Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1086540 [patent_doc_number] => 06831355 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-12-14 [patent_title] => 'Flip-chip sub-assembly, methods of making same and device including same' [patent_app_type] => B2 [patent_app_number] => 10/309156 [patent_app_country] => US [patent_app_date] => 2002-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3618 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/831/06831355.pdf [firstpage_image] =>[orig_patent_app_number] => 10309156 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/309156
Flip-chip sub-assembly, methods of making same and device including same Dec 3, 2002 Issued
Array ( [id] => 6680950 [patent_doc_number] => 20030116814 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-26 [patent_title] => 'Photodiode' [patent_app_type] => new [patent_app_number] => 10/307278 [patent_app_country] => US [patent_app_date] => 2002-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 20981 [patent_no_of_claims] => 66 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0116/20030116814.pdf [firstpage_image] =>[orig_patent_app_number] => 10307278 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/307278
Photodiode Dec 1, 2002 Issued
Array ( [id] => 6671933 [patent_doc_number] => 20030057536 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-27 [patent_title] => 'Non-contact type IC card' [patent_app_type] => new [patent_app_number] => 10/285624 [patent_app_country] => US [patent_app_date] => 2002-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2191 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0057/20030057536.pdf [firstpage_image] =>[orig_patent_app_number] => 10285624 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/285624
Non-contact type IC card Oct 31, 2002 Abandoned
Array ( [id] => 700102 [patent_doc_number] => 07067840 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-06-27 [patent_title] => 'Method and device for reducing the contact resistance in organic field-effect transistors by embedding nanoparticles to produce field boosting' [patent_app_type] => utility [patent_app_number] => 10/283883 [patent_app_country] => US [patent_app_date] => 2002-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 8417 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/067/07067840.pdf [firstpage_image] =>[orig_patent_app_number] => 10283883 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/283883
Method and device for reducing the contact resistance in organic field-effect transistors by embedding nanoparticles to produce field boosting Oct 29, 2002 Issued
Array ( [id] => 7376280 [patent_doc_number] => 20040080917 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-04-29 [patent_title] => 'Integrated microwave package and the process for making the same' [patent_app_type] => new [patent_app_number] => 10/278424 [patent_app_country] => US [patent_app_date] => 2002-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 9040 [patent_no_of_claims] => 51 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0080/20040080917.pdf [firstpage_image] =>[orig_patent_app_number] => 10278424 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/278424
Integrated microwave package and the process for making the same Oct 22, 2002 Abandoned
Array ( [id] => 7616706 [patent_doc_number] => 06946736 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-09-20 [patent_title] => 'Electrical device including dielectric layer formed by direct patterning process' [patent_app_type] => utility [patent_app_number] => 10/279304 [patent_app_country] => US [patent_app_date] => 2002-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4207 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/946/06946736.pdf [firstpage_image] =>[orig_patent_app_number] => 10279304 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/279304
Electrical device including dielectric layer formed by direct patterning process Oct 22, 2002 Issued
Array ( [id] => 6837229 [patent_doc_number] => 20030034569 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-20 [patent_title] => 'Electronic package and method of forming' [patent_app_type] => new [patent_app_number] => 10/273786 [patent_app_country] => US [patent_app_date] => 2002-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5380 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0034/20030034569.pdf [firstpage_image] =>[orig_patent_app_number] => 10273786 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/273786
Electronic package and method of forming Oct 17, 2002 Issued
Array ( [id] => 6651644 [patent_doc_number] => 20030131476 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Heat conduits and terminal radiator for microcircuit packaging and manufacturing process' [patent_app_type] => new [patent_app_number] => 10/259994 [patent_app_country] => US [patent_app_date] => 2002-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6313 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0131/20030131476.pdf [firstpage_image] =>[orig_patent_app_number] => 10259994 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/259994
Heat conduits and terminal radiator for microcircuit packaging and manufacturing process Sep 25, 2002 Abandoned
Array ( [id] => 6699472 [patent_doc_number] => 20030222352 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-04 [patent_title] => 'Under-bump metallugical structure' [patent_app_type] => new [patent_app_number] => 10/065103 [patent_app_country] => US [patent_app_date] => 2002-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5244 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20030222352.pdf [firstpage_image] =>[orig_patent_app_number] => 10065103 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/065103
Under-bump metallugical structure Sep 16, 2002 Abandoned
Array ( [id] => 6816112 [patent_doc_number] => 20030067070 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-04-10 [patent_title] => 'Semiconductor package' [patent_app_type] => new [patent_app_number] => 10/245228 [patent_app_country] => US [patent_app_date] => 2002-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3466 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0067/20030067070.pdf [firstpage_image] =>[orig_patent_app_number] => 10245228 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/245228
Semiconductor package Sep 15, 2002 Issued
Array ( [id] => 1144853 [patent_doc_number] => 06777788 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-08-17 [patent_title] => 'Method and structure for applying thick solder layer onto die attach pad' [patent_app_type] => B1 [patent_app_number] => 10/241363 [patent_app_country] => US [patent_app_date] => 2002-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 19 [patent_no_of_words] => 5027 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/777/06777788.pdf [firstpage_image] =>[orig_patent_app_number] => 10241363 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/241363
Method and structure for applying thick solder layer onto die attach pad Sep 9, 2002 Issued
Array ( [id] => 7130220 [patent_doc_number] => 20040041249 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-04 [patent_title] => 'STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY' [patent_app_type] => new [patent_app_number] => 10/232729 [patent_app_country] => US [patent_app_date] => 2002-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1619 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 268 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0041/20040041249.pdf [firstpage_image] =>[orig_patent_app_number] => 10232729 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/232729
Stacked chip package with enhanced thermal conductivity Sep 2, 2002 Issued
Array ( [id] => 6748088 [patent_doc_number] => 20030042608 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-06 [patent_title] => 'Bonding pad for optical semiconductor device and fabrication method thereof' [patent_app_type] => new [patent_app_number] => 10/234734 [patent_app_country] => US [patent_app_date] => 2002-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2906 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20030042608.pdf [firstpage_image] =>[orig_patent_app_number] => 10234734 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/234734
Bonding pad for optical semiconductor device and fabrication method thereof Sep 2, 2002 Issued
Array ( [id] => 7130213 [patent_doc_number] => 20040041242 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-04 [patent_title] => 'Substrate based unmolded package including lead frame structure and semiconductor die' [patent_app_type] => new [patent_app_number] => 10/233248 [patent_app_country] => US [patent_app_date] => 2002-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4515 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0041/20040041242.pdf [firstpage_image] =>[orig_patent_app_number] => 10233248 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/233248
Substrate based unmolded package including lead frame structure and semiconductor die Aug 29, 2002 Issued
Array ( [id] => 7130231 [patent_doc_number] => 20040041260 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-04 [patent_title] => 'Semiconductor component with backside contacts and method of fabrication' [patent_app_type] => new [patent_app_number] => 10/232549 [patent_app_country] => US [patent_app_date] => 2002-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6629 [patent_no_of_claims] => 63 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0041/20040041260.pdf [firstpage_image] =>[orig_patent_app_number] => 10232549 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/232549
Semiconductor component having backside pin contacts Aug 28, 2002 Issued
Array ( [id] => 658080 [patent_doc_number] => 07105383 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-09-12 [patent_title] => 'Packaged semiconductor with coated leads and method therefore' [patent_app_type] => utility [patent_app_number] => 10/230743 [patent_app_country] => US [patent_app_date] => 2002-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 1593 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/105/07105383.pdf [firstpage_image] =>[orig_patent_app_number] => 10230743 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/230743
Packaged semiconductor with coated leads and method therefore Aug 28, 2002 Issued
Array ( [id] => 7130236 [patent_doc_number] => 20040041265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-04 [patent_title] => 'Localized biasing for silicon on insulator structures' [patent_app_type] => new [patent_app_number] => 10/230938 [patent_app_country] => US [patent_app_date] => 2002-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7265 [patent_no_of_claims] => 85 [patent_no_of_ind_claims] => 14 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0041/20040041265.pdf [firstpage_image] =>[orig_patent_app_number] => 10230938 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/230938
Localized biasing for silicon on insulator structures Aug 28, 2002 Issued
Array ( [id] => 1037884 [patent_doc_number] => 06873036 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-29 [patent_title] => 'Die stacking scheme' [patent_app_type] => utility [patent_app_number] => 10/229968 [patent_app_country] => US [patent_app_date] => 2002-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 5673 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/873/06873036.pdf [firstpage_image] =>[orig_patent_app_number] => 10229968 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/229968
Die stacking scheme Aug 27, 2002 Issued
Array ( [id] => 6776732 [patent_doc_number] => 20030047812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-13 [patent_title] => 'Thin film aluminum alloy and sputtering target to form the same' [patent_app_type] => new [patent_app_number] => 10/228064 [patent_app_country] => US [patent_app_date] => 2002-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4171 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 11 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20030047812.pdf [firstpage_image] =>[orig_patent_app_number] => 10228064 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/228064
Thin film aluminum alloy and sputtering target to form the same Aug 26, 2002 Issued
Array ( [id] => 6748091 [patent_doc_number] => 20030042611 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-06 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/227189 [patent_app_country] => US [patent_app_date] => 2002-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4483 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 19 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20030042611.pdf [firstpage_image] =>[orig_patent_app_number] => 10227189 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/227189
Semiconductor device and method for manufacturing the same Aug 22, 2002 Issued
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