Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7058953 [patent_doc_number] => 20050001312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Chip package with grease heat sink' [patent_app_type] => utility [patent_app_number] => 10/898618 [patent_app_country] => US [patent_app_date] => 2004-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4553 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20050001312.pdf [firstpage_image] =>[orig_patent_app_number] => 10898618 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/898618
Chip package with grease heat sink Jul 21, 2004 Abandoned
Array ( [id] => 7059793 [patent_doc_number] => 20050002153 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Semiconductor integrated circuit device, mounting board, and device and board assembly' [patent_app_type] => utility [patent_app_number] => 10/893967 [patent_app_country] => US [patent_app_date] => 2004-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6016 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0002/20050002153.pdf [firstpage_image] =>[orig_patent_app_number] => 10893967 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/893967
Semiconductor integrated circuit device, mounting board, and device and board assembly Jul 19, 2004 Abandoned
Array ( [id] => 651300 [patent_doc_number] => 07112878 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-09-26 [patent_title] => 'Die stacking scheme' [patent_app_type] => utility [patent_app_number] => 10/891792 [patent_app_country] => US [patent_app_date] => 2004-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 5743 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/112/07112878.pdf [firstpage_image] =>[orig_patent_app_number] => 10891792 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/891792
Die stacking scheme Jul 14, 2004 Issued
Array ( [id] => 7120374 [patent_doc_number] => 20050012203 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-20 [patent_title] => 'Enhanced die-down ball grid array and method for making the same' [patent_app_type] => utility [patent_app_number] => 10/891519 [patent_app_country] => US [patent_app_date] => 2004-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6321 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20050012203.pdf [firstpage_image] =>[orig_patent_app_number] => 10891519 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/891519
Enhanced die-down ball grid array and method for making the same Jul 14, 2004 Issued
Array ( [id] => 7250332 [patent_doc_number] => 20040238955 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-02 [patent_title] => 'Semiconductor device and method of fabricating the same' [patent_app_type] => new [patent_app_number] => 10/878379 [patent_app_country] => US [patent_app_date] => 2004-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 7621 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0238/20040238955.pdf [firstpage_image] =>[orig_patent_app_number] => 10878379 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/878379
Semiconductor device and method of fabricating the same Jun 28, 2004 Abandoned
Array ( [id] => 345457 [patent_doc_number] => 07498647 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-03 [patent_title] => 'Packaged microelectronic imagers and methods of packaging microelectronic imagers' [patent_app_type] => utility [patent_app_number] => 10/864974 [patent_app_country] => US [patent_app_date] => 2004-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 5972 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/498/07498647.pdf [firstpage_image] =>[orig_patent_app_number] => 10864974 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/864974
Packaged microelectronic imagers and methods of packaging microelectronic imagers Jun 9, 2004 Issued
Array ( [id] => 7607186 [patent_doc_number] => 07098530 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-29 [patent_title] => 'Package for a high-frequency electronic device' [patent_app_type] => utility [patent_app_number] => 10/560004 [patent_app_country] => US [patent_app_date] => 2004-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 36 [patent_no_of_words] => 7365 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 220 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/098/07098530.pdf [firstpage_image] =>[orig_patent_app_number] => 10560004 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/560004
Package for a high-frequency electronic device Jun 7, 2004 Issued
Array ( [id] => 7411894 [patent_doc_number] => 20040207073 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-21 [patent_title] => 'Electronic apparatus' [patent_app_type] => new [patent_app_number] => 10/844392 [patent_app_country] => US [patent_app_date] => 2004-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 16893 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20040207073.pdf [firstpage_image] =>[orig_patent_app_number] => 10844392 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/844392
Electronic apparatus May 12, 2004 Issued
Array ( [id] => 683030 [patent_doc_number] => 07081665 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-25 [patent_title] => 'Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts' [patent_app_type] => utility [patent_app_number] => 10/841648 [patent_app_country] => US [patent_app_date] => 2004-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 40 [patent_no_of_words] => 6585 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/081/07081665.pdf [firstpage_image] =>[orig_patent_app_number] => 10841648 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/841648
Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts May 9, 2004 Issued
Array ( [id] => 591452 [patent_doc_number] => 07439613 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-10-21 [patent_title] => 'Substrate based unmolded package' [patent_app_type] => utility [patent_app_number] => 10/841656 [patent_app_country] => US [patent_app_date] => 2004-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 6330 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/439/07439613.pdf [firstpage_image] =>[orig_patent_app_number] => 10841656 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/841656
Substrate based unmolded package May 5, 2004 Issued
Array ( [id] => 6915607 [patent_doc_number] => 20050093168 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-05 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/833043 [patent_app_country] => US [patent_app_date] => 2004-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4182 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0093/20050093168.pdf [firstpage_image] =>[orig_patent_app_number] => 10833043 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/833043
Semiconductor device and method of manufacturing the same Apr 27, 2004 Issued
Array ( [id] => 734313 [patent_doc_number] => 07038313 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-02 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/832253 [patent_app_country] => US [patent_app_date] => 2004-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 6574 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/038/07038313.pdf [firstpage_image] =>[orig_patent_app_number] => 10832253 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/832253
Semiconductor device and method of manufacturing the same Apr 26, 2004 Issued
Array ( [id] => 6923461 [patent_doc_number] => 20050236716 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-27 [patent_title] => 'Heat dissipation structure and method thereof' [patent_app_type] => utility [patent_app_number] => 10/829583 [patent_app_country] => US [patent_app_date] => 2004-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2578 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0236/20050236716.pdf [firstpage_image] =>[orig_patent_app_number] => 10829583 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/829583
Heat dissipation structure and method thereof Apr 21, 2004 Abandoned
Array ( [id] => 7291831 [patent_doc_number] => 20040212070 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-28 [patent_title] => 'Memory module having space-saving arrangement of memory chips and memory chip therefore' [patent_app_type] => new [patent_app_number] => 10/828034 [patent_app_country] => US [patent_app_date] => 2004-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4218 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0212/20040212070.pdf [firstpage_image] =>[orig_patent_app_number] => 10828034 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/828034
Memory module having space-saving arrangement of memory chips and memory chip therefore Apr 19, 2004 Issued
Array ( [id] => 363881 [patent_doc_number] => 07482696 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-27 [patent_title] => 'Light-emitting diode package structure' [patent_app_type] => utility [patent_app_number] => 10/826003 [patent_app_country] => US [patent_app_date] => 2004-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3192 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/482/07482696.pdf [firstpage_image] =>[orig_patent_app_number] => 10826003 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/826003
Light-emitting diode package structure Apr 15, 2004 Issued
Array ( [id] => 730155 [patent_doc_number] => 07042077 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-09 [patent_title] => 'Integrated circuit package with low modulus layer and capacitor/interposer' [patent_app_type] => utility [patent_app_number] => 10/825400 [patent_app_country] => US [patent_app_date] => 2004-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 2553 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/042/07042077.pdf [firstpage_image] =>[orig_patent_app_number] => 10825400 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/825400
Integrated circuit package with low modulus layer and capacitor/interposer Apr 14, 2004 Issued
Array ( [id] => 681121 [patent_doc_number] => 07084491 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-01 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/823734 [patent_app_country] => US [patent_app_date] => 2004-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 26 [patent_no_of_words] => 10204 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 300 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/084/07084491.pdf [firstpage_image] =>[orig_patent_app_number] => 10823734 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/823734
Semiconductor device Apr 13, 2004 Issued
Array ( [id] => 4477374 [patent_doc_number] => 07868472 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-01-11 [patent_title] => 'Thermal dissipation in integrated circuit systems' [patent_app_type] => utility [patent_app_number] => 10/820484 [patent_app_country] => US [patent_app_date] => 2004-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 2497 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/868/07868472.pdf [firstpage_image] =>[orig_patent_app_number] => 10820484 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/820484
Thermal dissipation in integrated circuit systems Apr 7, 2004 Issued
Array ( [id] => 7250328 [patent_doc_number] => 20040238954 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-02 [patent_title] => 'Module component' [patent_app_type] => new [patent_app_number] => 10/815664 [patent_app_country] => US [patent_app_date] => 2004-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3366 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0238/20040238954.pdf [firstpage_image] =>[orig_patent_app_number] => 10815664 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/815664
Module component Apr 1, 2004 Abandoned
Array ( [id] => 817025 [patent_doc_number] => 07410833 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-08-12 [patent_title] => 'Interconnections for flip-chip using lead-free solders and having reaction barrier layers' [patent_app_type] => utility [patent_app_number] => 10/815103 [patent_app_country] => US [patent_app_date] => 2004-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 5704 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/410/07410833.pdf [firstpage_image] =>[orig_patent_app_number] => 10815103 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/815103
Interconnections for flip-chip using lead-free solders and having reaction barrier layers Mar 30, 2004 Issued
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