Search

Peniel M. Gumedzoe

Examiner (ID: 15826)

Most Active Art Unit
2899
Art Unit(s)
2891, 2899
Total Applications
1565
Issued Applications
1275
Pending Applications
89
Abandoned Applications
248

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19199116 [patent_doc_number] => 11996365 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-28 [patent_title] => Semiconductor package and a method of fabricating the same [patent_app_type] => utility [patent_app_number] => 18/114358 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 17 [patent_no_of_words] => 8632 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18114358 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/114358
Semiconductor package and a method of fabricating the same Feb 26, 2023 Issued
Array ( [id] => 19407175 [patent_doc_number] => 20240290686 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 18/113585 [patent_app_country] => US [patent_app_date] => 2023-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8028 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18113585 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/113585
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE Feb 22, 2023 Pending
Array ( [id] => 18585982 [patent_doc_number] => 20230268247 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS [patent_app_type] => utility [patent_app_number] => 18/171734 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9084 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18171734 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/171734
HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS Feb 20, 2023 Pending
Array ( [id] => 18913096 [patent_doc_number] => 11876084 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-16 [patent_title] => Power supply system [patent_app_type] => utility [patent_app_number] => 18/171686 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 43 [patent_no_of_words] => 12264 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18171686 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/171686
Power supply system Feb 20, 2023 Issued
Array ( [id] => 18456360 [patent_doc_number] => 20230197642 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS [patent_app_type] => utility [patent_app_number] => 18/172208 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4466 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18172208 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/172208
Ceramic semiconductor package seal rings Feb 20, 2023 Issued
Array ( [id] => 19392852 [patent_doc_number] => 20240282722 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => BALL GRID ARRAY RF PACKAGE CONFIGURATIONS [patent_app_type] => utility [patent_app_number] => 18/112494 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2259 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -1 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18112494 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/112494
BALL GRID ARRAY RF PACKAGE CONFIGURATIONS Feb 20, 2023 Pending
Array ( [id] => 19138086 [patent_doc_number] => 11973062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => High density pillar interconnect conversion with stack to substrate connection [patent_app_type] => utility [patent_app_number] => 18/169735 [patent_app_country] => US [patent_app_date] => 2023-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 33 [patent_no_of_words] => 8955 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169735 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169735
High density pillar interconnect conversion with stack to substrate connection Feb 14, 2023 Issued
Array ( [id] => 19269408 [patent_doc_number] => 20240213112 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF [patent_app_type] => utility [patent_app_number] => 18/169212 [patent_app_country] => US [patent_app_date] => 2023-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3787 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169212 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169212
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF Feb 14, 2023 Pending
Array ( [id] => 19364361 [patent_doc_number] => 20240266395 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-08 [patent_title] => SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/164177 [patent_app_country] => US [patent_app_date] => 2023-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10332 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18164177 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/164177
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Feb 2, 2023 Pending
Array ( [id] => 19335566 [patent_doc_number] => 20240249996 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-25 [patent_title] => PACKAGE ASSEMBLY WITH THERMAL INTERFACE MATERIAL GUTTER [patent_app_type] => utility [patent_app_number] => 18/099949 [patent_app_country] => US [patent_app_date] => 2023-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5843 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18099949 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/099949
PACKAGE ASSEMBLY WITH THERMAL INTERFACE MATERIAL GUTTER Jan 21, 2023 Pending
Array ( [id] => 19063148 [patent_doc_number] => 11942399 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-26 [patent_title] => Semiconductor devices having a serial power system [patent_app_type] => utility [patent_app_number] => 18/098668 [patent_app_country] => US [patent_app_date] => 2023-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6786 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18098668 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/098668
Semiconductor devices having a serial power system Jan 17, 2023 Issued
Array ( [id] => 18857341 [patent_doc_number] => 11854936 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/155067 [patent_app_country] => US [patent_app_date] => 2023-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 39 [patent_no_of_words] => 16142 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18155067 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/155067
Semiconductor device Jan 16, 2023 Issued
Array ( [id] => 18379723 [patent_doc_number] => 20230154812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module [patent_app_type] => utility [patent_app_number] => 18/154993 [patent_app_country] => US [patent_app_date] => 2023-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4216 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18154993 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/154993
Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module Jan 15, 2023 Issued
Array ( [id] => 18766958 [patent_doc_number] => 11817367 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-14 [patent_title] => Power module [patent_app_type] => utility [patent_app_number] => 18/096997 [patent_app_country] => US [patent_app_date] => 2023-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 4397 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18096997 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/096997
Power module Jan 12, 2023 Issued
Array ( [id] => 18900472 [patent_doc_number] => 20240015957 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/152979 [patent_app_country] => US [patent_app_date] => 2023-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9018 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152979 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152979
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Jan 10, 2023 Pending
Array ( [id] => 20416845 [patent_doc_number] => 12500139 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Package with heat dissipation structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/152463 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 26 [patent_no_of_words] => 6890 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152463 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152463
Package with Heat Dissipation Structure and Method for Forming the Same Jan 9, 2023 Issued
Array ( [id] => 20416845 [patent_doc_number] => 12500139 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Package with heat dissipation structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/152463 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 26 [patent_no_of_words] => 6890 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152463 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152463
Package with Heat Dissipation Structure and Method for Forming the Same Jan 9, 2023 Issued
Array ( [id] => 20274941 [patent_doc_number] => 12444727 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Semiconductor package structure and manufacturing method [patent_app_type] => utility [patent_app_number] => 18/152188 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3503 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152188 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152188
Semiconductor package structure and manufacturing method Jan 9, 2023 Issued
Array ( [id] => 20274941 [patent_doc_number] => 12444727 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Semiconductor package structure and manufacturing method [patent_app_type] => utility [patent_app_number] => 18/152188 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3503 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152188 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152188
Semiconductor package structure and manufacturing method Jan 9, 2023 Issued
Array ( [id] => 18905991 [patent_doc_number] => 20240021476 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => Transistor Contacts and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 18/151181 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13424 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151181 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151181
Transistor Contacts and Methods of Forming the Same Jan 5, 2023 Pending
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