Search

Peniel M. Gumedzoe

Examiner (ID: 15126, Phone: (571)270-3041 , Office: P/2899 )

Most Active Art Unit
2899
Art Unit(s)
2891, 2899
Total Applications
1599
Issued Applications
1308
Pending Applications
79
Abandoned Applications
248

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10455632 [patent_doc_number] => 20150340647 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-11-26 [patent_title] => 'PACKAGING METHOD AND DISPLAY DEVICE' [patent_app_type] => utility [patent_app_number] => 14/432456 [patent_app_country] => US [patent_app_date] => 2014-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5498 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14432456 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/432456
Packaging method and display device Apr 2, 2014 Issued
Array ( [id] => 11315370 [patent_doc_number] => 20160351480 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-12-01 [patent_title] => 'SEMICONDUCTOR MODULE AND DRIVE DEVICE EQUIPPED WITH SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 15/117238 [patent_app_country] => US [patent_app_date] => 2014-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4208 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15117238 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/117238
Semiconductor module and drive device equipped with semiconductor module Mar 27, 2014 Issued
Array ( [id] => 9888866 [patent_doc_number] => 08975120 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-03-10 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/204988 [patent_app_country] => US [patent_app_date] => 2014-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 34 [patent_no_of_words] => 18150 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 311 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14204988 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/204988
Method of manufacturing semiconductor device Mar 10, 2014 Issued
Array ( [id] => 9566044 [patent_doc_number] => 20140183757 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-03 [patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT' [patent_app_type] => utility [patent_app_number] => 14/202067 [patent_app_country] => US [patent_app_date] => 2014-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3263 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14202067 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/202067
Semiconductor device including passivation layer encapsulant Mar 9, 2014 Issued
Array ( [id] => 9518348 [patent_doc_number] => 20140154840 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-05 [patent_title] => 'CHIP PACKAGE AND METHOD FOR FORMING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/173340 [patent_app_country] => US [patent_app_date] => 2014-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3612 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14173340 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/173340
Chip package and method for forming the same Feb 4, 2014 Issued
Array ( [id] => 11770314 [patent_doc_number] => 09379006 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-28 [patent_title] => 'Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus' [patent_app_type] => utility [patent_app_number] => 14/162140 [patent_app_country] => US [patent_app_date] => 2014-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 56 [patent_no_of_words] => 15359 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14162140 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/162140
Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus Jan 22, 2014 Issued
Array ( [id] => 10172030 [patent_doc_number] => 09202742 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-12-01 [patent_title] => 'Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 14/156271 [patent_app_country] => US [patent_app_date] => 2014-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 4423 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14156271 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/156271
Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof Jan 14, 2014 Issued
Array ( [id] => 9460464 [patent_doc_number] => 20140124890 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-08 [patent_title] => 'Semiconductor Package Having Multi-Phase Power Inverter with Internal Temperature Sensor' [patent_app_type] => utility [patent_app_number] => 14/152640 [patent_app_country] => US [patent_app_date] => 2014-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 11853 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14152640 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/152640
Semiconductor package having multi-phase power inverter with internal temperature sensor Jan 9, 2014 Issued
Array ( [id] => 10597360 [patent_doc_number] => 09318455 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Method of forming a plurality of bumps on a substrate and method of forming a chip package' [patent_app_type] => utility [patent_app_number] => 14/151855 [patent_app_country] => US [patent_app_date] => 2014-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 15 [patent_no_of_words] => 4654 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14151855 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/151855
Method of forming a plurality of bumps on a substrate and method of forming a chip package Jan 9, 2014 Issued
Array ( [id] => 9632001 [patent_doc_number] => 20140210109 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-31 [patent_title] => 'BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 14/150952 [patent_app_country] => US [patent_app_date] => 2014-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 11133 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14150952 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/150952
Built-in electronic component substrate and method for manufacturing the substrate Jan 8, 2014 Issued
Array ( [id] => 11221614 [patent_doc_number] => 09449957 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-09-20 [patent_title] => 'Control and driver circuits on a power quad flat no-lead (PQFN) leadframe' [patent_app_type] => utility [patent_app_number] => 14/150469 [patent_app_country] => US [patent_app_date] => 2014-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 10803 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14150469 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/150469
Control and driver circuits on a power quad flat no-lead (PQFN) leadframe Jan 7, 2014 Issued
Array ( [id] => 13057123 [patent_doc_number] => 10049960 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 15/034433 [patent_app_country] => US [patent_app_date] => 2014-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 22 [patent_no_of_words] => 10282 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15034433 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/034433
Semiconductor device Jan 5, 2014 Issued
Array ( [id] => 10138505 [patent_doc_number] => 09171827 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-10-27 [patent_title] => 'Stack type semiconductor package' [patent_app_type] => utility [patent_app_number] => 14/148717 [patent_app_country] => US [patent_app_date] => 2014-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 27 [patent_no_of_words] => 11254 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14148717 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/148717
Stack type semiconductor package Jan 5, 2014 Issued
Array ( [id] => 10631540 [patent_doc_number] => 09349696 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-05-24 [patent_title] => 'Integrated antennas in wafer level package' [patent_app_type] => utility [patent_app_number] => 14/148585 [patent_app_country] => US [patent_app_date] => 2014-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4524 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14148585 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/148585
Integrated antennas in wafer level package Jan 5, 2014 Issued
Array ( [id] => 11333676 [patent_doc_number] => 09524928 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-12-20 [patent_title] => 'Power quad flat no-lead (PQFN) package having control and driver circuits' [patent_app_type] => utility [patent_app_number] => 14/147464 [patent_app_country] => US [patent_app_date] => 2014-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 10801 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14147464 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/147464
Power quad flat no-lead (PQFN) package having control and driver circuits Jan 2, 2014 Issued
Array ( [id] => 10916655 [patent_doc_number] => 20140319674 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-10-30 [patent_title] => 'SEMICONDUCTOR COOLING DEVICE' [patent_app_type] => utility [patent_app_number] => 14/145310 [patent_app_country] => US [patent_app_date] => 2013-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4103 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14145310 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/145310
Semiconductor cooling device Dec 30, 2013 Issued
Array ( [id] => 10158541 [patent_doc_number] => 09190325 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-11-17 [patent_title] => 'TSV formation' [patent_app_type] => utility [patent_app_number] => 14/144775 [patent_app_country] => US [patent_app_date] => 2013-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 22 [patent_no_of_words] => 4710 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14144775 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/144775
TSV formation Dec 30, 2013 Issued
Array ( [id] => 9565860 [patent_doc_number] => 20140183573 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-03 [patent_title] => 'LIGHT EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 14/140765 [patent_app_country] => US [patent_app_date] => 2013-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 10043 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14140765 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/140765
Light emitting device Dec 25, 2013 Issued
Array ( [id] => 9418864 [patent_doc_number] => 20140103514 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-17 [patent_title] => 'Power Quad Flat No-Lead (PQFN) Package Having Bootstrap Diodes on a Common Integrated Circuit (IC)' [patent_app_type] => utility [patent_app_number] => 14/140285 [patent_app_country] => US [patent_app_date] => 2013-12-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 8323 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14140285 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/140285
Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC) Dec 23, 2013 Issued
Array ( [id] => 10294482 [patent_doc_number] => 20150179481 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-06-25 [patent_title] => 'Semiconductor Device and Method of Making Embedded Wafer Level Chip Scale Packages' [patent_app_type] => utility [patent_app_number] => 14/139312 [patent_app_country] => US [patent_app_date] => 2013-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 37 [patent_figures_cnt] => 37 [patent_no_of_words] => 14807 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14139312 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/139312
Semiconductor device and method of making embedded wafer level chip scale packages Dec 22, 2013 Issued
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