Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1097468 [patent_doc_number] => 06822316 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-11-23 [patent_title] => 'Integrated circuit with improved interconnect structure and process for making same' [patent_app_type] => B1 [patent_app_number] => 10/167118 [patent_app_country] => US [patent_app_date] => 2002-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 25 [patent_no_of_words] => 6213 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/822/06822316.pdf [firstpage_image] =>[orig_patent_app_number] => 10167118 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/167118
Integrated circuit with improved interconnect structure and process for making same Jun 10, 2002 Issued
Array ( [id] => 6260684 [patent_doc_number] => 20020187630 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-12 [patent_title] => 'Semiconductor device with self-aligned contact and method for manufacturing the device' [patent_app_type] => new [patent_app_number] => 10/166963 [patent_app_country] => US [patent_app_date] => 2002-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2790 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0187/20020187630.pdf [firstpage_image] =>[orig_patent_app_number] => 10166963 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/166963
Semiconductor device with self-aligned contact and method for manufacturing the device Jun 10, 2002 Issued
Array ( [id] => 6686432 [patent_doc_number] => 20030030155 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-13 [patent_title] => 'Resin component for encapsulating semiconductor and semiconductor device using it' [patent_app_type] => new [patent_app_number] => 10/165394 [patent_app_country] => US [patent_app_date] => 2002-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5522 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0030/20030030155.pdf [firstpage_image] =>[orig_patent_app_number] => 10165394 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/165394
Resin component for encapsulating semiconductor and semiconductor device using it Jun 6, 2002 Issued
Array ( [id] => 1093865 [patent_doc_number] => 06825503 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-30 [patent_title] => 'Lens cap for semiconductor laser package' [patent_app_type] => B2 [patent_app_number] => 10/165743 [patent_app_country] => US [patent_app_date] => 2002-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 1360 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/825/06825503.pdf [firstpage_image] =>[orig_patent_app_number] => 10165743 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/165743
Lens cap for semiconductor laser package Jun 5, 2002 Issued
Array ( [id] => 6820075 [patent_doc_number] => 20030218236 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-11-27 [patent_title] => 'Chip carrier tape' [patent_app_type] => new [patent_app_number] => 10/155684 [patent_app_country] => US [patent_app_date] => 2002-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4526 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0218/20030218236.pdf [firstpage_image] =>[orig_patent_app_number] => 10155684 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/155684
Chip carrier tape May 23, 2002 Abandoned
Array ( [id] => 6820098 [patent_doc_number] => 20030218259 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-11-27 [patent_title] => 'Bond pad support structure for a semiconductor device' [patent_app_type] => new [patent_app_number] => 10/153163 [patent_app_country] => US [patent_app_date] => 2002-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2919 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0218/20030218259.pdf [firstpage_image] =>[orig_patent_app_number] => 10153163 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/153163
Bond pad support structure for a semiconductor device May 20, 2002 Abandoned
Array ( [id] => 1180500 [patent_doc_number] => 06744135 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-06-01 [patent_title] => 'Electronic apparatus' [patent_app_type] => B2 [patent_app_number] => 10/147073 [patent_app_country] => US [patent_app_date] => 2002-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 46 [patent_no_of_words] => 16591 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 30 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/744/06744135.pdf [firstpage_image] =>[orig_patent_app_number] => 10147073 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/147073
Electronic apparatus May 16, 2002 Issued
Array ( [id] => 6536213 [patent_doc_number] => 20020163067 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-07 [patent_title] => 'Three-dimensionally embodied circuit with electrically connected semiconductor chips' [patent_app_type] => new [patent_app_number] => 10/146583 [patent_app_country] => US [patent_app_date] => 2002-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2358 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0163/20020163067.pdf [firstpage_image] =>[orig_patent_app_number] => 10146583 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/146583
Three-dimensionally embodied circuit with electrically connected semiconductor chips May 14, 2002 Issued
Array ( [id] => 6254582 [patent_doc_number] => 20020185715 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-12 [patent_title] => 'Stress isolating die attach structure and method' [patent_app_type] => new [patent_app_number] => 10/146454 [patent_app_country] => US [patent_app_date] => 2002-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2137 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0185/20020185715.pdf [firstpage_image] =>[orig_patent_app_number] => 10146454 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/146454
Stress isolating die attach structure and method May 13, 2002 Issued
Array ( [id] => 6494542 [patent_doc_number] => 20020190357 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-19 [patent_title] => 'Semiconductor circuit device and process for manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/143984 [patent_app_country] => US [patent_app_date] => 2002-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2973 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0190/20020190357.pdf [firstpage_image] =>[orig_patent_app_number] => 10143984 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/143984
Semiconductor circuit device and process for manufacturing the same May 13, 2002 Abandoned
Array ( [id] => 1136737 [patent_doc_number] => 06784546 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-31 [patent_title] => 'Electrode structure and method of fabricating the same' [patent_app_type] => B2 [patent_app_number] => 10/133743 [patent_app_country] => US [patent_app_date] => 2002-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 4017 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/784/06784546.pdf [firstpage_image] =>[orig_patent_app_number] => 10133743 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/133743
Electrode structure and method of fabricating the same Apr 28, 2002 Issued
Array ( [id] => 1169979 [patent_doc_number] => 06756683 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-06-29 [patent_title] => 'High-frequency semiconductor device including a semiconductor chip' [patent_app_type] => B2 [patent_app_number] => 10/122514 [patent_app_country] => US [patent_app_date] => 2002-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3133 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/756/06756683.pdf [firstpage_image] =>[orig_patent_app_number] => 10122514 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/122514
High-frequency semiconductor device including a semiconductor chip Apr 14, 2002 Issued
Array ( [id] => 5757820 [patent_doc_number] => 20060208765 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'High frequency integrated circuit (hfic) microsystems assembly and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/472795 [patent_app_country] => US [patent_app_date] => 2002-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 5308 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 17 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0208/20060208765.pdf [firstpage_image] =>[orig_patent_app_number] => 10472795 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/472795
High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same Apr 7, 2002 Issued
Array ( [id] => 6012409 [patent_doc_number] => 20020100986 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-01 [patent_title] => 'Electronic device' [patent_app_type] => new [patent_app_number] => 10/104826 [patent_app_country] => US [patent_app_date] => 2002-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 16667 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0100/20020100986.pdf [firstpage_image] =>[orig_patent_app_number] => 10104826 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/104826
Semiconductor device with lead-free solder Mar 21, 2002 Issued
Array ( [id] => 738972 [patent_doc_number] => 07034386 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-25 [patent_title] => 'Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same' [patent_app_type] => utility [patent_app_number] => 10/100974 [patent_app_country] => US [patent_app_date] => 2002-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2259 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/034/07034386.pdf [firstpage_image] =>[orig_patent_app_number] => 10100974 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/100974
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same Mar 18, 2002 Issued
Array ( [id] => 6427591 [patent_doc_number] => 20020175396 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-28 [patent_title] => 'Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same' [patent_app_type] => new [patent_app_number] => 10/099193 [patent_app_country] => US [patent_app_date] => 2002-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 6689 [patent_no_of_claims] => 44 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0175/20020175396.pdf [firstpage_image] =>[orig_patent_app_number] => 10099193 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/099193
Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same Mar 12, 2002 Abandoned
Array ( [id] => 6431496 [patent_doc_number] => 20020127486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Shot configuration measuring mark and transfer error detection method using the same' [patent_app_type] => new [patent_app_number] => 10/090883 [patent_app_country] => US [patent_app_date] => 2002-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4438 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20020127486.pdf [firstpage_image] =>[orig_patent_app_number] => 10090883 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/090883
Shot configuration measuring mark and transfer error detection method using the same Mar 4, 2002 Abandoned
Array ( [id] => 6832770 [patent_doc_number] => 20030160315 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-28 [patent_title] => 'Method for processing multiple semiconductor devices for test' [patent_app_type] => new [patent_app_number] => 10/085694 [patent_app_country] => US [patent_app_date] => 2002-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2859 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20030160315.pdf [firstpage_image] =>[orig_patent_app_number] => 10085694 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/085694
Method for processing multiple semiconductor devices for test Feb 27, 2002 Issued
Array ( [id] => 1125327 [patent_doc_number] => 06794749 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-21 [patent_title] => 'Chip package with grease heat sink' [patent_app_type] => B2 [patent_app_number] => 10/083034 [patent_app_country] => US [patent_app_date] => 2002-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4568 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/794/06794749.pdf [firstpage_image] =>[orig_patent_app_number] => 10083034 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/083034
Chip package with grease heat sink Feb 25, 2002 Issued
Array ( [id] => 5840216 [patent_doc_number] => 20020130331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-19 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/083673 [patent_app_country] => US [patent_app_date] => 2002-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 12357 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0130/20020130331.pdf [firstpage_image] =>[orig_patent_app_number] => 10083673 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/083673
Semiconductor device and method of manufacturing the same Feb 24, 2002 Issued
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