Search

Peniel M. Gumedzoe

Examiner (ID: 15826)

Most Active Art Unit
2899
Art Unit(s)
2891, 2899
Total Applications
1565
Issued Applications
1275
Pending Applications
89
Abandoned Applications
248

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18757534 [patent_doc_number] => 20230360997 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/223221 [patent_app_country] => US [patent_app_date] => 2023-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3833 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -30 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18223221 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/223221
Electronic package and method for manufacturing the same Jul 17, 2023 Issued
Array ( [id] => 18774456 [patent_doc_number] => 20230369287 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/354632 [patent_app_country] => US [patent_app_date] => 2023-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9176 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354632 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/354632
Multi-chip packages and methods of forming the same Jul 17, 2023 Issued
Array ( [id] => 18774456 [patent_doc_number] => 20230369287 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/354632 [patent_app_country] => US [patent_app_date] => 2023-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9176 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354632 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/354632
Multi-chip packages and methods of forming the same Jul 17, 2023 Issued
Array ( [id] => 19524066 [patent_doc_number] => 12125806 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => Electronic device packages with internal moisture barriers [patent_app_type] => utility [patent_app_number] => 18/219422 [patent_app_country] => US [patent_app_date] => 2023-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 26 [patent_no_of_words] => 13678 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18219422 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/219422
Electronic device packages with internal moisture barriers Jul 6, 2023 Issued
Array ( [id] => 19539385 [patent_doc_number] => 12131942 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-29 [patent_title] => Source/drain isolation structure and methods thereof [patent_app_type] => utility [patent_app_number] => 18/344965 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 26 [patent_no_of_words] => 7709 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18344965 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/344965
Source/drain isolation structure and methods thereof Jun 29, 2023 Issued
Array ( [id] => 18975330 [patent_doc_number] => 20240055422 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 18/344314 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12894 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18344314 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/344314
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE Jun 28, 2023 Pending
Array ( [id] => 18975330 [patent_doc_number] => 20240055422 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 18/344314 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12894 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18344314 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/344314
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE Jun 28, 2023 Pending
Array ( [id] => 18804361 [patent_doc_number] => 11837525 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2023-12-05 [patent_title] => Module having a moulded plastic body and a multiplicity of load terminal elements and power semiconductor device therewith [patent_app_type] => utility [patent_app_number] => 18/215744 [patent_app_country] => US [patent_app_date] => 2023-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3583 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 234 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18215744 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/215744
Module having a moulded plastic body and a multiplicity of load terminal elements and power semiconductor device therewith Jun 27, 2023 Issued
Array ( [id] => 18943475 [patent_doc_number] => 20240038614 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/342149 [patent_app_country] => US [patent_app_date] => 2023-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4105 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18342149 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/342149
SEMICONDUCTOR PACKAGE STRUCTURE Jun 26, 2023 Pending
Array ( [id] => 20080903 [patent_doc_number] => 12354981 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-08 [patent_title] => Semiconductor device and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/342449 [patent_app_country] => US [patent_app_date] => 2023-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 33 [patent_no_of_words] => 2224 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 331 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18342449 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/342449
Semiconductor device and method for manufacturing the same Jun 26, 2023 Issued
Array ( [id] => 18943475 [patent_doc_number] => 20240038614 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/342149 [patent_app_country] => US [patent_app_date] => 2023-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4105 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18342149 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/342149
SEMICONDUCTOR PACKAGE STRUCTURE Jun 26, 2023 Pending
Array ( [id] => 19428229 [patent_doc_number] => 12087663 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-10 [patent_title] => Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels [patent_app_type] => utility [patent_app_number] => 18/214141 [patent_app_country] => US [patent_app_date] => 2023-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 7703 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18214141 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/214141
Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels Jun 25, 2023 Issued
Array ( [id] => 18848831 [patent_doc_number] => 20230411235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKAGING METHOD [patent_app_type] => utility [patent_app_number] => 18/209470 [patent_app_country] => US [patent_app_date] => 2023-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7371 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18209470 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/209470
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKAGING METHOD Jun 12, 2023 Pending
Array ( [id] => 18848831 [patent_doc_number] => 20230411235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKAGING METHOD [patent_app_type] => utility [patent_app_number] => 18/209470 [patent_app_country] => US [patent_app_date] => 2023-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7371 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18209470 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/209470
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKAGING METHOD Jun 12, 2023 Pending
Array ( [id] => 19634580 [patent_doc_number] => 20240413029 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-12 [patent_title] => EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUIT SUBSTRATE [patent_app_type] => utility [patent_app_number] => 18/333184 [patent_app_country] => US [patent_app_date] => 2023-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5741 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18333184 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/333184
EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUIT SUBSTRATE Jun 11, 2023 Pending
Array ( [id] => 18679894 [patent_doc_number] => 20230317552 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-05 [patent_title] => High Efficiency Heat Dissipation Using Thermal Interface Material Film [patent_app_type] => utility [patent_app_number] => 18/328387 [patent_app_country] => US [patent_app_date] => 2023-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7755 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18328387 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/328387
High efficiency heat dissipation using thermal interface material film Jun 1, 2023 Issued
Array ( [id] => 19073339 [patent_doc_number] => 20240107765 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => SEMICONDUCTOR STORAGE DEVICE [patent_app_type] => utility [patent_app_number] => 18/327446 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6096 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327446 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/327446
SEMICONDUCTOR STORAGE DEVICE May 31, 2023 Pending
Array ( [id] => 19621449 [patent_doc_number] => 20240407129 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => Boiler Enhancement Coatings with Active Boiling Management [patent_app_type] => utility [patent_app_number] => 18/327615 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6151 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -25 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327615 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/327615
Boiler enhancement coatings with active boiling management May 31, 2023 Issued
Array ( [id] => 19619276 [patent_doc_number] => 20240404956 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive Devices [patent_app_type] => utility [patent_app_number] => 18/325805 [patent_app_country] => US [patent_app_date] => 2023-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5122 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18325805 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/325805
Semiconductor device and method of making an interconnect bridge with integrated passive devices May 29, 2023 Issued
Array ( [id] => 19619276 [patent_doc_number] => 20240404956 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive Devices [patent_app_type] => utility [patent_app_number] => 18/325805 [patent_app_country] => US [patent_app_date] => 2023-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5122 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18325805 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/325805
Semiconductor device and method of making an interconnect bridge with integrated passive devices May 29, 2023 Issued
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