Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6733442 [patent_doc_number] => 20030011077 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-16 [patent_title] => 'Sealing resin for flip-flop mounting' [patent_app_type] => new [patent_app_number] => 10/204523 [patent_app_country] => US [patent_app_date] => 2002-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2746 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0011/20030011077.pdf [firstpage_image] =>[orig_patent_app_number] => 10204523 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/204523
Sealing resin for flip-flop mounting Aug 20, 2002 Abandoned
Array ( [id] => 1022597 [patent_doc_number] => 06888245 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-05-03 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/222814 [patent_app_country] => US [patent_app_date] => 2002-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 24 [patent_no_of_words] => 6104 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/888/06888245.pdf [firstpage_image] =>[orig_patent_app_number] => 10222814 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/222814
Semiconductor device Aug 18, 2002 Issued
Array ( [id] => 6690913 [patent_doc_number] => 20030038345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-27 [patent_title] => 'IC package substrate with over voltage protection function' [patent_app_type] => new [patent_app_number] => 10/219514 [patent_app_country] => US [patent_app_date] => 2002-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1528 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20030038345.pdf [firstpage_image] =>[orig_patent_app_number] => 10219514 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/219514
IC package substrate with over voltage protection function Aug 14, 2002 Issued
Array ( [id] => 6755846 [patent_doc_number] => 20030003623 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-02 [patent_title] => 'Electronic component mounted on a flat substrate and padded with a fluid filler' [patent_app_type] => new [patent_app_number] => 10/219515 [patent_app_country] => US [patent_app_date] => 2002-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1667 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20030003623.pdf [firstpage_image] =>[orig_patent_app_number] => 10219515 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/219515
Electronic component mounted on a flat substrate and padded with a fluid filler Aug 14, 2002 Issued
Array ( [id] => 6854209 [patent_doc_number] => 20030127710 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-10 [patent_title] => 'Low-loss coplanar waveguides and method of fabrication' [patent_app_type] => new [patent_app_number] => 10/206205 [patent_app_country] => US [patent_app_date] => 2002-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3034 [patent_no_of_claims] => 91 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20030127710.pdf [firstpage_image] =>[orig_patent_app_number] => 10206205 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/206205
Low-loss coplanar waveguides and method of fabrication Jul 28, 2002 Issued
Array ( [id] => 7348442 [patent_doc_number] => 20040012092 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-22 [patent_title] => 'Apparatus and method for reducing interference between signal lines' [patent_app_type] => new [patent_app_number] => 10/200093 [patent_app_country] => US [patent_app_date] => 2002-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1703 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20040012092.pdf [firstpage_image] =>[orig_patent_app_number] => 10200093 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/200093
Apparatus and method for reducing interference between signal lines Jul 18, 2002 Abandoned
Array ( [id] => 1120910 [patent_doc_number] => 06798051 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-28 [patent_title] => 'Connection of packaged integrated memory chips to a printed circuit board' [patent_app_type] => B2 [patent_app_number] => 10/197793 [patent_app_country] => US [patent_app_date] => 2002-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4332 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/798/06798051.pdf [firstpage_image] =>[orig_patent_app_number] => 10197793 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/197793
Connection of packaged integrated memory chips to a printed circuit board Jul 17, 2002 Issued
Array ( [id] => 1241557 [patent_doc_number] => 06683380 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-01-27 [patent_title] => 'Integrated circuit with bonding layer over active circuitry' [patent_app_type] => B2 [patent_app_number] => 10/191453 [patent_app_country] => US [patent_app_date] => 2002-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 3596 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/683/06683380.pdf [firstpage_image] =>[orig_patent_app_number] => 10191453 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/191453
Integrated circuit with bonding layer over active circuitry Jul 9, 2002 Issued
Array ( [id] => 7427750 [patent_doc_number] => 20040007780 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-15 [patent_title] => 'Particle-filled semiconductor attachment material' [patent_app_type] => new [patent_app_number] => 10/192004 [patent_app_country] => US [patent_app_date] => 2002-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2138 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20040007780.pdf [firstpage_image] =>[orig_patent_app_number] => 10192004 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/192004
Particle-filled semiconductor attachment material Jul 8, 2002 Abandoned
Array ( [id] => 1169877 [patent_doc_number] => 06756671 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-06-29 [patent_title] => 'Microelectronic device with a redistribution layer having a step shaped portion and method of making the same' [patent_app_type] => B2 [patent_app_number] => 10/190274 [patent_app_country] => US [patent_app_date] => 2002-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 5653 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/756/06756671.pdf [firstpage_image] =>[orig_patent_app_number] => 10190274 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/190274
Microelectronic device with a redistribution layer having a step shaped portion and method of making the same Jul 4, 2002 Issued
Array ( [id] => 6635888 [patent_doc_number] => 20030006498 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-09 [patent_title] => 'Semiconductor integrated circuit device, mounting board, and device and board assembly' [patent_app_type] => new [patent_app_number] => 10/188083 [patent_app_country] => US [patent_app_date] => 2002-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6102 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20030006498.pdf [firstpage_image] =>[orig_patent_app_number] => 10188083 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/188083
Semiconductor integrated circuit device, mounting board, and device and board assembly Jul 2, 2002 Issued
Array ( [id] => 7420428 [patent_doc_number] => 20040000579 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-01 [patent_title] => 'Forming contact arrays on substrates' [patent_app_type] => new [patent_app_number] => 10/186774 [patent_app_country] => US [patent_app_date] => 2002-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2437 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20040000579.pdf [firstpage_image] =>[orig_patent_app_number] => 10186774 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/186774
Forming contact arrays on substrates Jun 30, 2002 Abandoned
Array ( [id] => 1034466 [patent_doc_number] => 06875675 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-04-05 [patent_title] => 'Method for manufacturing a semiconductor film having a planarized surface' [patent_app_type] => utility [patent_app_number] => 10/186354 [patent_app_country] => US [patent_app_date] => 2002-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 4590 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/875/06875675.pdf [firstpage_image] =>[orig_patent_app_number] => 10186354 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/186354
Method for manufacturing a semiconductor film having a planarized surface Jun 27, 2002 Issued
Array ( [id] => 1107771 [patent_doc_number] => 06809030 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-10-26 [patent_title] => 'Method and structure for controlling the interface roughness of cobalt disilicide' [patent_app_type] => B2 [patent_app_number] => 10/185547 [patent_app_country] => US [patent_app_date] => 2002-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 5237 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/809/06809030.pdf [firstpage_image] =>[orig_patent_app_number] => 10185547 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/185547
Method and structure for controlling the interface roughness of cobalt disilicide Jun 27, 2002 Issued
Array ( [id] => 7421239 [patent_doc_number] => 20040000709 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-01 [patent_title] => 'Internal package interconnect with electrically parallel vias' [patent_app_type] => new [patent_app_number] => 10/183274 [patent_app_country] => US [patent_app_date] => 2002-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1958 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20040000709.pdf [firstpage_image] =>[orig_patent_app_number] => 10183274 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/183274
Internal package interconnect with electrically parallel vias Jun 25, 2002 Abandoned
Array ( [id] => 6823656 [patent_doc_number] => 20030234277 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-25 [patent_title] => 'Microelectronic device interconnects' [patent_app_type] => new [patent_app_number] => 10/183874 [patent_app_country] => US [patent_app_date] => 2002-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2531 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0234/20030234277.pdf [firstpage_image] =>[orig_patent_app_number] => 10183874 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/183874
Microelectronic device interconnects Jun 24, 2002 Issued
Array ( [id] => 1159885 [patent_doc_number] => 06762504 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-07-13 [patent_title] => 'Release films and adhesive films using the release films' [patent_app_type] => B1 [patent_app_number] => 10/172383 [patent_app_country] => US [patent_app_date] => 2002-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 17 [patent_no_of_words] => 6301 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/762/06762504.pdf [firstpage_image] =>[orig_patent_app_number] => 10172383 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/172383
Release films and adhesive films using the release films Jun 13, 2002 Issued
Array ( [id] => 1277084 [patent_doc_number] => 06650015 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-11-18 [patent_title] => 'Cavity-down ball grid array package with semiconductor chip solder ball' [patent_app_type] => B2 [patent_app_number] => 10/173213 [patent_app_country] => US [patent_app_date] => 2002-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3089 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/650/06650015.pdf [firstpage_image] =>[orig_patent_app_number] => 10173213 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/173213
Cavity-down ball grid array package with semiconductor chip solder ball Jun 13, 2002 Issued
Array ( [id] => 996892 [patent_doc_number] => 06914334 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-07-05 [patent_title] => 'Circuit board with trace configuration for high-speed digital differential signaling' [patent_app_type] => utility [patent_app_number] => 10/167904 [patent_app_country] => US [patent_app_date] => 2002-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 3367 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/914/06914334.pdf [firstpage_image] =>[orig_patent_app_number] => 10167904 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/167904
Circuit board with trace configuration for high-speed digital differential signaling Jun 11, 2002 Issued
Array ( [id] => 6753471 [patent_doc_number] => 20030001247 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-02 [patent_title] => 'High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing' [patent_app_type] => new [patent_app_number] => 10/170854 [patent_app_country] => US [patent_app_date] => 2002-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1310 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20030001247.pdf [firstpage_image] =>[orig_patent_app_number] => 10170854 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/170854
High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing Jun 11, 2002 Issued
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