Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 1097468
[patent_doc_number] => 06822316
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-11-23
[patent_title] => 'Integrated circuit with improved interconnect structure and process for making same'
[patent_app_type] => B1
[patent_app_number] => 10/167118
[patent_app_country] => US
[patent_app_date] => 2002-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 25
[patent_no_of_words] => 6213
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 25
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/822/06822316.pdf
[firstpage_image] =>[orig_patent_app_number] => 10167118
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/167118 | Integrated circuit with improved interconnect structure and process for making same | Jun 10, 2002 | Issued |
Array
(
[id] => 6260684
[patent_doc_number] => 20020187630
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-12
[patent_title] => 'Semiconductor device with self-aligned contact and method for manufacturing the device'
[patent_app_type] => new
[patent_app_number] => 10/166963
[patent_app_country] => US
[patent_app_date] => 2002-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2790
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0187/20020187630.pdf
[firstpage_image] =>[orig_patent_app_number] => 10166963
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/166963 | Semiconductor device with self-aligned contact and method for manufacturing the device | Jun 10, 2002 | Issued |
Array
(
[id] => 6686432
[patent_doc_number] => 20030030155
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-13
[patent_title] => 'Resin component for encapsulating semiconductor and semiconductor device using it'
[patent_app_type] => new
[patent_app_number] => 10/165394
[patent_app_country] => US
[patent_app_date] => 2002-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 5522
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 66
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0030/20030030155.pdf
[firstpage_image] =>[orig_patent_app_number] => 10165394
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/165394 | Resin component for encapsulating semiconductor and semiconductor device using it | Jun 6, 2002 | Issued |
Array
(
[id] => 1093865
[patent_doc_number] => 06825503
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-30
[patent_title] => 'Lens cap for semiconductor laser package'
[patent_app_type] => B2
[patent_app_number] => 10/165743
[patent_app_country] => US
[patent_app_date] => 2002-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 1360
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/825/06825503.pdf
[firstpage_image] =>[orig_patent_app_number] => 10165743
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/165743 | Lens cap for semiconductor laser package | Jun 5, 2002 | Issued |
Array
(
[id] => 6820075
[patent_doc_number] => 20030218236
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-11-27
[patent_title] => 'Chip carrier tape'
[patent_app_type] => new
[patent_app_number] => 10/155684
[patent_app_country] => US
[patent_app_date] => 2002-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4526
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0218/20030218236.pdf
[firstpage_image] =>[orig_patent_app_number] => 10155684
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/155684 | Chip carrier tape | May 23, 2002 | Abandoned |
Array
(
[id] => 6820098
[patent_doc_number] => 20030218259
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-11-27
[patent_title] => 'Bond pad support structure for a semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/153163
[patent_app_country] => US
[patent_app_date] => 2002-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2919
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0218/20030218259.pdf
[firstpage_image] =>[orig_patent_app_number] => 10153163
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/153163 | Bond pad support structure for a semiconductor device | May 20, 2002 | Abandoned |
Array
(
[id] => 1180500
[patent_doc_number] => 06744135
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-06-01
[patent_title] => 'Electronic apparatus'
[patent_app_type] => B2
[patent_app_number] => 10/147073
[patent_app_country] => US
[patent_app_date] => 2002-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 46
[patent_no_of_words] => 16591
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 30
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/744/06744135.pdf
[firstpage_image] =>[orig_patent_app_number] => 10147073
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/147073 | Electronic apparatus | May 16, 2002 | Issued |
Array
(
[id] => 6536213
[patent_doc_number] => 20020163067
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-11-07
[patent_title] => 'Three-dimensionally embodied circuit with electrically connected semiconductor chips'
[patent_app_type] => new
[patent_app_number] => 10/146583
[patent_app_country] => US
[patent_app_date] => 2002-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2358
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0163/20020163067.pdf
[firstpage_image] =>[orig_patent_app_number] => 10146583
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/146583 | Three-dimensionally embodied circuit with electrically connected semiconductor chips | May 14, 2002 | Issued |
Array
(
[id] => 6254582
[patent_doc_number] => 20020185715
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-12
[patent_title] => 'Stress isolating die attach structure and method'
[patent_app_type] => new
[patent_app_number] => 10/146454
[patent_app_country] => US
[patent_app_date] => 2002-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2137
[patent_no_of_claims] => 5
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0185/20020185715.pdf
[firstpage_image] =>[orig_patent_app_number] => 10146454
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/146454 | Stress isolating die attach structure and method | May 13, 2002 | Issued |
Array
(
[id] => 6494542
[patent_doc_number] => 20020190357
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-19
[patent_title] => 'Semiconductor circuit device and process for manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/143984
[patent_app_country] => US
[patent_app_date] => 2002-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2973
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 70
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0190/20020190357.pdf
[firstpage_image] =>[orig_patent_app_number] => 10143984
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/143984 | Semiconductor circuit device and process for manufacturing the same | May 13, 2002 | Abandoned |
Array
(
[id] => 1136737
[patent_doc_number] => 06784546
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-08-31
[patent_title] => 'Electrode structure and method of fabricating the same'
[patent_app_type] => B2
[patent_app_number] => 10/133743
[patent_app_country] => US
[patent_app_date] => 2002-04-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4017
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[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/784/06784546.pdf
[firstpage_image] =>[orig_patent_app_number] => 10133743
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/133743 | Electrode structure and method of fabricating the same | Apr 28, 2002 | Issued |
Array
(
[id] => 1169979
[patent_doc_number] => 06756683
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-06-29
[patent_title] => 'High-frequency semiconductor device including a semiconductor chip'
[patent_app_type] => B2
[patent_app_number] => 10/122514
[patent_app_country] => US
[patent_app_date] => 2002-04-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/756/06756683.pdf
[firstpage_image] =>[orig_patent_app_number] => 10122514
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/122514 | High-frequency semiconductor device including a semiconductor chip | Apr 14, 2002 | Issued |
Array
(
[id] => 5757820
[patent_doc_number] => 20060208765
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-21
[patent_title] => 'High frequency integrated circuit (hfic) microsystems assembly and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/472795
[patent_app_country] => US
[patent_app_date] => 2002-04-08
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0208/20060208765.pdf
[firstpage_image] =>[orig_patent_app_number] => 10472795
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/472795 | High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same | Apr 7, 2002 | Issued |
Array
(
[id] => 6012409
[patent_doc_number] => 20020100986
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-01
[patent_title] => 'Electronic device'
[patent_app_type] => new
[patent_app_number] => 10/104826
[patent_app_country] => US
[patent_app_date] => 2002-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0100/20020100986.pdf
[firstpage_image] =>[orig_patent_app_number] => 10104826
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/104826 | Semiconductor device with lead-free solder | Mar 21, 2002 | Issued |
Array
(
[id] => 738972
[patent_doc_number] => 07034386
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-25
[patent_title] => 'Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same'
[patent_app_type] => utility
[patent_app_number] => 10/100974
[patent_app_country] => US
[patent_app_date] => 2002-03-19
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/034/07034386.pdf
[firstpage_image] =>[orig_patent_app_number] => 10100974
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/100974 | Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same | Mar 18, 2002 | Issued |
Array
(
[id] => 6427591
[patent_doc_number] => 20020175396
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-11-28
[patent_title] => 'Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same'
[patent_app_type] => new
[patent_app_number] => 10/099193
[patent_app_country] => US
[patent_app_date] => 2002-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0175/20020175396.pdf
[firstpage_image] =>[orig_patent_app_number] => 10099193
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/099193 | Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same | Mar 12, 2002 | Abandoned |
Array
(
[id] => 6431496
[patent_doc_number] => 20020127486
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-12
[patent_title] => 'Shot configuration measuring mark and transfer error detection method using the same'
[patent_app_type] => new
[patent_app_number] => 10/090883
[patent_app_country] => US
[patent_app_date] => 2002-03-05
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0127/20020127486.pdf
[firstpage_image] =>[orig_patent_app_number] => 10090883
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/090883 | Shot configuration measuring mark and transfer error detection method using the same | Mar 4, 2002 | Abandoned |
Array
(
[id] => 6832770
[patent_doc_number] => 20030160315
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-28
[patent_title] => 'Method for processing multiple semiconductor devices for test'
[patent_app_type] => new
[patent_app_number] => 10/085694
[patent_app_country] => US
[patent_app_date] => 2002-02-28
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[pdf_file] => publications/A1/0160/20030160315.pdf
[firstpage_image] =>[orig_patent_app_number] => 10085694
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/085694 | Method for processing multiple semiconductor devices for test | Feb 27, 2002 | Issued |
Array
(
[id] => 1125327
[patent_doc_number] => 06794749
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-09-21
[patent_title] => 'Chip package with grease heat sink'
[patent_app_type] => B2
[patent_app_number] => 10/083034
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/794/06794749.pdf
[firstpage_image] =>[orig_patent_app_number] => 10083034
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/083034 | Chip package with grease heat sink | Feb 25, 2002 | Issued |
Array
(
[id] => 5840216
[patent_doc_number] => 20020130331
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-19
[patent_title] => 'Semiconductor device and method of manufacturing the same'
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[patent_app_number] => 10/083673
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[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0130/20020130331.pdf
[firstpage_image] =>[orig_patent_app_number] => 10083673
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/083673 | Semiconductor device and method of manufacturing the same | Feb 24, 2002 | Issued |