
Pia Florence Tibbits
Examiner (ID: 11212)
| Most Active Art Unit | 2838 |
| Art Unit(s) | 3992, 2838, 2859 |
| Total Applications | 918 |
| Issued Applications | 776 |
| Pending Applications | 47 |
| Abandoned Applications | 95 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4743383
[patent_doc_number] => 20080087984
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-17
[patent_title] => 'Compound semiconductor modified surface by use of pulsed electron beam and ion implantation through a deposited metal layer'
[patent_app_type] => utility
[patent_app_number] => 11/998961
[patent_app_country] => US
[patent_app_date] => 2007-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3757
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0087/20080087984.pdf
[firstpage_image] =>[orig_patent_app_number] => 11998961
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/998961 | Compound semiconductor modified surface by use of pulsed electron beam and ion implantation through a deposited metal layer | Dec 2, 2007 | Abandoned |
Array
(
[id] => 33716
[patent_doc_number] => 07791193
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-07
[patent_title] => 'Pad over active circuit system and method with meshed support structure'
[patent_app_type] => utility
[patent_app_number] => 11/943381
[patent_app_country] => US
[patent_app_date] => 2007-11-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 27
[patent_no_of_words] => 4340
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 244
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/791/07791193.pdf
[firstpage_image] =>[orig_patent_app_number] => 11943381
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/943381 | Pad over active circuit system and method with meshed support structure | Nov 19, 2007 | Issued |
Array
(
[id] => 124202
[patent_doc_number] => 07705468
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-27
[patent_title] => 'Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/940522
[patent_app_country] => US
[patent_app_date] => 2007-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 4185
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 194
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/705/07705468.pdf
[firstpage_image] =>[orig_patent_app_number] => 11940522
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/940522 | Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same | Nov 14, 2007 | Issued |
Array
(
[id] => 5275567
[patent_doc_number] => 20090127699
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-21
[patent_title] => 'LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE AND SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/940961
[patent_app_country] => US
[patent_app_date] => 2007-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 1957
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0127/20090127699.pdf
[firstpage_image] =>[orig_patent_app_number] => 11940961
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/940961 | Low temperature co-fired ceramics substrate and semiconductor package | Nov 14, 2007 | Issued |
Array
(
[id] => 5282419
[patent_doc_number] => 20090096093
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-16
[patent_title] => 'INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/939732
[patent_app_country] => US
[patent_app_date] => 2007-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3669
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0096/20090096093.pdf
[firstpage_image] =>[orig_patent_app_number] => 11939732
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/939732 | INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME | Nov 13, 2007 | Abandoned |
Array
(
[id] => 5262347
[patent_doc_number] => 20090115032
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-07
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY'
[patent_app_type] => utility
[patent_app_number] => 11/936532
[patent_app_country] => US
[patent_app_date] => 2007-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4571
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0115/20090115032.pdf
[firstpage_image] =>[orig_patent_app_number] => 11936532
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/936532 | Integrated circuit package system with dual connectivity | Nov 6, 2007 | Issued |
Array
(
[id] => 4782715
[patent_doc_number] => 20080136044
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-12
[patent_title] => 'Semiconductor package and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/982751
[patent_app_country] => US
[patent_app_date] => 2007-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4118
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0136/20080136044.pdf
[firstpage_image] =>[orig_patent_app_number] => 11982751
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/982751 | Semiconductor package and method of manufacturing the same | Nov 4, 2007 | Issued |
Array
(
[id] => 4701896
[patent_doc_number] => 20080061418
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-13
[patent_title] => 'Three dimensional device integration method and integrated device'
[patent_app_type] => utility
[patent_app_number] => 11/980452
[patent_app_country] => US
[patent_app_date] => 2007-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 29
[patent_no_of_words] => 12995
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0061/20080061418.pdf
[firstpage_image] =>[orig_patent_app_number] => 11980452
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/980452 | Three dimensional device integration method and integrated device | Oct 30, 2007 | Abandoned |
Array
(
[id] => 4479793
[patent_doc_number] => 07906860
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-03-15
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/925312
[patent_app_country] => US
[patent_app_date] => 2007-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 16
[patent_no_of_words] => 4423
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 74
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/906/07906860.pdf
[firstpage_image] =>[orig_patent_app_number] => 11925312
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/925312 | Semiconductor device | Oct 25, 2007 | Issued |
Array
(
[id] => 102469
[patent_doc_number] => 07723213
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-25
[patent_title] => 'Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips'
[patent_app_type] => utility
[patent_app_number] => 11/976521
[patent_app_country] => US
[patent_app_date] => 2007-10-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 24
[patent_no_of_words] => 7031
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 8
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/723/07723213.pdf
[firstpage_image] =>[orig_patent_app_number] => 11976521
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/976521 | Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips | Oct 24, 2007 | Issued |
Array
(
[id] => 5582852
[patent_doc_number] => 20090102054
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-23
[patent_title] => 'SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/876241
[patent_app_country] => US
[patent_app_date] => 2007-10-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3180
[patent_no_of_claims] => 25
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0102/20090102054.pdf
[firstpage_image] =>[orig_patent_app_number] => 11876241
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/876241 | Semiconductor package | Oct 21, 2007 | Issued |
Array
(
[id] => 4667192
[patent_doc_number] => 20080042252
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-21
[patent_title] => 'STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS'
[patent_app_type] => utility
[patent_app_number] => 11/874531
[patent_app_country] => US
[patent_app_date] => 2007-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 1683
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0042/20080042252.pdf
[firstpage_image] =>[orig_patent_app_number] => 11874531
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/874531 | Stackable ceramic FBGA for high thermal applications | Oct 17, 2007 | Issued |
Array
(
[id] => 4743410
[patent_doc_number] => 20080088011
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-17
[patent_title] => 'Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/974441
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[patent_app_date] => 2007-10-12
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[pdf_file] => publications/A1/0088/20080088011.pdf
[firstpage_image] =>[orig_patent_app_number] => 11974441
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/974441 | Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof | Oct 11, 2007 | Issued |
Array
(
[id] => 6615016
[patent_doc_number] => 20100225003
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-09-09
[patent_title] => 'METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINABLE WITH SUCH A METHOD'
[patent_app_type] => utility
[patent_app_number] => 12/681119
[patent_app_country] => US
[patent_app_date] => 2007-10-09
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0225/20100225003.pdf
[firstpage_image] =>[orig_patent_app_number] => 12681119
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/681119 | Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method | Oct 8, 2007 | Issued |
Array
(
[id] => 7723496
[patent_doc_number] => 08096764
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-01-17
[patent_title] => 'System for rotating a wind turbine blade'
[patent_app_type] => utility
[patent_app_number] => 12/444439
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[pdf_file] => patents/08/096/08096764.pdf
[firstpage_image] =>[orig_patent_app_number] => 12444439
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/444439 | System for rotating a wind turbine blade | Oct 8, 2007 | Issued |
Array
(
[id] => 4583417
[patent_doc_number] => 07834464
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-11-16
[patent_title] => 'Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device'
[patent_app_type] => utility
[patent_app_number] => 11/869211
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[pdf_file] => patents/07/834/07834464.pdf
[firstpage_image] =>[orig_patent_app_number] => 11869211
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/869211 | Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device | Oct 8, 2007 | Issued |
Array
(
[id] => 4800514
[patent_doc_number] => 20080012101
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-17
[patent_title] => 'Semiconductor Package Having Improved Adhesion and Solderability'
[patent_app_type] => utility
[patent_app_number] => 11/864233
[patent_app_country] => US
[patent_app_date] => 2007-09-28
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[firstpage_image] =>[orig_patent_app_number] => 11864233
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/864233 | Semiconductor Package Having Improved Adhesion and Solderability | Sep 27, 2007 | Abandoned |
Array
(
[id] => 4936449
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/860751 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Sep 24, 2007 | Abandoned |
Array
(
[id] => 5505859
[patent_doc_number] => 20090079066
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-26
[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS'
[patent_app_type] => utility
[patent_app_number] => 11/859462
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[pdf_file] => publications/A1/0079/20090079066.pdf
[firstpage_image] =>[orig_patent_app_number] => 11859462
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/859462 | Integrated circuit packaging system with passive components | Sep 20, 2007 | Issued |
Array
(
[id] => 8244885
[patent_doc_number] => 08202798
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-06-19
[patent_title] => 'Improvements for reducing electromigration effect in an integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 12/675242
[patent_app_country] => US
[patent_app_date] => 2007-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/202/08202798.pdf
[firstpage_image] =>[orig_patent_app_number] => 12675242
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/675242 | Improvements for reducing electromigration effect in an integrated circuit | Sep 19, 2007 | Issued |