Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 1086540
[patent_doc_number] => 06831355
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-12-14
[patent_title] => 'Flip-chip sub-assembly, methods of making same and device including same'
[patent_app_type] => B2
[patent_app_number] => 10/309156
[patent_app_country] => US
[patent_app_date] => 2002-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 3618
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/831/06831355.pdf
[firstpage_image] =>[orig_patent_app_number] => 10309156
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/309156 | Flip-chip sub-assembly, methods of making same and device including same | Dec 3, 2002 | Issued |
Array
(
[id] => 6680950
[patent_doc_number] => 20030116814
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-26
[patent_title] => 'Photodiode'
[patent_app_type] => new
[patent_app_number] => 10/307278
[patent_app_country] => US
[patent_app_date] => 2002-12-02
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0116/20030116814.pdf
[firstpage_image] =>[orig_patent_app_number] => 10307278
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/307278 | Photodiode | Dec 1, 2002 | Issued |
Array
(
[id] => 6671933
[patent_doc_number] => 20030057536
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-27
[patent_title] => 'Non-contact type IC card'
[patent_app_type] => new
[patent_app_number] => 10/285624
[patent_app_country] => US
[patent_app_date] => 2002-11-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2191
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[pdf_file] => publications/A1/0057/20030057536.pdf
[firstpage_image] =>[orig_patent_app_number] => 10285624
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/285624 | Non-contact type IC card | Oct 31, 2002 | Abandoned |
Array
(
[id] => 700102
[patent_doc_number] => 07067840
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-06-27
[patent_title] => 'Method and device for reducing the contact resistance in organic field-effect transistors by embedding nanoparticles to produce field boosting'
[patent_app_type] => utility
[patent_app_number] => 10/283883
[patent_app_country] => US
[patent_app_date] => 2002-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 8417
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/067/07067840.pdf
[firstpage_image] =>[orig_patent_app_number] => 10283883
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/283883 | Method and device for reducing the contact resistance in organic field-effect transistors by embedding nanoparticles to produce field boosting | Oct 29, 2002 | Issued |
Array
(
[id] => 7376280
[patent_doc_number] => 20040080917
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-29
[patent_title] => 'Integrated microwave package and the process for making the same'
[patent_app_type] => new
[patent_app_number] => 10/278424
[patent_app_country] => US
[patent_app_date] => 2002-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 9040
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[pdf_file] => publications/A1/0080/20040080917.pdf
[firstpage_image] =>[orig_patent_app_number] => 10278424
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/278424 | Integrated microwave package and the process for making the same | Oct 22, 2002 | Abandoned |
Array
(
[id] => 7616706
[patent_doc_number] => 06946736
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-09-20
[patent_title] => 'Electrical device including dielectric layer formed by direct patterning process'
[patent_app_type] => utility
[patent_app_number] => 10/279304
[patent_app_country] => US
[patent_app_date] => 2002-10-23
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[pdf_file] => patents/06/946/06946736.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/279304 | Electrical device including dielectric layer formed by direct patterning process | Oct 22, 2002 | Issued |
Array
(
[id] => 6837229
[patent_doc_number] => 20030034569
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-20
[patent_title] => 'Electronic package and method of forming'
[patent_app_type] => new
[patent_app_number] => 10/273786
[patent_app_country] => US
[patent_app_date] => 2002-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_claims] => 31
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0034/20030034569.pdf
[firstpage_image] =>[orig_patent_app_number] => 10273786
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/273786 | Electronic package and method of forming | Oct 17, 2002 | Issued |
Array
(
[id] => 6651644
[patent_doc_number] => 20030131476
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-17
[patent_title] => 'Heat conduits and terminal radiator for microcircuit packaging and manufacturing process'
[patent_app_type] => new
[patent_app_number] => 10/259994
[patent_app_country] => US
[patent_app_date] => 2002-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 6313
[patent_no_of_claims] => 23
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0131/20030131476.pdf
[firstpage_image] =>[orig_patent_app_number] => 10259994
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/259994 | Heat conduits and terminal radiator for microcircuit packaging and manufacturing process | Sep 25, 2002 | Abandoned |
Array
(
[id] => 6699472
[patent_doc_number] => 20030222352
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-12-04
[patent_title] => 'Under-bump metallugical structure'
[patent_app_type] => new
[patent_app_number] => 10/065103
[patent_app_country] => US
[patent_app_date] => 2002-09-17
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0222/20030222352.pdf
[firstpage_image] =>[orig_patent_app_number] => 10065103
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/065103 | Under-bump metallugical structure | Sep 16, 2002 | Abandoned |
Array
(
[id] => 6816112
[patent_doc_number] => 20030067070
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-04-10
[patent_title] => 'Semiconductor package'
[patent_app_type] => new
[patent_app_number] => 10/245228
[patent_app_country] => US
[patent_app_date] => 2002-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0067/20030067070.pdf
[firstpage_image] =>[orig_patent_app_number] => 10245228
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/245228 | Semiconductor package | Sep 15, 2002 | Issued |
Array
(
[id] => 1144853
[patent_doc_number] => 06777788
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-08-17
[patent_title] => 'Method and structure for applying thick solder layer onto die attach pad'
[patent_app_type] => B1
[patent_app_number] => 10/241363
[patent_app_country] => US
[patent_app_date] => 2002-09-10
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/777/06777788.pdf
[firstpage_image] =>[orig_patent_app_number] => 10241363
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/241363 | Method and structure for applying thick solder layer onto die attach pad | Sep 9, 2002 | Issued |
Array
(
[id] => 7130220
[patent_doc_number] => 20040041249
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-03-04
[patent_title] => 'STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY'
[patent_app_type] => new
[patent_app_number] => 10/232729
[patent_app_country] => US
[patent_app_date] => 2002-09-03
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 10232729
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/232729 | Stacked chip package with enhanced thermal conductivity | Sep 2, 2002 | Issued |
Array
(
[id] => 6748088
[patent_doc_number] => 20030042608
[patent_country] => US
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[patent_issue_date] => 2003-03-06
[patent_title] => 'Bonding pad for optical semiconductor device and fabrication method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/234734 | Bonding pad for optical semiconductor device and fabrication method thereof | Sep 2, 2002 | Issued |
Array
(
[id] => 7130213
[patent_doc_number] => 20040041242
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[patent_kind] => A1
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[patent_title] => 'Substrate based unmolded package including lead frame structure and semiconductor die'
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[patent_app_number] => 10/233248
[patent_app_country] => US
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Array
(
[id] => 7130231
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[patent_title] => 'Semiconductor component with backside contacts and method of fabrication'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/232549 | Semiconductor component having backside pin contacts | Aug 28, 2002 | Issued |
Array
(
[id] => 658080
[patent_doc_number] => 07105383
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[patent_kind] => B2
[patent_issue_date] => 2006-09-12
[patent_title] => 'Packaged semiconductor with coated leads and method therefore'
[patent_app_type] => utility
[patent_app_number] => 10/230743
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/230743 | Packaged semiconductor with coated leads and method therefore | Aug 28, 2002 | Issued |
Array
(
[id] => 7130236
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[patent_title] => 'Localized biasing for silicon on insulator structures'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/230938 | Localized biasing for silicon on insulator structures | Aug 28, 2002 | Issued |
Array
(
[id] => 1037884
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[patent_title] => 'Die stacking scheme'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/229968 | Die stacking scheme | Aug 27, 2002 | Issued |
Array
(
[id] => 6776732
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[patent_title] => 'Thin film aluminum alloy and sputtering target to form the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/228064 | Thin film aluminum alloy and sputtering target to form the same | Aug 26, 2002 | Issued |
Array
(
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[pdf_file] => publications/A1/0042/20030042611.pdf
[firstpage_image] =>[orig_patent_app_number] => 10227189
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/227189 | Semiconductor device and method for manufacturing the same | Aug 22, 2002 | Issued |