Quoc Dinh Hoang
Examiner (ID: 9225, Phone: (571)272-1780 , Office: P/2892 )
Most Active Art Unit | 2892 |
Art Unit(s) | 2818, 2892 |
Total Applications | 2221 |
Issued Applications | 1984 |
Pending Applications | 81 |
Abandoned Applications | 156 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 17848130
[patent_doc_number] => 11437517
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-09-06
[patent_title] => Semiconductor structures and methods with high mobility and high energy bandgap materials
[patent_app_type] => utility
[patent_app_number] => 16/913012
[patent_app_country] => US
[patent_app_date] => 2020-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 12
[patent_no_of_words] => 3388
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16913012
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/913012 | Semiconductor structures and methods with high mobility and high energy bandgap materials | Jun 25, 2020 | Issued |
Array
(
[id] => 17316264
[patent_doc_number] => 20210405313
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-30
[patent_title] => Miniaturization of Optical Sensor Modules through Wirebonded Ball Stacks
[patent_app_type] => utility
[patent_app_number] => 16/912000
[patent_app_country] => US
[patent_app_date] => 2020-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3104
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16912000
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/912000 | Miniaturization of optical sensor modules through wirebonded ball stacks | Jun 24, 2020 | Issued |
Array
(
[id] => 17189184
[patent_doc_number] => 20210336069
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-10-28
[patent_title] => VARIABLE CAPACITOR
[patent_app_type] => utility
[patent_app_number] => 16/893447
[patent_app_country] => US
[patent_app_date] => 2020-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4861
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16893447
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/893447 | VARIABLE CAPACITOR | Jun 4, 2020 | Pending |
Array
(
[id] => 17122297
[patent_doc_number] => 11133442
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-09-28
[patent_title] => Wavelength converted light emitting device with small source size
[patent_app_type] => utility
[patent_app_number] => 16/890655
[patent_app_country] => US
[patent_app_date] => 2020-06-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 5077
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16890655
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/890655 | Wavelength converted light emitting device with small source size | Jun 1, 2020 | Issued |
Array
(
[id] => 17159062
[patent_doc_number] => 20210320113
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-10-14
[patent_title] => METHOD OF MANUFACTURING MEMORY STURCTURE
[patent_app_type] => utility
[patent_app_number] => 16/880937
[patent_app_country] => US
[patent_app_date] => 2020-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3663
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16880937
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/880937 | Method of manufacturing memory structure | May 20, 2020 | Issued |
Array
(
[id] => 17232436
[patent_doc_number] => 20210358993
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-11-18
[patent_title] => HIGH DYNAMIC RANGE SPLIT PIXEL CMOS IMAGE SENSOR WITH LOW COLOR CROSSTALK
[patent_app_type] => utility
[patent_app_number] => 16/877077
[patent_app_country] => US
[patent_app_date] => 2020-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7291
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -35
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16877077
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/877077 | High dynamic range split pixel CMOS image sensor with low color crosstalk | May 17, 2020 | Issued |
Array
(
[id] => 17215706
[patent_doc_number] => 20210349044
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-11-11
[patent_title] => INTEGRATED CIRCUIT PACKAGE THAT MEASURES AMOUNT OF INTERNAL PRECIOUS MATERIAL
[patent_app_type] => utility
[patent_app_number] => 16/871162
[patent_app_country] => US
[patent_app_date] => 2020-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6938
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 52
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16871162
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/871162 | Integrated circuit package that measures amount of internal precious material | May 10, 2020 | Issued |
Array
(
[id] => 16256752
[patent_doc_number] => 20200266127
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-08-20
[patent_title] => MULTI-LAYER COOLING STRUCTURE INCLUDING THROUGH-SILICON VIAS THROUGH A PLURALITY OF DIRECTLY-BONDED SUBSTRATES AND METHODS OF MAKING THE SAME
[patent_app_type] => utility
[patent_app_number] => 16/866050
[patent_app_country] => US
[patent_app_date] => 2020-05-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7310
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 133
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16866050
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/866050 | Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same | May 3, 2020 | Issued |
Array
(
[id] => 16928410
[patent_doc_number] => 11049902
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-06-29
[patent_title] => Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer
[patent_app_type] => utility
[patent_app_number] => 16/853950
[patent_app_country] => US
[patent_app_date] => 2020-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 42
[patent_no_of_words] => 17974
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 140
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16853950
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/853950 | Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer | Apr 20, 2020 | Issued |
Array
(
[id] => 17002809
[patent_doc_number] => 11081632
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-08-03
[patent_title] => Micro-LED chips and methods for manufacturing the same and display devices
[patent_app_type] => utility
[patent_app_number] => 16/852574
[patent_app_country] => US
[patent_app_date] => 2020-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5727
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16852574
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/852574 | Micro-LED chips and methods for manufacturing the same and display devices | Apr 19, 2020 | Issued |
Array
(
[id] => 17818659
[patent_doc_number] => 11424283
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-08-23
[patent_title] => Photoelectric conversion apparatus, imaging system and mobile body
[patent_app_type] => utility
[patent_app_number] => 16/848946
[patent_app_country] => US
[patent_app_date] => 2020-04-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 21
[patent_no_of_words] => 9346
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16848946
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/848946 | Photoelectric conversion apparatus, imaging system and mobile body | Apr 14, 2020 | Issued |
Array
(
[id] => 16677465
[patent_doc_number] => 20210066231
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-03-04
[patent_title] => INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
[patent_app_type] => utility
[patent_app_number] => 16/846616
[patent_app_country] => US
[patent_app_date] => 2020-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11850
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 180
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16846616
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/846616 | Integrated circuit device having redistribution pattern | Apr 12, 2020 | Issued |
Array
(
[id] => 17159083
[patent_doc_number] => 20210320134
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-10-14
[patent_title] => MONOLITHIC MULTI-METALLIC THERMAL EXPANSION STABILIZER
[patent_app_type] => utility
[patent_app_number] => 16/844128
[patent_app_country] => US
[patent_app_date] => 2020-04-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5666
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 224
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16844128
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/844128 | Monolithic multi-metallic thermal expansion stabilizer | Apr 8, 2020 | Issued |
Array
(
[id] => 17925999
[patent_doc_number] => 11469263
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-10-11
[patent_title] => Image sensor
[patent_app_type] => utility
[patent_app_number] => 16/839279
[patent_app_country] => US
[patent_app_date] => 2020-04-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 6936
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 45
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16839279
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/839279 | Image sensor | Apr 2, 2020 | Issued |
Array
(
[id] => 16379295
[patent_doc_number] => 20200328138
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-10-15
[patent_title] => SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 16/826925
[patent_app_country] => US
[patent_app_date] => 2020-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7382
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -2
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16826925
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/826925 | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Mar 22, 2020 | Abandoned |
Array
(
[id] => 17115679
[patent_doc_number] => 20210296276
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-23
[patent_title] => SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD FOR FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 16/823489
[patent_app_country] => US
[patent_app_date] => 2020-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6659
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823489
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/823489 | Semiconductor device with composite dielectric structure and method for forming the same | Mar 18, 2020 | Issued |
Array
(
[id] => 16286232
[patent_doc_number] => 20200279834
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-09-03
[patent_title] => PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
[patent_app_type] => utility
[patent_app_number] => 16/819647
[patent_app_country] => US
[patent_app_date] => 2020-03-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3800
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 53
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16819647
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/819647 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Mar 15, 2020 | Issued |
Array
(
[id] => 18131335
[patent_doc_number] => 11557552
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-01-17
[patent_title] => 3D trench reference planes for integrated-circuit die packages
[patent_app_type] => utility
[patent_app_number] => 16/818603
[patent_app_country] => US
[patent_app_date] => 2020-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 8
[patent_no_of_words] => 8688
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16818603
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/818603 | 3D trench reference planes for integrated-circuit die packages | Mar 12, 2020 | Issued |
Array
(
[id] => 17424273
[patent_doc_number] => 11257734
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-02-22
[patent_title] => Thermal management package and method
[patent_app_type] => utility
[patent_app_number] => 16/816874
[patent_app_country] => US
[patent_app_date] => 2020-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 6154
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16816874
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/816874 | Thermal management package and method | Mar 11, 2020 | Issued |
Array
(
[id] => 18190697
[patent_doc_number] => 11581299
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-02-14
[patent_title] => Flexible impedance network system
[patent_app_type] => utility
[patent_app_number] => 16/817588
[patent_app_country] => US
[patent_app_date] => 2020-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 3183
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16817588
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/817588 | Flexible impedance network system | Mar 11, 2020 | Issued |