Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7614964 [patent_doc_number] => 06897562 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-05-24 [patent_title] => 'Electronic component and method of manufacturing same' [patent_app_type] => utility [patent_app_number] => 10/411744 [patent_app_country] => US [patent_app_date] => 2003-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 6072 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/897/06897562.pdf [firstpage_image] =>[orig_patent_app_number] => 10411744 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/411744
Electronic component and method of manufacturing same Apr 10, 2003 Issued
Array ( [id] => 7334177 [patent_doc_number] => 20040188813 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-30 [patent_title] => 'Integrated circuit package with reduced stress on die and associated methods' [patent_app_type] => new [patent_app_number] => 10/403313 [patent_app_country] => US [patent_app_date] => 2003-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5216 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0188/20040188813.pdf [firstpage_image] =>[orig_patent_app_number] => 10403313 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/403313
Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems Mar 30, 2003 Issued
Array ( [id] => 519194 [patent_doc_number] => 07193237 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-03-20 [patent_title] => 'Organic semiconductor material and organic electronic device' [patent_app_type] => utility [patent_app_number] => 10/396512 [patent_app_country] => US [patent_app_date] => 2003-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 17849 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 18 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/193/07193237.pdf [firstpage_image] =>[orig_patent_app_number] => 10396512 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/396512
Organic semiconductor material and organic electronic device Mar 25, 2003 Issued
Array ( [id] => 6610565 [patent_doc_number] => 20030209713 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-11-13 [patent_title] => 'Semiconductor, electrooptic apparatus and electronic apparatus' [patent_app_type] => new [patent_app_number] => 10/395393 [patent_app_country] => US [patent_app_date] => 2003-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 9700 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 18 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0209/20030209713.pdf [firstpage_image] =>[orig_patent_app_number] => 10395393 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/395393
Semiconductor, electrooptic apparatus and electronic apparatus Mar 24, 2003 Abandoned
Array ( [id] => 6699461 [patent_doc_number] => 20030222341 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-04 [patent_title] => 'Systems and methods for cooling microelectronic devices using oscillatory devices' [patent_app_type] => new [patent_app_number] => 10/396133 [patent_app_country] => US [patent_app_date] => 2003-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 9480 [patent_no_of_claims] => 74 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20030222341.pdf [firstpage_image] =>[orig_patent_app_number] => 10396133 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/396133
Systems and methods for cooling microelectronic devices using oscillatory devices Mar 24, 2003 Abandoned
Array ( [id] => 7421209 [patent_doc_number] => 20040183179 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-23 [patent_title] => 'Package structure for a multi-chip integrated circuit' [patent_app_type] => new [patent_app_number] => 10/391783 [patent_app_country] => US [patent_app_date] => 2003-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1441 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20040183179.pdf [firstpage_image] =>[orig_patent_app_number] => 10391783 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/391783
Package structure for a multi-chip integrated circuit Mar 19, 2003 Abandoned
Array ( [id] => 1056951 [patent_doc_number] => 06856009 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-15 [patent_title] => 'Techniques for packaging multiple device components' [patent_app_type] => utility [patent_app_number] => 10/386254 [patent_app_country] => US [patent_app_date] => 2003-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 4343 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/856/06856009.pdf [firstpage_image] =>[orig_patent_app_number] => 10386254 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/386254
Techniques for packaging multiple device components Mar 10, 2003 Issued
Array ( [id] => 1281489 [patent_doc_number] => 06646349 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-11-11 [patent_title] => 'Ball grid array semiconductor package' [patent_app_type] => B1 [patent_app_number] => 10/376943 [patent_app_country] => US [patent_app_date] => 2003-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 4171 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 234 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/646/06646349.pdf [firstpage_image] =>[orig_patent_app_number] => 10376943 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/376943
Ball grid array semiconductor package Feb 27, 2003 Issued
Array ( [id] => 1063780 [patent_doc_number] => 06849951 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-02-01 [patent_title] => 'Bypass capacitor solution for integrated circuit dice' [patent_app_type] => utility [patent_app_number] => 10/377863 [patent_app_country] => US [patent_app_date] => 2003-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 4385 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/849/06849951.pdf [firstpage_image] =>[orig_patent_app_number] => 10377863 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/377863
Bypass capacitor solution for integrated circuit dice Feb 27, 2003 Issued
Array ( [id] => 578980 [patent_doc_number] => 07459771 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-12-02 [patent_title] => 'Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process' [patent_app_type] => utility [patent_app_number] => 10/369114 [patent_app_country] => US [patent_app_date] => 2003-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 3201 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/459/07459771.pdf [firstpage_image] =>[orig_patent_app_number] => 10369114 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/369114
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process Feb 17, 2003 Issued
Array ( [id] => 6758789 [patent_doc_number] => 20030122150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-03 [patent_title] => 'Fabricating a molecular electronic device having a protective barrier layer' [patent_app_type] => new [patent_app_number] => 10/365946 [patent_app_country] => US [patent_app_date] => 2003-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3497 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0122/20030122150.pdf [firstpage_image] =>[orig_patent_app_number] => 10365946 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/365946
Fabricating a molecular electronic device having a protective barrier layer Feb 11, 2003 Issued
Array ( [id] => 519998 [patent_doc_number] => 07193320 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-03-20 [patent_title] => 'Semiconductor device having a heat spreader exposed from a seal resin' [patent_app_type] => utility [patent_app_number] => 10/352074 [patent_app_country] => US [patent_app_date] => 2003-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 30 [patent_no_of_words] => 10727 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/193/07193320.pdf [firstpage_image] =>[orig_patent_app_number] => 10352074 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/352074
Semiconductor device having a heat spreader exposed from a seal resin Jan 27, 2003 Issued
Array ( [id] => 634560 [patent_doc_number] => 07129565 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-31 [patent_title] => 'Semiconductor device, method of manufacturing the same, and phase shift mask' [patent_app_type] => utility [patent_app_number] => 10/349934 [patent_app_country] => US [patent_app_date] => 2003-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 37 [patent_figures_cnt] => 53 [patent_no_of_words] => 15499 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/129/07129565.pdf [firstpage_image] =>[orig_patent_app_number] => 10349934 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/349934
Semiconductor device, method of manufacturing the same, and phase shift mask Jan 23, 2003 Issued
Array ( [id] => 930033 [patent_doc_number] => 06978534 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-12-27 [patent_title] => 'Device for pressure bonding an integrated circuit to a printed circuit board' [patent_app_type] => utility [patent_app_number] => 10/345484 [patent_app_country] => US [patent_app_date] => 2003-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 19 [patent_no_of_words] => 4197 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/978/06978534.pdf [firstpage_image] =>[orig_patent_app_number] => 10345484 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/345484
Device for pressure bonding an integrated circuit to a printed circuit board Jan 16, 2003 Issued
Array ( [id] => 1063581 [patent_doc_number] => 06849867 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-01 [patent_title] => 'Method of making radiation emitter devices' [patent_app_type] => utility [patent_app_number] => 10/338540 [patent_app_country] => US [patent_app_date] => 2003-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 11678 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/849/06849867.pdf [firstpage_image] =>[orig_patent_app_number] => 10338540 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/338540
Method of making radiation emitter devices Jan 7, 2003 Issued
Array ( [id] => 6681294 [patent_doc_number] => 20030117158 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-26 [patent_title] => 'Contact spring configuration for contacting a semiconductor wafer and method for producing a contact spring configuration' [patent_app_type] => new [patent_app_number] => 10/324874 [patent_app_country] => US [patent_app_date] => 2002-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7449 [patent_no_of_claims] => 46 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20030117158.pdf [firstpage_image] =>[orig_patent_app_number] => 10324874 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/324874
Contact spring configuration for contacting a semiconductor wafer and method for producing a contact spring configuration Dec 19, 2002 Issued
Array ( [id] => 7605017 [patent_doc_number] => 07115912 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-03 [patent_title] => 'Device for defeating reverse engineering of integrated circuits by optical means' [patent_app_type] => utility [patent_app_number] => 10/324963 [patent_app_country] => US [patent_app_date] => 2002-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 17 [patent_no_of_words] => 6857 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/115/07115912.pdf [firstpage_image] =>[orig_patent_app_number] => 10324963 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/324963
Device for defeating reverse engineering of integrated circuits by optical means Dec 19, 2002 Issued
Array ( [id] => 7457105 [patent_doc_number] => 20040119150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-24 [patent_title] => 'Multiple dice package' [patent_app_type] => new [patent_app_number] => 10/324533 [patent_app_country] => US [patent_app_date] => 2002-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1878 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0119/20040119150.pdf [firstpage_image] =>[orig_patent_app_number] => 10324533 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/324533
Multiple dice package Dec 18, 2002 Issued
Array ( [id] => 964006 [patent_doc_number] => 06949819 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-09-27 [patent_title] => 'Jumper chip component and mounting structure therefor' [patent_app_type] => utility [patent_app_number] => 10/322134 [patent_app_country] => US [patent_app_date] => 2002-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 4362 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/949/06949819.pdf [firstpage_image] =>[orig_patent_app_number] => 10322134 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/322134
Jumper chip component and mounting structure therefor Dec 16, 2002 Issued
Array ( [id] => 993589 [patent_doc_number] => 06916688 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-07-12 [patent_title] => 'Apparatus and method for a wafer level chip scale package heat sink' [patent_app_type] => utility [patent_app_number] => 10/313434 [patent_app_country] => US [patent_app_date] => 2002-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1649 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/916/06916688.pdf [firstpage_image] =>[orig_patent_app_number] => 10313434 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/313434
Apparatus and method for a wafer level chip scale package heat sink Dec 4, 2002 Issued
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