
Peniel M. Gumedzoe
Examiner (ID: 10153, Phone: (571)270-3041 , Office: P/2899 )
| Most Active Art Unit | 2899 |
| Art Unit(s) | 2899, 2891 |
| Total Applications | 1612 |
| Issued Applications | 1320 |
| Pending Applications | 80 |
| Abandoned Applications | 248 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10691485
[patent_doc_number] => 20160037631
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-04
[patent_title] => 'DISPLAY APPARATUS WITH NARROW BEZEL'
[patent_app_type] => utility
[patent_app_number] => 14/445438
[patent_app_country] => US
[patent_app_date] => 2014-07-29
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Array
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[patent_title] => 'Surface-Mountable Optoelectronic Semiconductor Component and Method for Producing Same'
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Array
(
[id] => 10916669
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[patent_kind] => A1
[patent_issue_date] => 2014-10-30
[patent_title] => 'Protection Layers for Conductive Pads and Methods of Formation Thereof'
[patent_app_type] => utility
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Array
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[patent_doc_number] => 20140306357
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[patent_kind] => A1
[patent_issue_date] => 2014-10-16
[patent_title] => 'DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING DIE-BONDING FILM'
[patent_app_type] => utility
[patent_app_number] => 14/315495
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[patent_app_date] => 2014-06-26
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/315495 | Dicing die-bonding film and method of forming a cut on the dicing die-bonding film | Jun 25, 2014 | Issued |
Array
(
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/279891 | METHOD FOR INTERCONNECTION OF COMPONENTS ON A SUBSTRATE | May 15, 2014 | Abandoned |
Array
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[id] => 10165345
[patent_doc_number] => 09196576
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[patent_issue_date] => 2015-11-24
[patent_title] => 'Semiconductor package with stress relief and heat spreader'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/277801 | Semiconductor package with stress relief and heat spreader | May 14, 2014 | Issued |
Array
(
[id] => 10214325
[patent_doc_number] => 20150099317
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-04-09
[patent_title] => 'SURFACE EMITTING SEMICONDUCTOR LASER, SURFACE EMITTING SEMICONDUCTOR LASER ARRAY, SURFACE EMITTING SEMICONDUCTOR LASER DEVICE, OPTICAL TRANSMISSION DEVICE, INFORMATION PROCESSING APPARATUS, AND METHOD OF PRODUCING SURFACE EMITTING SEMICONDUCTOR LASER'
[patent_app_type] => utility
[patent_app_number] => 14/275227
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/275227 | Surface emitting semiconductor laser, surface emitting semiconductor laser array, surface emitting semiconductor laser device, optical transmission device, information processing apparatus, and method of producing surface emitting semiconductor laser | May 11, 2014 | Issued |
Array
(
[id] => 9682693
[patent_doc_number] => 20140239456
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[patent_kind] => A1
[patent_issue_date] => 2014-08-28
[patent_title] => 'SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP'
[patent_app_type] => utility
[patent_app_number] => 14/269840
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Array
(
[id] => 9928478
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[patent_title] => 'CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF'
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Array
(
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Array
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Array
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Array
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