
Peniel M. Gumedzoe
Examiner (ID: 15126, Phone: (571)270-3041 , Office: P/2899 )
| Most Active Art Unit | 2899 |
| Art Unit(s) | 2891, 2899 |
| Total Applications | 1599 |
| Issued Applications | 1308 |
| Pending Applications | 79 |
| Abandoned Applications | 248 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9905929
[patent_doc_number] => 20150061129
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-03-05
[patent_title] => 'Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board'
[patent_app_type] => utility
[patent_app_number] => 14/475249
[patent_app_country] => US
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Array
(
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[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE'
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[patent_app_number] => 14/475270
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Array
(
[id] => 11765120
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[patent_issue_date] => 2016-06-21
[patent_title] => 'Lead frame, manufacture method and package structure thereof'
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Array
(
[id] => 11792645
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[patent_issue_date] => 2016-07-26
[patent_title] => 'Semiconductor package having magnetic connection member'
[patent_app_type] => utility
[patent_app_number] => 14/457493
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/457493 | Semiconductor package having magnetic connection member | Aug 11, 2014 | Issued |
Array
(
[id] => 11967244
[patent_doc_number] => 20170271397
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[patent_kind] => A1
[patent_issue_date] => 2017-09-21
[patent_title] => 'Anti-Reflective Treatment Of The Rear Side Of A Semiconductor Wafer'
[patent_app_type] => utility
[patent_app_number] => 15/502212
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/502212 | Anti-Reflective Treatment Of The Rear Side Of A Semiconductor Wafer | Aug 7, 2014 | Abandoned |
Array
(
[id] => 10277269
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[patent_issue_date] => 2015-06-11
[patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME'
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Array
(
[id] => 10929960
[patent_doc_number] => 20140332981
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[patent_issue_date] => 2014-11-13
[patent_title] => 'LOW-STRESS VIAS'
[patent_app_type] => utility
[patent_app_number] => 14/450109
[patent_app_country] => US
[patent_app_date] => 2014-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/450109 | Low-stress vias | Jul 31, 2014 | Issued |
Array
(
[id] => 10691485
[patent_doc_number] => 20160037631
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-04
[patent_title] => 'DISPLAY APPARATUS WITH NARROW BEZEL'
[patent_app_type] => utility
[patent_app_number] => 14/445438
[patent_app_country] => US
[patent_app_date] => 2014-07-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/445438 | DISPLAY APPARATUS WITH NARROW BEZEL | Jul 28, 2014 | Abandoned |
Array
(
[id] => 10826380
[patent_doc_number] => 20160172547
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-06-16
[patent_title] => 'Surface-Mountable Optoelectronic Semiconductor Component and Method for Producing Same'
[patent_app_type] => utility
[patent_app_number] => 14/907043
[patent_app_country] => US
[patent_app_date] => 2014-07-16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/907043 | Surface-mountable optoelectronic semiconductor component with conductive connection on housing body | Jul 15, 2014 | Issued |
Array
(
[id] => 10916669
[patent_doc_number] => 20140319688
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-10-30
[patent_title] => 'Protection Layers for Conductive Pads and Methods of Formation Thereof'
[patent_app_type] => utility
[patent_app_number] => 14/326252
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/326252 | Protection Layers for Conductive Pads and Methods of Formation Thereof | Jul 7, 2014 | Abandoned |
Array
(
[id] => 10903344
[patent_doc_number] => 20140306357
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[patent_kind] => A1
[patent_issue_date] => 2014-10-16
[patent_title] => 'DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING DIE-BONDING FILM'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/315495 | Dicing die-bonding film and method of forming a cut on the dicing die-bonding film | Jun 25, 2014 | Issued |
Array
(
[id] => 12012874
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/286483 | Stack-type semiconductor package | May 22, 2014 | Issued |
Array
(
[id] => 9839090
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Array
(
[id] => 10165345
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/277801 | Semiconductor package with stress relief and heat spreader | May 14, 2014 | Issued |
Array
(
[id] => 10214325
[patent_doc_number] => 20150099317
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[patent_title] => 'SURFACE EMITTING SEMICONDUCTOR LASER, SURFACE EMITTING SEMICONDUCTOR LASER ARRAY, SURFACE EMITTING SEMICONDUCTOR LASER DEVICE, OPTICAL TRANSMISSION DEVICE, INFORMATION PROCESSING APPARATUS, AND METHOD OF PRODUCING SURFACE EMITTING SEMICONDUCTOR LASER'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/275227 | Surface emitting semiconductor laser, surface emitting semiconductor laser array, surface emitting semiconductor laser device, optical transmission device, information processing apparatus, and method of producing surface emitting semiconductor laser | May 11, 2014 | Issued |
Array
(
[id] => 9682693
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[patent_title] => 'SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP'
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Array
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Array
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