Search

Pia Florence Tibbits

Examiner (ID: 11212)

Most Active Art Unit
2838
Art Unit(s)
3992, 2838, 2859
Total Applications
918
Issued Applications
776
Pending Applications
47
Abandoned Applications
95

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4805995 [patent_doc_number] => 20080169573 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-17 [patent_title] => 'CIRCUIT SUBSTRATE AND THE SEMICONDUCTOR PACKAGE HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/014212 [patent_app_country] => US [patent_app_date] => 2008-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2565 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0169/20080169573.pdf [firstpage_image] =>[orig_patent_app_number] => 12014212 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/014212
Circuit substrate and the semiconductor package having the same Jan 14, 2008 Issued
Array ( [id] => 34712 [patent_doc_number] => 07786569 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-31 [patent_title] => 'Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection' [patent_app_type] => utility [patent_app_number] => 12/013422 [patent_app_country] => US [patent_app_date] => 2008-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 26 [patent_no_of_words] => 3842 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/786/07786569.pdf [firstpage_image] =>[orig_patent_app_number] => 12013422 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/013422
Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection Jan 11, 2008 Issued
Array ( [id] => 103165 [patent_doc_number] => 07728444 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-06-01 [patent_title] => 'Wiring board' [patent_app_type] => utility [patent_app_number] => 12/007352 [patent_app_country] => US [patent_app_date] => 2008-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 7320 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/728/07728444.pdf [firstpage_image] =>[orig_patent_app_number] => 12007352 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/007352
Wiring board Jan 8, 2008 Issued
Array ( [id] => 4925226 [patent_doc_number] => 20080164589 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-10 [patent_title] => 'POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) AND METHOD OF FABRICATING THE PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/970911 [patent_app_country] => US [patent_app_date] => 2008-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4263 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0164/20080164589.pdf [firstpage_image] =>[orig_patent_app_number] => 11970911 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/970911
Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package Jan 7, 2008 Issued
Array ( [id] => 4843330 [patent_doc_number] => 20080179738 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-31 [patent_title] => 'WIRING BOARD AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/969402 [patent_app_country] => US [patent_app_date] => 2008-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 11855 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0179/20080179738.pdf [firstpage_image] =>[orig_patent_app_number] => 11969402 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/969402
Wiring board and semiconductor device Jan 3, 2008 Issued
Array ( [id] => 4433482 [patent_doc_number] => 07968987 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-06-28 [patent_title] => 'Carbon dioxide gettering for a chip module assembly' [patent_app_type] => utility [patent_app_number] => 11/968831 [patent_app_country] => US [patent_app_date] => 2008-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5239 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/968/07968987.pdf [firstpage_image] =>[orig_patent_app_number] => 11968831 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/968831
Carbon dioxide gettering for a chip module assembly Jan 2, 2008 Issued
Array ( [id] => 23358 [patent_doc_number] => 07800219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-21 [patent_title] => 'High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/968602 [patent_app_country] => US [patent_app_date] => 2008-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 16 [patent_no_of_words] => 6585 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 216 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/800/07800219.pdf [firstpage_image] =>[orig_patent_app_number] => 11968602 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/968602
High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Jan 1, 2008 Issued
Array ( [id] => 7730962 [patent_doc_number] => 08102062 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2012-01-24 [patent_title] => 'Optionally bonding either two sides or more sides of integrated circuits' [patent_app_type] => utility [patent_app_number] => 11/966012 [patent_app_country] => US [patent_app_date] => 2007-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 7812 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/102/08102062.pdf [firstpage_image] =>[orig_patent_app_number] => 11966012 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/966012
Optionally bonding either two sides or more sides of integrated circuits Dec 27, 2007 Issued
Array ( [id] => 55054 [patent_doc_number] => 07768120 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-03 [patent_title] => 'Heat spreader and semiconductor device using the same' [patent_app_type] => utility [patent_app_number] => 12/005312 [patent_app_country] => US [patent_app_date] => 2007-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 17144 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/768/07768120.pdf [firstpage_image] =>[orig_patent_app_number] => 12005312 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/005312
Heat spreader and semiconductor device using the same Dec 26, 2007 Issued
Array ( [id] => 4517956 [patent_doc_number] => 07911040 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-22 [patent_title] => 'Integrated circuit package with improved connections' [patent_app_type] => utility [patent_app_number] => 11/965621 [patent_app_country] => US [patent_app_date] => 2007-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 23 [patent_no_of_words] => 8183 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/911/07911040.pdf [firstpage_image] =>[orig_patent_app_number] => 11965621 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/965621
Integrated circuit package with improved connections Dec 26, 2007 Issued
Array ( [id] => 5432258 [patent_doc_number] => 20090166844 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-07-02 [patent_title] => 'METAL COVER ON FLIP-CHIP MATRIX-ARRAY (FCMX) SUBSTRATE FOR LOW COST CPU ASSEMBLY' [patent_app_type] => utility [patent_app_number] => 11/964401 [patent_app_country] => US [patent_app_date] => 2007-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1289 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0166/20090166844.pdf [firstpage_image] =>[orig_patent_app_number] => 11964401 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/964401
METAL COVER ON FLIP-CHIP MATRIX-ARRAY (FCMX) SUBSTRATE FOR LOW COST CPU ASSEMBLY Dec 25, 2007 Abandoned
Array ( [id] => 4876713 [patent_doc_number] => 20080150096 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-26 [patent_title] => 'MULTI-CHIP MODULE, MANUFACTURING METHOD THEREOF, MOUNTING STRUCTURE OF MULTI-CHIP MODULE, AND MANUFACTURING METHOD OF MOUNTING STRUCTURE' [patent_app_type] => utility [patent_app_number] => 11/960042 [patent_app_country] => US [patent_app_date] => 2007-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 25856 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20080150096.pdf [firstpage_image] =>[orig_patent_app_number] => 11960042 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/960042
MULTI-CHIP MODULE, MANUFACTURING METHOD THEREOF, MOUNTING STRUCTURE OF MULTI-CHIP MODULE, AND MANUFACTURING METHOD OF MOUNTING STRUCTURE Dec 18, 2007 Abandoned
Array ( [id] => 5542814 [patent_doc_number] => 20090152691 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'LEADFRAME HAVING DIE ATTACH PAD WITH DELAMINATION AND CRACK-ARRESTING FEATURES' [patent_app_type] => utility [patent_app_number] => 11/959412 [patent_app_country] => US [patent_app_date] => 2007-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3605 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0152/20090152691.pdf [firstpage_image] =>[orig_patent_app_number] => 11959412 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/959412
Leadframe having die attach pad with delamination and crack-arresting features Dec 17, 2007 Issued
Array ( [id] => 5542863 [patent_doc_number] => 20090152740 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP' [patent_app_type] => utility [patent_app_number] => 11/957862 [patent_app_country] => US [patent_app_date] => 2007-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4470 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0152/20090152740.pdf [firstpage_image] =>[orig_patent_app_number] => 11957862 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/957862
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP Dec 16, 2007 Abandoned
Array ( [id] => 4876763 [patent_doc_number] => 20080150146 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-26 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/957152 [patent_app_country] => US [patent_app_date] => 2007-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2605 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20080150146.pdf [firstpage_image] =>[orig_patent_app_number] => 11957152 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/957152
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Dec 13, 2007 Abandoned
Array ( [id] => 5542811 [patent_doc_number] => 20090152688 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INTERFERENCE' [patent_app_type] => utility [patent_app_number] => 11/956132 [patent_app_country] => US [patent_app_date] => 2007-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4080 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0152/20090152688.pdf [firstpage_image] =>[orig_patent_app_number] => 11956132 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/956132
Integrated circuit package system for shielding electromagnetic interference Dec 12, 2007 Issued
Array ( [id] => 5542823 [patent_doc_number] => 20090152700 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTABLE INTEGRATED CIRCUIT DIE' [patent_app_type] => utility [patent_app_number] => 11/954601 [patent_app_country] => US [patent_app_date] => 2007-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3582 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0152/20090152700.pdf [firstpage_image] =>[orig_patent_app_number] => 11954601 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/954601
Mountable integrated circuit package system with mountable integrated circuit die Dec 11, 2007 Issued
Array ( [id] => 4745774 [patent_doc_number] => 20080090376 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'METHOD OF FABRICATING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/954204 [patent_app_country] => US [patent_app_date] => 2007-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4660 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0090/20080090376.pdf [firstpage_image] =>[orig_patent_app_number] => 11954204 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/954204
METHOD OF FABRICATING SEMICONDUCTOR DEVICE Dec 10, 2007 Abandoned
Array ( [id] => 4487609 [patent_doc_number] => 07902644 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-08 [patent_title] => 'Integrated circuit package system for electromagnetic isolation' [patent_app_type] => utility [patent_app_number] => 11/952951 [patent_app_country] => US [patent_app_date] => 2007-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 3860 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/902/07902644.pdf [firstpage_image] =>[orig_patent_app_number] => 11952951 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/952951
Integrated circuit package system for electromagnetic isolation Dec 6, 2007 Issued
Array ( [id] => 4673447 [patent_doc_number] => 20080211075 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-04 [patent_title] => 'IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME' [patent_app_type] => utility [patent_app_number] => 11/950921 [patent_app_country] => US [patent_app_date] => 2007-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6098 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0211/20080211075.pdf [firstpage_image] =>[orig_patent_app_number] => 11950921 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/950921
IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME Dec 4, 2007 Abandoned
Menu