_app_number] => 16/826995 [patent_app_country] => US [patent_app_date] => 2020-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 18 [patent_no_of_words] => 4802 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16826995 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/826995
Semiconductor devices Mar 22, 2020 Issued
Array ( [id] => 16332314 [patent_doc_number] => 20200303280 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-09-24 [patent_title] => THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BETWEEN HEAT GENERATING COMPONENT AND HEAT SPREADER [patent_app_type] => utility [patent_app_number] => 16/823895 [patent_app_country] => US [patent_app_date] => 2020-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3830 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823895 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/823895
THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BETWEEN HEAT GENERATING COMPONENT AND HEAT SPREADER Mar 18, 2020 Abandoned
Array ( [id] => 17100190 [patent_doc_number] => 20210287981 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => SEMICONDUCTOR ASSEMBLY HAVING T-SHAPED INTERCONNECTION AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/819758 [patent_app_country] => US [patent_app_date] => 2020-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6347 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16819758 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/819758
Semiconductor assembly having T-shaped interconnection and method of manufacturing the same Mar 15, 2020 Issued
Array ( [id] => 17100161 [patent_doc_number] => 20210287952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => SYSTEM AND METHOD FOR A DEVICE PACKAGE [patent_app_type] => utility [patent_app_number] => 16/816823 [patent_app_country] => US [patent_app_date] => 2020-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6355 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16816823 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/816823
System and method for a device package Mar 11, 2020 Issued
Array ( [id] => 17615341 [patent_doc_number] => 20220157621 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/439121 [patent_app_country] => US [patent_app_date] => 2020-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13644 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17439121 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/439121
COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE Mar 4, 2020 Pending
Array ( [id] => 16715734 [patent_doc_number] => 20210082881 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-03-18 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 16/809837 [patent_app_country] => US [patent_app_date] => 2020-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3784 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16809837 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/809837
Semiconductor package Mar 4, 2020 Issued
Array ( [id] => 18131206 [patent_doc_number] => 11557421 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-17 [patent_title] => Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method [patent_app_type] => utility [patent_app_number] => 16/809689 [patent_app_country] => US [patent_app_date] => 2020-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6102 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16809689 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/809689
Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method Mar 4, 2020 Issued
Array ( [id] => 17730758 [patent_doc_number] => 11387159 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-12 [patent_title] => Chip package [patent_app_type] => utility [patent_app_number] => 16/808369 [patent_app_country] => US [patent_app_date] => 2020-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 7650 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 248 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16808369 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/808369
Chip package Mar 3, 2020 Issued
Array ( [id] => 16789212 [patent_doc_number] => 10991651 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-04-27 [patent_title] => Interconnection structure having reduced capacitance and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/808041 [patent_app_country] => US [patent_app_date] => 2020-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 5369 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16808041 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/808041
Interconnection structure having reduced capacitance and method of manufacturing the same Mar 2, 2020 Issued
Array ( [id] => 16348110 [patent_doc_number] => 20200312761 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-10-01 [patent_title] => CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/806160 [patent_app_country] => US [patent_app_date] => 2020-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9879 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806160 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/806160
Circuit board and method for manufacturing the same Mar 1, 2020 Issued
Array ( [id] => 17239771 [patent_doc_number] => 11183666 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-11-23 [patent_title] => Optoelectronic semiconductor component [patent_app_type] => utility [patent_app_number] => 16/806272 [patent_app_country] => US [patent_app_date] => 2020-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 4049 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806272 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/806272
Optoelectronic semiconductor component Mar 1, 2020 Issued
Array ( [id] => 18047961 [patent_doc_number] => 11521919 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-12-06 [patent_title] => Flex-foil package with coplanar topology for high-frequency signals [patent_app_type] => utility [patent_app_number] => 16/803072 [patent_app_country] => US [patent_app_date] => 2020-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 12805 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 420 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16803072 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/803072
Flex-foil package with coplanar topology for high-frequency signals Feb 26, 2020 Issued
Array ( [id] => 16896306 [patent_doc_number] => 11037868 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-06-15 [patent_title] => Semiconductor device package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/801061 [patent_app_country] => US [patent_app_date] => 2020-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 30 [patent_no_of_words] => 5690 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16801061 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/801061
Semiconductor device package and method of manufacturing the same Feb 24, 2020 Issued
Array ( [id] => 16080799 [patent_doc_number] => 20200194386 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-06-18 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 16/800537 [patent_app_country] => US [patent_app_date] => 2020-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7275 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16800537 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/800537
Semiconductor device Feb 24, 2020 Issued
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