Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 7058953
[patent_doc_number] => 20050001312
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-06
[patent_title] => 'Chip package with grease heat sink'
[patent_app_type] => utility
[patent_app_number] => 10/898618
[patent_app_country] => US
[patent_app_date] => 2004-07-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4553
[patent_no_of_claims] => 26
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20050001312.pdf
[firstpage_image] =>[orig_patent_app_number] => 10898618
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/898618 | Chip package with grease heat sink | Jul 21, 2004 | Abandoned |
Array
(
[id] => 7059793
[patent_doc_number] => 20050002153
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-06
[patent_title] => 'Semiconductor integrated circuit device, mounting board, and device and board assembly'
[patent_app_type] => utility
[patent_app_number] => 10/893967
[patent_app_country] => US
[patent_app_date] => 2004-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[firstpage_image] =>[orig_patent_app_number] => 10893967
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/893967 | Semiconductor integrated circuit device, mounting board, and device and board assembly | Jul 19, 2004 | Abandoned |
Array
(
[id] => 651300
[patent_doc_number] => 07112878
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-09-26
[patent_title] => 'Die stacking scheme'
[patent_app_type] => utility
[patent_app_number] => 10/891792
[patent_app_country] => US
[patent_app_date] => 2004-07-15
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[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/07/112/07112878.pdf
[firstpage_image] =>[orig_patent_app_number] => 10891792
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/891792 | Die stacking scheme | Jul 14, 2004 | Issued |
Array
(
[id] => 7120374
[patent_doc_number] => 20050012203
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-20
[patent_title] => 'Enhanced die-down ball grid array and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 10/891519
[patent_app_country] => US
[patent_app_date] => 2004-07-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 6321
[patent_no_of_claims] => 45
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[pdf_file] => publications/A1/0012/20050012203.pdf
[firstpage_image] =>[orig_patent_app_number] => 10891519
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/891519 | Enhanced die-down ball grid array and method for making the same | Jul 14, 2004 | Issued |
Array
(
[id] => 7250332
[patent_doc_number] => 20040238955
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-02
[patent_title] => 'Semiconductor device and method of fabricating the same'
[patent_app_type] => new
[patent_app_number] => 10/878379
[patent_app_country] => US
[patent_app_date] => 2004-06-29
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[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 7621
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[pdf_file] => publications/A1/0238/20040238955.pdf
[firstpage_image] =>[orig_patent_app_number] => 10878379
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/878379 | Semiconductor device and method of fabricating the same | Jun 28, 2004 | Abandoned |
Array
(
[id] => 345457
[patent_doc_number] => 07498647
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-03
[patent_title] => 'Packaged microelectronic imagers and methods of packaging microelectronic imagers'
[patent_app_type] => utility
[patent_app_number] => 10/864974
[patent_app_country] => US
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[pdf_file] => patents/07/498/07498647.pdf
[firstpage_image] =>[orig_patent_app_number] => 10864974
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/864974 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Jun 9, 2004 | Issued |
Array
(
[id] => 7607186
[patent_doc_number] => 07098530
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-08-29
[patent_title] => 'Package for a high-frequency electronic device'
[patent_app_type] => utility
[patent_app_number] => 10/560004
[patent_app_country] => US
[patent_app_date] => 2004-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 7365
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/098/07098530.pdf
[firstpage_image] =>[orig_patent_app_number] => 10560004
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/560004 | Package for a high-frequency electronic device | Jun 7, 2004 | Issued |
Array
(
[id] => 7411894
[patent_doc_number] => 20040207073
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-21
[patent_title] => 'Electronic apparatus'
[patent_app_type] => new
[patent_app_number] => 10/844392
[patent_app_country] => US
[patent_app_date] => 2004-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 27
[patent_no_of_words] => 16893
[patent_no_of_claims] => 18
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0207/20040207073.pdf
[firstpage_image] =>[orig_patent_app_number] => 10844392
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/844392 | Electronic apparatus | May 12, 2004 | Issued |
Array
(
[id] => 683030
[patent_doc_number] => 07081665
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-25
[patent_title] => 'Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts'
[patent_app_type] => utility
[patent_app_number] => 10/841648
[patent_app_country] => US
[patent_app_date] => 2004-05-10
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[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/07/081/07081665.pdf
[firstpage_image] =>[orig_patent_app_number] => 10841648
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/841648 | Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts | May 9, 2004 | Issued |
Array
(
[id] => 591452
[patent_doc_number] => 07439613
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-21
[patent_title] => 'Substrate based unmolded package'
[patent_app_type] => utility
[patent_app_number] => 10/841656
[patent_app_country] => US
[patent_app_date] => 2004-05-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 6330
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/439/07439613.pdf
[firstpage_image] =>[orig_patent_app_number] => 10841656
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/841656 | Substrate based unmolded package | May 5, 2004 | Issued |
Array
(
[id] => 6915607
[patent_doc_number] => 20050093168
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-05
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/833043
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[patent_app_date] => 2004-04-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0093/20050093168.pdf
[firstpage_image] =>[orig_patent_app_number] => 10833043
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/833043 | Semiconductor device and method of manufacturing the same | Apr 27, 2004 | Issued |
Array
(
[id] => 734313
[patent_doc_number] => 07038313
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-05-02
[patent_title] => 'Semiconductor device and method of manufacturing the same'
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[pdf_file] => patents/07/038/07038313.pdf
[firstpage_image] =>[orig_patent_app_number] => 10832253
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/832253 | Semiconductor device and method of manufacturing the same | Apr 26, 2004 | Issued |
Array
(
[id] => 6923461
[patent_doc_number] => 20050236716
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-27
[patent_title] => 'Heat dissipation structure and method thereof'
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[patent_app_number] => 10/829583
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[firstpage_image] =>[orig_patent_app_number] => 10829583
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/829583 | Heat dissipation structure and method thereof | Apr 21, 2004 | Abandoned |
Array
(
[id] => 7291831
[patent_doc_number] => 20040212070
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-28
[patent_title] => 'Memory module having space-saving arrangement of memory chips and memory chip therefore'
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[firstpage_image] =>[orig_patent_app_number] => 10828034
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/828034 | Memory module having space-saving arrangement of memory chips and memory chip therefore | Apr 19, 2004 | Issued |
Array
(
[id] => 363881
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[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-01-27
[patent_title] => 'Light-emitting diode package structure'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/826003 | Light-emitting diode package structure | Apr 15, 2004 | Issued |
Array
(
[id] => 730155
[patent_doc_number] => 07042077
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[patent_kind] => B2
[patent_issue_date] => 2006-05-09
[patent_title] => 'Integrated circuit package with low modulus layer and capacitor/interposer'
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[pdf_file] => patents/07/042/07042077.pdf
[firstpage_image] =>[orig_patent_app_number] => 10825400
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/825400 | Integrated circuit package with low modulus layer and capacitor/interposer | Apr 14, 2004 | Issued |
Array
(
[id] => 681121
[patent_doc_number] => 07084491
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[patent_kind] => B2
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[patent_title] => 'Semiconductor device'
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[pdf_file] => patents/07/084/07084491.pdf
[firstpage_image] =>[orig_patent_app_number] => 10823734
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/823734 | Semiconductor device | Apr 13, 2004 | Issued |
Array
(
[id] => 4477374
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[patent_kind] => B2
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[patent_title] => 'Thermal dissipation in integrated circuit systems'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/820484 | Thermal dissipation in integrated circuit systems | Apr 7, 2004 | Issued |
Array
(
[id] => 7250328
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[firstpage_image] =>[orig_patent_app_number] => 10815664
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/815664 | Module component | Apr 1, 2004 | Abandoned |
Array
(
[id] => 817025
[patent_doc_number] => 07410833
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-12
[patent_title] => 'Interconnections for flip-chip using lead-free solders and having reaction barrier layers'
[patent_app_type] => utility
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/410/07410833.pdf
[firstpage_image] =>[orig_patent_app_number] => 10815103
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/815103 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Mar 30, 2004 | Issued |