Ralf T Seifert

Array ( [id] => 576611 [patent_doc_number] => 07456083 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-11-25 [patent_title] => 'Semiconductor device and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 11/069061 [patent_app_country] => US [patent_app_date] => 2005-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 4307 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/456/07456083.pdf [firstpage_image] =>[orig_patent_app_number] => 11069061 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5703219 [patent_doc_number] => 20060192266 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-08-31 [patent_title] => 'Semiconductor memory having charge trapping memory cells and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/067983 [patent_app_country] => US [patent_app_date] => 2005-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 6358 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0192/20060192266.pdf [firstpage_image] =>[orig_patent_app_number] => 11067983 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7016508 [patent_doc_number] => 20050218525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-06 [patent_title] => 'Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/058323 [patent_app_country] => US [patent_app_date] => 2005-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 8245 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0218/20050218525.pdf [firstpage_image] =>[orig_patent_app_number] => 11058323 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6994034 [patent_doc_number] => 20050133810 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-23 [patent_title] => 'Opto-electronic assembly having an encapsulant with at least two different functional zones' [patent_app_type] => utility [patent_app_number] => 11/048676 [patent_app_country] => US [patent_app_date] => 2005-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 11710 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20050133810.pdf [firstpage_image] =>[orig_patent_app_number] => 11048676 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7141599 [patent_doc_number] => 20050117267 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-02 [patent_title] => 'IC package substrate with over voltage protection function' [patent_app_type] => utility [patent_app_number] => 11/025330 [patent_app_country] => US [patent_app_date] => 2004-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1500 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20050117267.pdf [firstpage_image] =>[orig_patent_app_number] => 11025330 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 303950 [patent_doc_number] => 07535090 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-19 [patent_title] => 'LSI package provided with interface module' [patent_app_type] => utility [patent_app_number] => 11/015013 [patent_app_country] => US [patent_app_date] => 2004-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 19 [patent_no_of_words] => 18303 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/535/07535090.pdf [firstpage_image] =>[orig_patent_app_number] => 11015013 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7096137 [patent_doc_number] => 20050128595 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-16 [patent_title] => 'Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens' [patent_app_type] => utility [patent_app_number] => 11/013101 [patent_app_country] => US [patent_app_date] => 2004-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 13339 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20050128595.pdf [firstpage_image] =>[orig_patent_app_number] => 11013101 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 469805 [patent_doc_number] => 07233067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-06-19 [patent_title] => 'Manufacturing a bump electrode with roughened face' [patent_app_type] => utility [patent_app_number] => 10/988553 [patent_app_country] => US [patent_app_date] => 2004-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2944 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/233/07233067.pdf [firstpage_image] =>[orig_patent_app_number] => 10988553 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7232381 [patent_doc_number] => 20050139391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-30 [patent_title] => 'Circuit board with trace configuration for high-speed digital differential signaling' [patent_app_type] => utility [patent_app_number] => 10/977192 [patent_app_country] => US [patent_app_date] => 2004-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3389 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0139/20050139391.pdf [firstpage_image] =>[orig_patent_app_number] => 10977192 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7048478 [patent_doc_number] => 20050184365 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-08-25 [patent_title] => 'High density lead arrangement package structure' [patent_app_type] => utility [patent_app_number] => 10/959203 [patent_app_country] => US [patent_app_date] => 2004-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1928 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0184/20050184365.pdf [firstpage_image] =>[orig_patent_app_number] => 10959203 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 616350 [patent_doc_number] => 07144761 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-05 [patent_title] => 'Semiconductor device and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/958282 [patent_app_country] => US [patent_app_date] => 2004-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 43 [patent_no_of_words] => 6181 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/144/07144761.pdf [firstpage_image] =>[orig_patent_app_number] => 10958282 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 672936 [patent_doc_number] => 07091538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-15 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/954183 [patent_app_country] => US [patent_app_date] => 2004-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 3967 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/091/07091538.pdf [firstpage_image] =>[orig_patent_app_number] => 10954183 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 687841 [patent_doc_number] => 07078800 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-18 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/957176 [patent_app_country] => US [patent_app_date] => 2004-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3502 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/078/07078800.pdf [firstpage_image] =>[orig_patent_app_number] => 10957176 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6918185 [patent_doc_number] => 20050095746 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-05 [patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument' [patent_app_type] => utility [patent_app_number] => 10/941871 [patent_app_country] => US [patent_app_date] => 2004-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4715 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0095/20050095746.pdf [firstpage_image] =>[orig_patent_app_number] => 10941871 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 578353 [patent_doc_number] => 07459721 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-12-02 [patent_title] => 'Field effect type organic transistor and process for production thereof' [patent_app_type] => utility [patent_app_number] => 10/555374 [patent_app_country] => US [patent_app_date] => 2004-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 5413 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/459/07459721.pdf [firstpage_image] =>[orig_patent_app_number] => 10555374 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 45176 [patent_doc_number] => 07777319 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-17 [patent_title] => 'Three dimensional integrated circuits' [patent_app_type] => utility [patent_app_number] => 10/937828 [patent_app_country] => US [patent_app_date] => 2004-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 6919 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/777/07777319.pdf [firstpage_image] =>[orig_patent_app_number] => 10937828 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 686550 [patent_doc_number] => 07078266 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-18 [patent_title] => 'Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts' [patent_app_type] => utility [patent_app_number] => 10/933144 [patent_app_country] => US [patent_app_date] => 2004-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 40 [patent_no_of_words] => 6585 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/078/07078266.pdf [firstpage_image] =>[orig_patent_app_number] => 10933144 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 662646 [patent_doc_number] => 07101749 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-09-05 [patent_title] => 'Non-volatile semiconductor memory device' [patent_app_type] => utility [patent_app_number] => 10/933035 [patent_app_country] => US [patent_app_date] => 2004-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3612 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/101/07101749.pdf [firstpage_image] =>[orig_patent_app_number] => 10933035 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 285895 [patent_doc_number] => 07550824 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-23 [patent_title] => 'Low k interconnect dielectric using surface transformation' [patent_app_type] => utility [patent_app_number] => 10/931593 [patent_app_country] => US [patent_app_date] => 2004-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 26 [patent_no_of_words] => 6214 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/550/07550824.pdf [firstpage_image] =>[orig_patent_app_number] => 10931593 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7120382 [patent_doc_number] => 20050012211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-20 [patent_title] => 'Under-bump metallugical structure' [patent_app_type] => utility [patent_app_number] => 10/921369 [patent_app_country] => US [patent_app_date] => 2004-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4365 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20050012211.pdf [firstpage_image] =>[orig_patent_app_number] => 10921369 [rel_patent_id] =>[rel_patent_doc_number] =>)