Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5664763
[patent_doc_number] => 20060170113
[patent_country] => US
[patent_kind] => A1
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[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/334373
[patent_app_country] => US
[patent_app_date] => 2006-01-19
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[pdf_file] => publications/A1/0170/20060170113.pdf
[firstpage_image] =>[orig_patent_app_number] => 11334373
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/334373 | Semiconductor device | Jan 18, 2006 | Issued |
Array
(
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[patent_doc_number] => 20070164267
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[patent_kind] => A1
[patent_issue_date] => 2007-07-19
[patent_title] => 'Electrically rewritable non-volatile memory element and method of manufacturing the same'
[patent_app_type] => utility
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Array
(
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[patent_issue_date] => 2006-08-17
[patent_title] => 'Three-dimensional circuit module and method of manufacturing the same'
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[patent_app_date] => 2006-01-18
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Array
(
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[patent_doc_number] => 07312519
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-12-25
[patent_title] => 'Stacked integrated circuit package-in-package system'
[patent_app_type] => utility
[patent_app_number] => 11/331564
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[patent_app_date] => 2006-01-12
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/331564 | Stacked integrated circuit package-in-package system | Jan 11, 2006 | Issued |
Array
(
[id] => 5217530
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[patent_title] => 'Structure of Ball Grid Array package'
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Array
(
[id] => 582007
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[patent_issue_date] => 2008-11-25
[patent_title] => 'Die seal structure for reducing stress induced during die saw process'
[patent_app_type] => utility
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Array
(
[id] => 5863251
[patent_doc_number] => 20060097381
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[patent_kind] => A1
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[patent_title] => 'Chip package with grease heat sink'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11312678
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/312678 | Chip package with grease heat sink | Dec 18, 2005 | Abandoned |
Array
(
[id] => 5652717
[patent_doc_number] => 20060138452
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[patent_kind] => A1
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[patent_title] => 'Power semiconductor module'
[patent_app_type] => utility
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[patent_app_date] => 2005-12-16
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[firstpage_image] =>[orig_patent_app_number] => 11304703
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/304703 | Power semiconductor module | Dec 15, 2005 | Issued |
Array
(
[id] => 4789504
[patent_doc_number] => 20080290477
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Array
(
[id] => 7590951
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[patent_title] => 'High density three dimensional semiconductor die package'
[patent_app_type] => utility
[patent_app_number] => 11/264889
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[pdf_file] => patents/07/663/07663216.pdf
[firstpage_image] =>[orig_patent_app_number] => 11264889
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/264889 | High density three dimensional semiconductor die package | Nov 1, 2005 | Issued |
Array
(
[id] => 356575
[patent_doc_number] => 07489013
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[patent_kind] => B1
[patent_issue_date] => 2009-02-10
[patent_title] => 'Destructor integrated circuit chip, interposer electronic device and methods'
[patent_app_type] => utility
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Array
(
[id] => 844087
[patent_doc_number] => 07388284
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[patent_kind] => B1
[patent_issue_date] => 2008-06-17
[patent_title] => 'Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/250943 | Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit | Oct 13, 2005 | Issued |
Array
(
[id] => 893116
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[patent_title] => 'Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same'
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Array
(
[id] => 211474
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[patent_title] => 'Method of improving adhesion between two dielectric films'
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Array
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Array
(
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Array
(
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Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/238114 | Device with integrated capacitance structure | Sep 28, 2005 | Issued |