Search

Philip L. Cotey

Examiner (ID: 12874, Phone: (571)270-1029 , Office: P/2855 )

Most Active Art Unit
2855
Art Unit(s)
2855, 2856
Total Applications
844
Issued Applications
667
Pending Applications
70
Abandoned Applications
119

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18105565 [patent_doc_number] => 11545463 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-03 [patent_title] => Chip package structure with ring-like structure [patent_app_type] => utility [patent_app_number] => 17/394621 [patent_app_country] => US [patent_app_date] => 2021-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 7967 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17394621 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/394621
Chip package structure with ring-like structure Aug 4, 2021 Issued
Array ( [id] => 18248958 [patent_doc_number] => 11605554 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-14 [patent_title] => Flip-chip process and bonding equipment [patent_app_type] => utility [patent_app_number] => 17/392462 [patent_app_country] => US [patent_app_date] => 2021-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 3215 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17392462 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/392462
Flip-chip process and bonding equipment Aug 2, 2021 Issued
Array ( [id] => 17886583 [patent_doc_number] => 20220302061 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-22 [patent_title] => SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/392369 [patent_app_country] => US [patent_app_date] => 2021-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4507 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17392369 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/392369
Semiconductor package comprising plurality of bumps and fabricating method Aug 2, 2021 Issued
Array ( [id] => 18892792 [patent_doc_number] => 11871585 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-09 [patent_title] => Semiconductor device comprising magnetic tunneling junctions (MTJs) in a magnetoresistive random access memory (MRAM) [patent_app_type] => utility [patent_app_number] => 17/389310 [patent_app_country] => US [patent_app_date] => 2021-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2641 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17389310 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/389310
Semiconductor device comprising magnetic tunneling junctions (MTJs) in a magnetoresistive random access memory (MRAM) Jul 28, 2021 Issued
Array ( [id] => 18156196 [patent_doc_number] => 11569188 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-31 [patent_title] => Semiconductor device including elongated bonding structure between the substrate [patent_app_type] => utility [patent_app_number] => 17/387755 [patent_app_country] => US [patent_app_date] => 2021-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 30 [patent_no_of_words] => 4769 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17387755 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/387755
Semiconductor device including elongated bonding structure between the substrate Jul 27, 2021 Issued
Array ( [id] => 18190665 [patent_doc_number] => 11581267 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-14 [patent_title] => Method for fabricating semiconductor device with protection structure and air gaps [patent_app_type] => utility [patent_app_number] => 17/385546 [patent_app_country] => US [patent_app_date] => 2021-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 7298 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17385546 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/385546
Method for fabricating semiconductor device with protection structure and air gaps Jul 25, 2021 Issued
Array ( [id] => 18148803 [patent_doc_number] => 20230022660 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-26 [patent_title] => COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION [patent_app_type] => utility [patent_app_number] => 17/383918 [patent_app_country] => US [patent_app_date] => 2021-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5218 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17383918 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/383918
Compact routing package for high frequency isolation Jul 22, 2021 Issued
Array ( [id] => 17217852 [patent_doc_number] => 20210351190 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-11 [patent_title] => METHOD FOR FABRICATING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/380603 [patent_app_country] => US [patent_app_date] => 2021-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8691 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17380603 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/380603
Method for fabricating semiconductor device including capacitor structure Jul 19, 2021 Issued
Array ( [id] => 18142126 [patent_doc_number] => 20230015970 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/378356 [patent_app_country] => US [patent_app_date] => 2021-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9055 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17378356 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/378356
Semiconductor structure and method for forming the same Jul 15, 2021 Issued
Array ( [id] => 18721502 [patent_doc_number] => 11798858 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-24 [patent_title] => Semiconductor package structure including reinforcement component and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/377169 [patent_app_country] => US [patent_app_date] => 2021-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 6507 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17377169 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/377169
Semiconductor package structure including reinforcement component and method for manufacturing the same Jul 14, 2021 Issued
Array ( [id] => 18653374 [patent_doc_number] => 20230299214 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => OPTICALLY TRANSPARENT ELECTROMAGNETIC SHIELDING ASSEMBLY [patent_app_type] => utility [patent_app_number] => 18/006007 [patent_app_country] => US [patent_app_date] => 2021-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7718 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 244 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18006007 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/006007
OPTICALLY TRANSPARENT ELECTROMAGNETIC SHIELDING ASSEMBLY Jul 7, 2021 Issued
Array ( [id] => 17188852 [patent_doc_number] => 20210335737 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-28 [patent_title] => MULTI-METAL CONTACT STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/370576 [patent_app_country] => US [patent_app_date] => 2021-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7644 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17370576 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/370576
Multi-metal contact structure Jul 7, 2021 Issued
Array ( [id] => 18562981 [patent_doc_number] => 11728234 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-15 [patent_title] => Electronic package comprising wire inside an electronic component and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/368475 [patent_app_country] => US [patent_app_date] => 2021-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 5742 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17368475 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/368475
Electronic package comprising wire inside an electronic component and manufacturing method thereof Jul 5, 2021 Issued
Array ( [id] => 17174167 [patent_doc_number] => 20210327838 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-21 [patent_title] => BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTRIC AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/357120 [patent_app_country] => US [patent_app_date] => 2021-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20030 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17357120 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/357120
Bonded assembly containing low dielectric constant bonding dielectric material Jun 23, 2021 Issued
Array ( [id] => 17318878 [patent_doc_number] => 20210407928 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-30 [patent_title] => QUANTUM DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/357233 [patent_app_country] => US [patent_app_date] => 2021-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7551 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17357233 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/357233
Quantum device including shield part and method of manufacturing the same Jun 23, 2021 Issued
Array ( [id] => 18975296 [patent_doc_number] => 20240055388 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM [patent_app_type] => utility [patent_app_number] => 18/037760 [patent_app_country] => US [patent_app_date] => 2021-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7731 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 249 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18037760 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/037760
Bump-forming device, bump-forming method, and non-transitory computer-readable medium Jun 21, 2021 Issued
Array ( [id] => 18205479 [patent_doc_number] => 11587884 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-21 [patent_title] => Patterned ground shield device including multiple pattered ground shield layers [patent_app_type] => utility [patent_app_number] => 17/351387 [patent_app_country] => US [patent_app_date] => 2021-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2863 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17351387 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/351387
Patterned ground shield device including multiple pattered ground shield layers Jun 17, 2021 Issued
Array ( [id] => 17660958 [patent_doc_number] => 20220181423 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/351683 [patent_app_country] => US [patent_app_date] => 2021-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6833 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17351683 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/351683
Display device with alternating power and data lines Jun 17, 2021 Issued
Array ( [id] => 18068195 [patent_doc_number] => 20220399283 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-15 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/346068 [patent_app_country] => US [patent_app_date] => 2021-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6210 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17346068 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/346068
Manufacturing process steps of a semiconductor device package Jun 10, 2021 Issued
Array ( [id] => 18061760 [patent_doc_number] => 20220392847 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-08 [patent_title] => SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING OF SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/340089 [patent_app_country] => US [patent_app_date] => 2021-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7779 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17340089 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/340089
Semiconductor package, semiconductor device and shielding housing of semiconductor package Jun 6, 2021 Issued
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