Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 185187
[patent_doc_number] => 07645645
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-01-12
[patent_title] => 'Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof'
[patent_app_type] => utility
[patent_app_number] => 11/372334
[patent_app_country] => US
[patent_app_date] => 2006-03-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 19
[patent_no_of_words] => 5675
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/645/07645645.pdf
[firstpage_image] =>[orig_patent_app_number] => 11372334
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/372334 | Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof | Mar 8, 2006 | Issued |
Array
(
[id] => 112300
[patent_doc_number] => 07713787
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-11
[patent_title] => 'Mounted body and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/911144
[patent_app_country] => US
[patent_app_date] => 2006-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 10656
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[pdf_file] => patents/07/713/07713787.pdf
[firstpage_image] =>[orig_patent_app_number] => 11911144
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/911144 | Mounted body and method for manufacturing the same | Feb 20, 2006 | Issued |
Array
(
[id] => 457408
[patent_doc_number] => 07244959
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-07-17
[patent_title] => 'Detection of electromagnetic radiation using micromechanical multiple quantum wells structures'
[patent_app_type] => utility
[patent_app_number] => 11/358933
[patent_app_country] => US
[patent_app_date] => 2006-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2894
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/244/07244959.pdf
[firstpage_image] =>[orig_patent_app_number] => 11358933
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/358933 | Detection of electromagnetic radiation using micromechanical multiple quantum wells structures | Feb 20, 2006 | Issued |
Array
(
[id] => 5617021
[patent_doc_number] => 20060186553
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-24
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/354124
[patent_app_country] => US
[patent_app_date] => 2006-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
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[patent_no_of_words] => 8565
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[pdf_file] => publications/A1/0186/20060186553.pdf
[firstpage_image] =>[orig_patent_app_number] => 11354124
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/354124 | Semiconductor device | Feb 14, 2006 | Issued |
Array
(
[id] => 113926
[patent_doc_number] => 07714451
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-11
[patent_title] => 'Semiconductor package system with thermal die bonding'
[patent_app_type] => utility
[patent_app_number] => 11/307614
[patent_app_country] => US
[patent_app_date] => 2006-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/07/714/07714451.pdf
[firstpage_image] =>[orig_patent_app_number] => 11307614
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/307614 | Semiconductor package system with thermal die bonding | Feb 13, 2006 | Issued |
Array
(
[id] => 5675557
[patent_doc_number] => 20060180912
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-17
[patent_title] => 'Stacked ball grid array package module utilizing one or more interposer layers'
[patent_app_type] => utility
[patent_app_number] => 11/350974
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[patent_app_date] => 2006-02-08
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[pdf_file] => publications/A1/0180/20060180912.pdf
[firstpage_image] =>[orig_patent_app_number] => 11350974
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/350974 | Stacked ball grid array package module utilizing one or more interposer layers | Feb 7, 2006 | Issued |
Array
(
[id] => 221370
[patent_doc_number] => 07608916
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-10-27
[patent_title] => 'Aluminum leadframes for semiconductor QFN/SON devices'
[patent_app_type] => utility
[patent_app_number] => 11/345754
[patent_app_country] => US
[patent_app_date] => 2006-02-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3789
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/608/07608916.pdf
[firstpage_image] =>[orig_patent_app_number] => 11345754
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/345754 | Aluminum leadframes for semiconductor QFN/SON devices | Feb 1, 2006 | Issued |
Array
(
[id] => 55091
[patent_doc_number] => 07768136
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-03
[patent_title] => 'Sealed-by-resin type semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/344084
[patent_app_country] => US
[patent_app_date] => 2006-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 8151
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/768/07768136.pdf
[firstpage_image] =>[orig_patent_app_number] => 11344084
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/344084 | Sealed-by-resin type semiconductor device | Jan 31, 2006 | Issued |
Array
(
[id] => 5175218
[patent_doc_number] => 20070176276
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-02
[patent_title] => 'Semiconductor die assembly'
[patent_app_type] => utility
[patent_app_number] => 11/344494
[patent_app_country] => US
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[pdf_file] => publications/A1/0176/20070176276.pdf
[firstpage_image] =>[orig_patent_app_number] => 11344494
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/344494 | Semiconductor die assembly | Jan 31, 2006 | Abandoned |
Array
(
[id] => 823989
[patent_doc_number] => 07405462
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-29
[patent_title] => 'FPGA architecture at conventional and submicron scales'
[patent_app_type] => utility
[patent_app_number] => 11/343304
[patent_app_country] => US
[patent_app_date] => 2006-01-31
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[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/07/405/07405462.pdf
[firstpage_image] =>[orig_patent_app_number] => 11343304
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/343304 | FPGA architecture at conventional and submicron scales | Jan 30, 2006 | Issued |
Array
(
[id] => 5178491
[patent_doc_number] => 20070179551
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-02
[patent_title] => 'Filtered electrical interconnect assembly'
[patent_app_type] => utility
[patent_app_number] => 11/343174
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[pdf_file] => publications/A1/0179/20070179551.pdf
[firstpage_image] =>[orig_patent_app_number] => 11343174
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/343174 | Filtered electrical interconnect assembly | Jan 29, 2006 | Issued |
Array
(
[id] => 169724
[patent_doc_number] => 07667333
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-02-23
[patent_title] => 'Stack of semiconductor chips'
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[pdf_file] => patents/07/667/07667333.pdf
[firstpage_image] =>[orig_patent_app_number] => 11341884
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/341884 | Stack of semiconductor chips | Jan 26, 2006 | Issued |
Array
(
[id] => 5680920
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[patent_title] => 'Semiconductor device and method for producing same'
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[firstpage_image] =>[orig_patent_app_number] => 11342294
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/342294 | Semiconductor device and method for producing same | Jan 26, 2006 | Issued |
Array
(
[id] => 322988
[patent_doc_number] => 07518221
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[patent_issue_date] => 2009-04-14
[patent_title] => 'Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires'
[patent_app_type] => utility
[patent_app_number] => 11/340934
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[pdf_file] => patents/07/518/07518221.pdf
[firstpage_image] =>[orig_patent_app_number] => 11340934
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/340934 | Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires | Jan 25, 2006 | Issued |
Array
(
[id] => 152661
[patent_doc_number] => 07679108
[patent_country] => US
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[patent_issue_date] => 2010-03-16
[patent_title] => 'Semiconductor memory and fabrication method for the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/339483 | Semiconductor memory and fabrication method for the same | Jan 25, 2006 | Issued |
Array
(
[id] => 5838314
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[patent_title] => 'Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/339973 | Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip | Jan 25, 2006 | Issued |
Array
(
[id] => 5909047
[patent_doc_number] => 20060125090
[patent_country] => US
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[patent_issue_date] => 2006-06-15
[patent_title] => 'Heat dissipation structure and method thereof'
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[firstpage_image] =>[orig_patent_app_number] => 11338551
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/338551 | Heat dissipation structure and method thereof | Jan 23, 2006 | Abandoned |
Array
(
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Array
(
[id] => 5049118
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[patent_title] => 'Semiconductor device having termination circuit line'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/335523 | Semiconductor device having termination circuit line | Jan 19, 2006 | Abandoned |
Array
(
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[firstpage_image] =>[orig_patent_app_number] => 11335944
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/335944 | Arrangements for an integrated sensor | Jan 19, 2006 | Issued |