Search

Pia Florence Tibbits

Examiner (ID: 11212)

Most Active Art Unit
2838
Art Unit(s)
3992, 2838, 2859
Total Applications
918
Issued Applications
776
Pending Applications
47
Abandoned Applications
95

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4743383 [patent_doc_number] => 20080087984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Compound semiconductor modified surface by use of pulsed electron beam and ion implantation through a deposited metal layer' [patent_app_type] => utility [patent_app_number] => 11/998961 [patent_app_country] => US [patent_app_date] => 2007-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3757 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20080087984.pdf [firstpage_image] =>[orig_patent_app_number] => 11998961 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/998961
Compound semiconductor modified surface by use of pulsed electron beam and ion implantation through a deposited metal layer Dec 2, 2007 Abandoned
Array ( [id] => 33716 [patent_doc_number] => 07791193 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-07 [patent_title] => 'Pad over active circuit system and method with meshed support structure' [patent_app_type] => utility [patent_app_number] => 11/943381 [patent_app_country] => US [patent_app_date] => 2007-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 27 [patent_no_of_words] => 4340 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 244 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/791/07791193.pdf [firstpage_image] =>[orig_patent_app_number] => 11943381 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/943381
Pad over active circuit system and method with meshed support structure Nov 19, 2007 Issued
Array ( [id] => 124202 [patent_doc_number] => 07705468 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-27 [patent_title] => 'Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/940522 [patent_app_country] => US [patent_app_date] => 2007-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4185 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/705/07705468.pdf [firstpage_image] =>[orig_patent_app_number] => 11940522 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/940522
Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same Nov 14, 2007 Issued
Array ( [id] => 5275567 [patent_doc_number] => 20090127699 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-21 [patent_title] => 'LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE AND SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/940961 [patent_app_country] => US [patent_app_date] => 2007-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 1957 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20090127699.pdf [firstpage_image] =>[orig_patent_app_number] => 11940961 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/940961
Low temperature co-fired ceramics substrate and semiconductor package Nov 14, 2007 Issued
Array ( [id] => 5282419 [patent_doc_number] => 20090096093 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-16 [patent_title] => 'INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME' [patent_app_type] => utility [patent_app_number] => 11/939732 [patent_app_country] => US [patent_app_date] => 2007-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3669 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20090096093.pdf [firstpage_image] =>[orig_patent_app_number] => 11939732 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/939732
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME Nov 13, 2007 Abandoned
Array ( [id] => 5262347 [patent_doc_number] => 20090115032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-07 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY' [patent_app_type] => utility [patent_app_number] => 11/936532 [patent_app_country] => US [patent_app_date] => 2007-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4571 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0115/20090115032.pdf [firstpage_image] =>[orig_patent_app_number] => 11936532 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/936532
Integrated circuit package system with dual connectivity Nov 6, 2007 Issued
Array ( [id] => 4782715 [patent_doc_number] => 20080136044 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-12 [patent_title] => 'Semiconductor package and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/982751 [patent_app_country] => US [patent_app_date] => 2007-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4118 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0136/20080136044.pdf [firstpage_image] =>[orig_patent_app_number] => 11982751 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/982751
Semiconductor package and method of manufacturing the same Nov 4, 2007 Issued
Array ( [id] => 4701896 [patent_doc_number] => 20080061418 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-13 [patent_title] => 'Three dimensional device integration method and integrated device' [patent_app_type] => utility [patent_app_number] => 11/980452 [patent_app_country] => US [patent_app_date] => 2007-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 29 [patent_no_of_words] => 12995 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20080061418.pdf [firstpage_image] =>[orig_patent_app_number] => 11980452 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/980452
Three dimensional device integration method and integrated device Oct 30, 2007 Abandoned
Array ( [id] => 4479793 [patent_doc_number] => 07906860 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-15 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/925312 [patent_app_country] => US [patent_app_date] => 2007-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4423 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/906/07906860.pdf [firstpage_image] =>[orig_patent_app_number] => 11925312 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/925312
Semiconductor device Oct 25, 2007 Issued
Array ( [id] => 102469 [patent_doc_number] => 07723213 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-25 [patent_title] => 'Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips' [patent_app_type] => utility [patent_app_number] => 11/976521 [patent_app_country] => US [patent_app_date] => 2007-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 24 [patent_no_of_words] => 7031 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 18 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/723/07723213.pdf [firstpage_image] =>[orig_patent_app_number] => 11976521 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/976521
Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips Oct 24, 2007 Issued
Array ( [id] => 5582852 [patent_doc_number] => 20090102054 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-23 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/876241 [patent_app_country] => US [patent_app_date] => 2007-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3180 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20090102054.pdf [firstpage_image] =>[orig_patent_app_number] => 11876241 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/876241
Semiconductor package Oct 21, 2007 Issued
Array ( [id] => 4667192 [patent_doc_number] => 20080042252 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-21 [patent_title] => 'STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS' [patent_app_type] => utility [patent_app_number] => 11/874531 [patent_app_country] => US [patent_app_date] => 2007-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1683 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20080042252.pdf [firstpage_image] =>[orig_patent_app_number] => 11874531 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/874531
Stackable ceramic FBGA for high thermal applications Oct 17, 2007 Issued
Array ( [id] => 4743410 [patent_doc_number] => 20080088011 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/974441 [patent_app_country] => US [patent_app_date] => 2007-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6440 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0088/20080088011.pdf [firstpage_image] =>[orig_patent_app_number] => 11974441 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/974441
Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof Oct 11, 2007 Issued
Array ( [id] => 6615016 [patent_doc_number] => 20100225003 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-09 [patent_title] => 'METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINABLE WITH SUCH A METHOD' [patent_app_type] => utility [patent_app_number] => 12/681119 [patent_app_country] => US [patent_app_date] => 2007-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5591 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0225/20100225003.pdf [firstpage_image] =>[orig_patent_app_number] => 12681119 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/681119
Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method Oct 8, 2007 Issued
Array ( [id] => 7723496 [patent_doc_number] => 08096764 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-01-17 [patent_title] => 'System for rotating a wind turbine blade' [patent_app_type] => utility [patent_app_number] => 12/444439 [patent_app_country] => US [patent_app_date] => 2007-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5730 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/096/08096764.pdf [firstpage_image] =>[orig_patent_app_number] => 12444439 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/444439
System for rotating a wind turbine blade Oct 8, 2007 Issued
Array ( [id] => 4583417 [patent_doc_number] => 07834464 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-16 [patent_title] => 'Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device' [patent_app_type] => utility [patent_app_number] => 11/869211 [patent_app_country] => US [patent_app_date] => 2007-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 36 [patent_no_of_words] => 5967 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/834/07834464.pdf [firstpage_image] =>[orig_patent_app_number] => 11869211 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/869211
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Oct 8, 2007 Issued
Array ( [id] => 4800514 [patent_doc_number] => 20080012101 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-17 [patent_title] => 'Semiconductor Package Having Improved Adhesion and Solderability' [patent_app_type] => utility [patent_app_number] => 11/864233 [patent_app_country] => US [patent_app_date] => 2007-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4707 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20080012101.pdf [firstpage_image] =>[orig_patent_app_number] => 11864233 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/864233
Semiconductor Package Having Improved Adhesion and Solderability Sep 27, 2007 Abandoned
Array ( [id] => 4936449 [patent_doc_number] => 20080073763 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-27 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/860751 [patent_app_country] => US [patent_app_date] => 2007-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4666 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0073/20080073763.pdf [firstpage_image] =>[orig_patent_app_number] => 11860751 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/860751
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Sep 24, 2007 Abandoned
Array ( [id] => 5505859 [patent_doc_number] => 20090079066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-26 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS' [patent_app_type] => utility [patent_app_number] => 11/859462 [patent_app_country] => US [patent_app_date] => 2007-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3253 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20090079066.pdf [firstpage_image] =>[orig_patent_app_number] => 11859462 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/859462
Integrated circuit packaging system with passive components Sep 20, 2007 Issued
Array ( [id] => 8244885 [patent_doc_number] => 08202798 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-19 [patent_title] => 'Improvements for reducing electromigration effect in an integrated circuit' [patent_app_type] => utility [patent_app_number] => 12/675242 [patent_app_country] => US [patent_app_date] => 2007-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2084 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/202/08202798.pdf [firstpage_image] =>[orig_patent_app_number] => 12675242 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/675242
Improvements for reducing electromigration effect in an integrated circuit Sep 19, 2007 Issued
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