Search

Peniel M. Gumedzoe

Examiner (ID: 15126, Phone: (571)270-3041 , Office: P/2899 )

Most Active Art Unit
2899
Art Unit(s)
2891, 2899
Total Applications
1599
Issued Applications
1308
Pending Applications
79
Abandoned Applications
248

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 13581847 [patent_doc_number] => 20180342472 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-11-29 [patent_title] => MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES HAVING COMPOUND SEMICONDUCTOR DEVICES INTEGRATED ON A PACKAGE FABRIC [patent_app_type] => utility [patent_app_number] => 15/771982 [patent_app_country] => US [patent_app_date] => 2015-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4779 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15771982 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/771982
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric Dec 21, 2015 Issued
Array ( [id] => 11710581 [patent_doc_number] => 20170179080 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-06-22 [patent_title] => 'SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS' [patent_app_type] => utility [patent_app_number] => 14/975128 [patent_app_country] => US [patent_app_date] => 2015-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5884 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14975128 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/975128
SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS Dec 17, 2015 Abandoned
Array ( [id] => 10981607 [patent_doc_number] => 20160178552 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-06-23 [patent_title] => 'HUMIDITY SENSOR' [patent_app_type] => utility [patent_app_number] => 14/973995 [patent_app_country] => US [patent_app_date] => 2015-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2986 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14973995 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/973995
Method for manufacturing humidity sensor Dec 17, 2015 Issued
Array ( [id] => 13558913 [patent_doc_number] => 20180331004 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-11-15 [patent_title] => PRE-MOLDED ACTIVE IC OF PASSIVE COMPONENTS TO MINIATURIZE SYSTEM IN PACKAGE [patent_app_type] => utility [patent_app_number] => 15/772483 [patent_app_country] => US [patent_app_date] => 2015-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3355 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15772483 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/772483
Pre-molded active IC of passive components to miniaturize system in package Dec 15, 2015 Issued
Array ( [id] => 13470457 [patent_doc_number] => 20180286771 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-10-04 [patent_title] => SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 15/766112 [patent_app_country] => US [patent_app_date] => 2015-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3507 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15766112 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/766112
Semiconductor module Dec 3, 2015 Issued
Array ( [id] => 12115182 [patent_doc_number] => 09871178 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-01-16 [patent_title] => 'Light-emitting diode device' [patent_app_type] => utility [patent_app_number] => 14/954465 [patent_app_country] => US [patent_app_date] => 2015-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3539 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14954465 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/954465
Light-emitting diode device Nov 29, 2015 Issued
Array ( [id] => 11660121 [patent_doc_number] => 09673133 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-06-06 [patent_title] => 'Semiconductor devices having through-electrodes' [patent_app_type] => utility [patent_app_number] => 14/939394 [patent_app_country] => US [patent_app_date] => 2015-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 4663 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14939394 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/939394
Semiconductor devices having through-electrodes Nov 11, 2015 Issued
Array ( [id] => 10802715 [patent_doc_number] => 20160148871 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-05-26 [patent_title] => 'ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/939384 [patent_app_country] => US [patent_app_date] => 2015-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 6613 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14939384 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/939384
Electronic component and method for producing the same Nov 11, 2015 Issued
Array ( [id] => 11578672 [patent_doc_number] => 09633942 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-04-25 [patent_title] => 'Conductively doped polymer pattern placement error compensation layer' [patent_app_type] => utility [patent_app_number] => 14/939365 [patent_app_country] => US [patent_app_date] => 2015-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 21 [patent_no_of_words] => 4002 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14939365 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/939365
Conductively doped polymer pattern placement error compensation layer Nov 11, 2015 Issued
Array ( [id] => 11681338 [patent_doc_number] => 09679874 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-06-13 [patent_title] => 'Semiconductor package and semiconductor device including the same' [patent_app_type] => utility [patent_app_number] => 14/938788 [patent_app_country] => US [patent_app_date] => 2015-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 12 [patent_no_of_words] => 5538 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14938788 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/938788
Semiconductor package and semiconductor device including the same Nov 10, 2015 Issued
Array ( [id] => 13695501 [patent_doc_number] => 20170358705 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-12-14 [patent_title] => LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING SAME [patent_app_type] => utility [patent_app_number] => 15/538435 [patent_app_country] => US [patent_app_date] => 2015-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12007 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15538435 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/538435
Light emitting device and light emitting device package having same Nov 10, 2015 Issued
Array ( [id] => 11637923 [patent_doc_number] => 09659908 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-05-23 [patent_title] => 'Systems and methods for package on package through mold interconnects' [patent_app_type] => utility [patent_app_number] => 14/937022 [patent_app_country] => US [patent_app_date] => 2015-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 6738 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14937022 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/937022
Systems and methods for package on package through mold interconnects Nov 9, 2015 Issued
Array ( [id] => 10718076 [patent_doc_number] => 20160064223 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-03-03 [patent_title] => 'METHOD OF FORMING METAL GATE ELECTRODE' [patent_app_type] => utility [patent_app_number] => 14/936939 [patent_app_country] => US [patent_app_date] => 2015-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4786 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14936939 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/936939
Method of forming metal gate electrode Nov 9, 2015 Issued
Array ( [id] => 11321613 [patent_doc_number] => 09520361 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-12-13 [patent_title] => 'Semiconductor devices' [patent_app_type] => utility [patent_app_number] => 14/937406 [patent_app_country] => US [patent_app_date] => 2015-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 33 [patent_no_of_words] => 13544 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14937406 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/937406
Semiconductor devices Nov 9, 2015 Issued
Array ( [id] => 11623158 [patent_doc_number] => 20170133345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-05-11 [patent_title] => 'BONDING SUBSTRATES USING SOLDER SURFACE TENSION DURING SOLDER REFLOW FOR THREE DIMENSIONAL SELF-ALIGNMENT OF SUBSTRATES' [patent_app_type] => utility [patent_app_number] => 14/936849 [patent_app_country] => US [patent_app_date] => 2015-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 6695 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14936849 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/936849
Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates Nov 9, 2015 Issued
Array ( [id] => 10787436 [patent_doc_number] => 20160133592 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-05-12 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME' [patent_app_type] => utility [patent_app_number] => 14/936837 [patent_app_country] => US [patent_app_date] => 2015-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 9432 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14936837 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/936837
Semiconductor device and manufacturing method for the same Nov 9, 2015 Issued
Array ( [id] => 11753421 [patent_doc_number] => 09711440 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-07-18 [patent_title] => 'Wiring board and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 14/935749 [patent_app_country] => US [patent_app_date] => 2015-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 10261 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14935749 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/935749
Wiring board and method for manufacturing the same Nov 8, 2015 Issued
Array ( [id] => 11623147 [patent_doc_number] => 20170133334 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-05-11 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 14/935912 [patent_app_country] => US [patent_app_date] => 2015-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6501 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14935912 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/935912
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Nov 8, 2015 Abandoned
Array ( [id] => 12935644 [patent_doc_number] => 09831104 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-11-28 [patent_title] => Techniques for molded underfill for integrated circuit dies [patent_app_type] => utility [patent_app_number] => 14/935011 [patent_app_country] => US [patent_app_date] => 2015-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 4036 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14935011 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/935011
Techniques for molded underfill for integrated circuit dies Nov 5, 2015 Issued
Array ( [id] => 11459990 [patent_doc_number] => 20170053896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-02-23 [patent_title] => 'PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/935160 [patent_app_country] => US [patent_app_date] => 2015-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 53 [patent_figures_cnt] => 53 [patent_no_of_words] => 8749 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14935160 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/935160
Package structures and method of forming the same Nov 5, 2015 Issued
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