Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 7614964
[patent_doc_number] => 06897562
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-05-24
[patent_title] => 'Electronic component and method of manufacturing same'
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[patent_app_number] => 10/411744
[patent_app_country] => US
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[pdf_file] => patents/06/897/06897562.pdf
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Array
(
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[patent_issue_date] => 2004-09-30
[patent_title] => 'Integrated circuit package with reduced stress on die and associated methods'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/403313 | Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems | Mar 30, 2003 | Issued |
Array
(
[id] => 519194
[patent_doc_number] => 07193237
[patent_country] => US
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[patent_issue_date] => 2007-03-20
[patent_title] => 'Organic semiconductor material and organic electronic device'
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Array
(
[id] => 6610565
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[patent_kind] => A1
[patent_issue_date] => 2003-11-13
[patent_title] => 'Semiconductor, electrooptic apparatus and electronic apparatus'
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[patent_app_number] => 10/395393
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[patent_app_date] => 2003-03-25
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Array
(
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[patent_issue_date] => 2003-12-04
[patent_title] => 'Systems and methods for cooling microelectronic devices using oscillatory devices'
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Array
(
[id] => 7421209
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[patent_title] => 'Package structure for a multi-chip integrated circuit'
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Array
(
[id] => 1056951
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/386254 | Techniques for packaging multiple device components | Mar 10, 2003 | Issued |
Array
(
[id] => 1281489
[patent_doc_number] => 06646349
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[patent_kind] => B1
[patent_issue_date] => 2003-11-11
[patent_title] => 'Ball grid array semiconductor package'
[patent_app_type] => B1
[patent_app_number] => 10/376943
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/376943 | Ball grid array semiconductor package | Feb 27, 2003 | Issued |
Array
(
[id] => 1063780
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[patent_issue_date] => 2005-02-01
[patent_title] => 'Bypass capacitor solution for integrated circuit dice'
[patent_app_type] => utility
[patent_app_number] => 10/377863
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/377863 | Bypass capacitor solution for integrated circuit dice | Feb 27, 2003 | Issued |
Array
(
[id] => 578980
[patent_doc_number] => 07459771
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[patent_kind] => B2
[patent_issue_date] => 2008-12-02
[patent_title] => 'Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process'
[patent_app_type] => utility
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Array
(
[id] => 6758789
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Array
(
[id] => 519998
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Array
(
[id] => 634560
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/338540 | Method of making radiation emitter devices | Jan 7, 2003 | Issued |
Array
(
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Array
(
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[patent_title] => 'Device for defeating reverse engineering of integrated circuits by optical means'
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/313434 | Apparatus and method for a wafer level chip scale package heat sink | Dec 4, 2002 | Issued |