
Peniel M. Gumedzoe
Examiner (ID: 6124, Phone: (571)270-3041 , Office: P/2899 )
| Most Active Art Unit | 2899 |
| Art Unit(s) | 2899, 2891 |
| Total Applications | 1595 |
| Issued Applications | 1303 |
| Pending Applications | 83 |
| Abandoned Applications | 248 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 16699907
[patent_doc_number] => 10950515
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-03-16
[patent_title] => Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus
[patent_app_type] => utility
[patent_app_number] => 16/838892
[patent_app_country] => US
[patent_app_date] => 2020-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 11
[patent_no_of_words] => 8510
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16838892
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/838892 | Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus | Apr 1, 2020 | Issued |
Array
(
[id] => 17130350
[patent_doc_number] => 20210305119
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-30
[patent_title] => IC DIE WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS
[patent_app_type] => utility
[patent_app_number] => 16/831076
[patent_app_country] => US
[patent_app_date] => 2020-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 18743
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16831076
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/831076 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Mar 25, 2020 | Issued |
Array
(
[id] => 17130351
[patent_doc_number] => 20210305120
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-30
[patent_title] => IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS
[patent_app_type] => utility
[patent_app_number] => 16/831078
[patent_app_country] => US
[patent_app_date] => 2020-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 18739
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -22
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16831078
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/831078 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Mar 25, 2020 | Issued |
Array
(
[id] => 18796974
[patent_doc_number] => 11830809
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-11-28
[patent_title] => Magnetic structures in integrated circuit package supports
[patent_app_type] => utility
[patent_app_number] => 16/829336
[patent_app_country] => US
[patent_app_date] => 2020-03-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 21
[patent_no_of_words] => 11913
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16829336
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/829336 | Magnetic structures in integrated circuit package supports | Mar 24, 2020 | Issued |
Array
(
[id] => 17529943
[patent_doc_number] => 11302643
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-04-12
[patent_title] => Microelectronic component having molded regions with through-mold vias
[patent_app_type] => utility
[patent_app_number] => 16/829396
[patent_app_country] => US
[patent_app_date] => 2020-03-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 27
[patent_no_of_words] => 14871
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16829396
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/829396 | Microelectronic component having molded regions with through-mold vias | Mar 24, 2020 | Issued |
Array
(
[id] => 17730799
[patent_doc_number] => 11387200
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-07-12
[patent_title] => Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
[patent_app_type] => utility
[patent_app_number] => 16/827296
[patent_app_country] => US
[patent_app_date] => 2020-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 4862
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16827296
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/827296 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Mar 22, 2020 | Issued |
Array
(
[id] => 17700208
[patent_doc_number] => 11373942
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-06-28
[patent_title] => Semiconductor devices
[patent_app_type] => utility
[patent_app_number] => 16/826995
[patent_app_country] => US
[patent_app_date] => 2020-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 18
[patent_no_of_words] => 4802
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 231
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16826995
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/826995 | Semiconductor devices | Mar 22, 2020 | Issued |
Array
(
[id] => 16332314
[patent_doc_number] => 20200303280
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-09-24
[patent_title] => THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BETWEEN HEAT GENERATING COMPONENT AND HEAT SPREADER
[patent_app_type] => utility
[patent_app_number] => 16/823895
[patent_app_country] => US
[patent_app_date] => 2020-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3830
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -9
[patent_words_short_claim] => 140
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823895
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/823895 | THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BETWEEN HEAT GENERATING COMPONENT AND HEAT SPREADER | Mar 18, 2020 | Abandoned |
Array
(
[id] => 17100190
[patent_doc_number] => 20210287981
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-16
[patent_title] => SEMICONDUCTOR ASSEMBLY HAVING T-SHAPED INTERCONNECTION AND METHOD OF MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 16/819758
[patent_app_country] => US
[patent_app_date] => 2020-03-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6347
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16819758
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/819758 | Semiconductor assembly having T-shaped interconnection and method of manufacturing the same | Mar 15, 2020 | Issued |
Array
(
[id] => 17100161
[patent_doc_number] => 20210287952
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-16
[patent_title] => SYSTEM AND METHOD FOR A DEVICE PACKAGE
[patent_app_type] => utility
[patent_app_number] => 16/816823
[patent_app_country] => US
[patent_app_date] => 2020-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6355
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16816823
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/816823 | System and method for a device package | Mar 11, 2020 | Issued |
Array
(
[id] => 17615341
[patent_doc_number] => 20220157621
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-05-19
[patent_title] => COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/439121
[patent_app_country] => US
[patent_app_date] => 2020-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13644
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17439121
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/439121 | COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE | Mar 4, 2020 | Pending |
Array
(
[id] => 16715734
[patent_doc_number] => 20210082881
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-03-18
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 16/809837
[patent_app_country] => US
[patent_app_date] => 2020-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3784
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16809837
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/809837 | Semiconductor package | Mar 4, 2020 | Issued |
Array
(
[id] => 18131206
[patent_doc_number] => 11557421
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-01-17
[patent_title] => Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method
[patent_app_type] => utility
[patent_app_number] => 16/809689
[patent_app_country] => US
[patent_app_date] => 2020-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 6102
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16809689
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/809689 | Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method | Mar 4, 2020 | Issued |
Array
(
[id] => 17730758
[patent_doc_number] => 11387159
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-07-12
[patent_title] => Chip package
[patent_app_type] => utility
[patent_app_number] => 16/808369
[patent_app_country] => US
[patent_app_date] => 2020-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 11
[patent_no_of_words] => 7650
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 248
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16808369
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/808369 | Chip package | Mar 3, 2020 | Issued |
Array
(
[id] => 16789212
[patent_doc_number] => 10991651
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2021-04-27
[patent_title] => Interconnection structure having reduced capacitance and method of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 16/808041
[patent_app_country] => US
[patent_app_date] => 2020-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 5369
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16808041
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/808041 | Interconnection structure having reduced capacitance and method of manufacturing the same | Mar 2, 2020 | Issued |
Array
(
[id] => 16348110
[patent_doc_number] => 20200312761
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-10-01
[patent_title] => CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 16/806160
[patent_app_country] => US
[patent_app_date] => 2020-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9879
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806160
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/806160 | Circuit board and method for manufacturing the same | Mar 1, 2020 | Issued |
Array
(
[id] => 17239771
[patent_doc_number] => 11183666
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-11-23
[patent_title] => Optoelectronic semiconductor component
[patent_app_type] => utility
[patent_app_number] => 16/806272
[patent_app_country] => US
[patent_app_date] => 2020-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 4049
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 263
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806272
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/806272 | Optoelectronic semiconductor component | Mar 1, 2020 | Issued |
Array
(
[id] => 18047961
[patent_doc_number] => 11521919
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-12-06
[patent_title] => Flex-foil package with coplanar topology for high-frequency signals
[patent_app_type] => utility
[patent_app_number] => 16/803072
[patent_app_country] => US
[patent_app_date] => 2020-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 14
[patent_no_of_words] => 12805
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 420
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16803072
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/803072 | Flex-foil package with coplanar topology for high-frequency signals | Feb 26, 2020 | Issued |
Array
(
[id] => 16896306
[patent_doc_number] => 11037868
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-06-15
[patent_title] => Semiconductor device package and method of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 16/801061
[patent_app_country] => US
[patent_app_date] => 2020-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 30
[patent_no_of_words] => 5690
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16801061
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/801061 | Semiconductor device package and method of manufacturing the same | Feb 24, 2020 | Issued |
Array
(
[id] => 16080799
[patent_doc_number] => 20200194386
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-06-18
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 16/800537
[patent_app_country] => US
[patent_app_date] => 2020-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7275
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16800537
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/800537 | Semiconductor device | Feb 24, 2020 | Issued |