Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 800614
[patent_doc_number] => 07425762
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-09-16
[patent_title] => 'Electronic apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/607910
[patent_app_country] => US
[patent_app_date] => 2006-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 46
[patent_no_of_words] => 16588
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 440
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/425/07425762.pdf
[firstpage_image] =>[orig_patent_app_number] => 11607910
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/607910 | Electronic apparatus | Dec 3, 2006 | Issued |
Array
(
[id] => 34753
[patent_doc_number] => 07791823
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-07
[patent_title] => 'Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens'
[patent_app_type] => utility
[patent_app_number] => 11/562762
[patent_app_country] => US
[patent_app_date] => 2006-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 25
[patent_no_of_words] => 13357
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 145
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/791/07791823.pdf
[firstpage_image] =>[orig_patent_app_number] => 11562762
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/562762 | Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens | Nov 21, 2006 | Issued |
Array
(
[id] => 5262382
[patent_doc_number] => 20090115067
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-07
[patent_title] => 'MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUCH MODULE'
[patent_app_type] => utility
[patent_app_number] => 12/093223
[patent_app_country] => US
[patent_app_date] => 2006-11-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 10584
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0115/20090115067.pdf
[firstpage_image] =>[orig_patent_app_number] => 12093223
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/093223 | MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUCH MODULE | Nov 15, 2006 | Abandoned |
Array
(
[id] => 65047
[patent_doc_number] => 07759781
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-07-20
[patent_title] => 'LSI package provided with interface module'
[patent_app_type] => utility
[patent_app_number] => 11/552256
[patent_app_country] => US
[patent_app_date] => 2006-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 19
[patent_no_of_words] => 18330
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/759/07759781.pdf
[firstpage_image] =>[orig_patent_app_number] => 11552256
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/552256 | LSI package provided with interface module | Oct 23, 2006 | Issued |
Array
(
[id] => 5026312
[patent_doc_number] => 20070267758
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-22
[patent_title] => 'SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/539130
[patent_app_country] => US
[patent_app_date] => 2006-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2148
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0267/20070267758.pdf
[firstpage_image] =>[orig_patent_app_number] => 11539130
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/539130 | SEMICONDUCTOR PACKAGE | Oct 4, 2006 | Abandoned |
Array
(
[id] => 5150683
[patent_doc_number] => 20070050743
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'Vertical Twist Scheme for High Density DRAMs'
[patent_app_type] => utility
[patent_app_number] => 11/537797
[patent_app_country] => US
[patent_app_date] => 2006-10-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 8597
[patent_no_of_claims] => 45
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0050/20070050743.pdf
[firstpage_image] =>[orig_patent_app_number] => 11537797
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/537797 | Vertical Twist Scheme for High Density DRAMs | Oct 1, 2006 | Abandoned |
Array
(
[id] => 830438
[patent_doc_number] => 07399992
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-15
[patent_title] => 'Device for defeating reverse engineering of integrated circuits by optical means'
[patent_app_type] => utility
[patent_app_number] => 11/541997
[patent_app_country] => US
[patent_app_date] => 2006-10-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 17
[patent_no_of_words] => 6896
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/399/07399992.pdf
[firstpage_image] =>[orig_patent_app_number] => 11541997
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/541997 | Device for defeating reverse engineering of integrated circuits by optical means | Oct 1, 2006 | Issued |
Array
(
[id] => 5168965
[patent_doc_number] => 20070069396
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/525903
[patent_app_country] => US
[patent_app_date] => 2006-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6611
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0069/20070069396.pdf
[firstpage_image] =>[orig_patent_app_number] => 11525903
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/525903 | Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package | Sep 24, 2006 | Abandoned |
Array
(
[id] => 5228233
[patent_doc_number] => 20070290340
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-20
[patent_title] => 'CHIP STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/468304
[patent_app_country] => US
[patent_app_date] => 2006-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2195
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0290/20070290340.pdf
[firstpage_image] =>[orig_patent_app_number] => 11468304
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/468304 | CHIP STRUCTURE | Aug 29, 2006 | Abandoned |
Array
(
[id] => 4443814
[patent_doc_number] => 07928590
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-04-19
[patent_title] => 'Integrated circuit package with a heat dissipation device'
[patent_app_type] => utility
[patent_app_number] => 11/464784
[patent_app_country] => US
[patent_app_date] => 2006-08-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 8448
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/928/07928590.pdf
[firstpage_image] =>[orig_patent_app_number] => 11464784
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/464784 | Integrated circuit package with a heat dissipation device | Aug 14, 2006 | Issued |
Array
(
[id] => 4648823
[patent_doc_number] => 20080036078
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-14
[patent_title] => 'WIREBOND-LESS SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/464333
[patent_app_country] => US
[patent_app_date] => 2006-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 6197
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0036/20080036078.pdf
[firstpage_image] =>[orig_patent_app_number] => 11464333
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/464333 | WIREBOND-LESS SEMICONDUCTOR PACKAGE | Aug 13, 2006 | Abandoned |
Array
(
[id] => 4648820
[patent_doc_number] => 20080036075
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-14
[patent_title] => 'Lightweight, Hermetically Sealed Package Having Auxiliary, Selectively Contoured, Low Mass, Pseudo Wall Insert For Surface-Mounting And Dissipating Heat From Electronic Circuit Components'
[patent_app_type] => utility
[patent_app_number] => 11/463383
[patent_app_country] => US
[patent_app_date] => 2006-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3834
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0036/20080036075.pdf
[firstpage_image] =>[orig_patent_app_number] => 11463383
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/463383 | Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components | Aug 8, 2006 | Issued |
Array
(
[id] => 5104470
[patent_doc_number] => 20070063345
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-22
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/500263
[patent_app_country] => US
[patent_app_date] => 2006-08-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3240
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0063/20070063345.pdf
[firstpage_image] =>[orig_patent_app_number] => 11500263
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/500263 | Semiconductor device | Aug 6, 2006 | Issued |
Array
(
[id] => 4685730
[patent_doc_number] => 20080029911
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-07
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 11/462303
[patent_app_country] => US
[patent_app_date] => 2006-08-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4236
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0029/20080029911.pdf
[firstpage_image] =>[orig_patent_app_number] => 11462303
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/462303 | Integrated circuit package system | Aug 2, 2006 | Issued |
Array
(
[id] => 191314
[patent_doc_number] => 07642627
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-01-05
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/461634
[patent_app_country] => US
[patent_app_date] => 2006-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 3503
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/642/07642627.pdf
[firstpage_image] =>[orig_patent_app_number] => 11461634
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/461634 | Semiconductor device | Jul 31, 2006 | Issued |
Array
(
[id] => 33548
[patent_doc_number] => 07791081
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-07
[patent_title] => 'Radiation-emitting semiconductor chip'
[patent_app_type] => utility
[patent_app_number] => 11/494984
[patent_app_country] => US
[patent_app_date] => 2006-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 7170
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/791/07791081.pdf
[firstpage_image] =>[orig_patent_app_number] => 11494984
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/494984 | Radiation-emitting semiconductor chip | Jul 27, 2006 | Issued |
Array
(
[id] => 4654953
[patent_doc_number] => 20080023813
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-31
[patent_title] => 'Multi-die apparatus including moveable portions'
[patent_app_type] => utility
[patent_app_number] => 11/495363
[patent_app_country] => US
[patent_app_date] => 2006-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 8730
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0023/20080023813.pdf
[firstpage_image] =>[orig_patent_app_number] => 11495363
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/495363 | Multi-die apparatus including moveable portions | Jul 27, 2006 | Issued |
Array
(
[id] => 5605693
[patent_doc_number] => 20060267209
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-30
[patent_title] => 'High-frequency semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/493526
[patent_app_country] => US
[patent_app_date] => 2006-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 9209
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0267/20060267209.pdf
[firstpage_image] =>[orig_patent_app_number] => 11493526
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/493526 | High-frequency semiconductor device and method of manufacturing the same | Jul 26, 2006 | Issued |
Array
(
[id] => 5240569
[patent_doc_number] => 20070019060
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-25
[patent_title] => 'Substrate sheet, manufacturing method of circuit substrate, and ink jet head'
[patent_app_type] => utility
[patent_app_number] => 11/490204
[patent_app_country] => US
[patent_app_date] => 2006-07-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 7113
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0019/20070019060.pdf
[firstpage_image] =>[orig_patent_app_number] => 11490204
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/490204 | Substrate sheet, manufacturing method of circuit substrate, and ink jet head | Jul 20, 2006 | Issued |
Array
(
[id] => 4795352
[patent_doc_number] => 20080006938
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-10
[patent_title] => 'Method for bonding wafers to produce stacked integrated circuits'
[patent_app_type] => utility
[patent_app_number] => 11/484544
[patent_app_country] => US
[patent_app_date] => 2006-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 8635
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20080006938.pdf
[firstpage_image] =>[orig_patent_app_number] => 11484544
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/484544 | Method for bonding wafers to produce stacked integrated circuits | Jul 9, 2006 | Issued |