Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5870698
[patent_doc_number] => 20020047200
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-04-25
[patent_title] => 'Low profile optically-sensitive semiconductor package'
[patent_app_type] => new
[patent_app_number] => 09/837804
[patent_app_country] => US
[patent_app_date] => 2001-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
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[patent_words_short_claim] => 260
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0047/20020047200.pdf
[firstpage_image] =>[orig_patent_app_number] => 09837804
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/837804 | Low profile optically-sensitive semiconductor package | Apr 17, 2001 | Issued |
Array
(
[id] => 6445067
[patent_doc_number] => 20020149108
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-17
[patent_title] => 'Low-loss coplanar waveguides and method of fabrication'
[patent_app_type] => new
[patent_app_number] => 09/835643
[patent_app_country] => US
[patent_app_date] => 2001-04-17
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0149/20020149108.pdf
[firstpage_image] =>[orig_patent_app_number] => 09835643
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/835643 | Method of forming low-loss coplanar waveguides | Apr 16, 2001 | Issued |
Array
(
[id] => 1420373
[patent_doc_number] => 06521916
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-02-18
[patent_title] => 'Radiation emitter device having an encapsulant with different zones of thermal conductivity'
[patent_app_type] => B2
[patent_app_number] => 09/835278
[patent_app_country] => US
[patent_app_date] => 2001-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/06/521/06521916.pdf
[firstpage_image] =>[orig_patent_app_number] => 09835278
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/835278 | Radiation emitter device having an encapsulant with different zones of thermal conductivity | Apr 12, 2001 | Issued |
Array
(
[id] => 6690946
[patent_doc_number] => 20030038378
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-27
[patent_title] => 'Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein'
[patent_app_type] => new
[patent_app_number] => 09/834014
[patent_app_country] => US
[patent_app_date] => 2001-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 9276
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[pdf_file] => publications/A1/0038/20030038378.pdf
[firstpage_image] =>[orig_patent_app_number] => 09834014
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/834014 | Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein | Apr 11, 2001 | Abandoned |
Array
(
[id] => 7090951
[patent_doc_number] => 20010033009
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-10-25
[patent_title] => 'Display driver module and mounting structure therefor'
[patent_app_type] => new
[patent_app_number] => 09/826930
[patent_app_country] => US
[patent_app_date] => 2001-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => publications/A1/0033/20010033009.pdf
[firstpage_image] =>[orig_patent_app_number] => 09826930
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/826930 | Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis | Apr 5, 2001 | Issued |
Array
(
[id] => 6153934
[patent_doc_number] => 20020145192
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-10
[patent_title] => 'Heat-resisting high-power diode'
[patent_app_type] => new
[patent_app_number] => 09/827144
[patent_app_country] => US
[patent_app_date] => 2001-04-06
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[pdf_file] => publications/A1/0145/20020145192.pdf
[firstpage_image] =>[orig_patent_app_number] => 09827144
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/827144 | Heat-resisting high-power diode | Apr 5, 2001 | Abandoned |
Array
(
[id] => 6153981
[patent_doc_number] => 20020145203
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-10
[patent_title] => 'Method and structure for economical high density chip carrier'
[patent_app_type] => new
[patent_app_number] => 09/827014
[patent_app_country] => US
[patent_app_date] => 2001-04-05
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[patent_drawing_sheets_cnt] => 9
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[pdf_file] => publications/A1/0145/20020145203.pdf
[firstpage_image] =>[orig_patent_app_number] => 09827014
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/827014 | Economical high density chip carrier | Apr 4, 2001 | Issued |
Array
(
[id] => 5885875
[patent_doc_number] => 20020011661
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-31
[patent_title] => 'Push-in type semiconductor device including heat spreader'
[patent_app_type] => new
[patent_app_number] => 09/824001
[patent_app_country] => US
[patent_app_date] => 2001-04-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 5869
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[pdf_file] => publications/A1/0011/20020011661.pdf
[firstpage_image] =>[orig_patent_app_number] => 09824001
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/824001 | Push-in type semiconductor device including heat spreader | Apr 2, 2001 | Abandoned |
Array
(
[id] => 5901089
[patent_doc_number] => 20020140070
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-03
[patent_title] => 'Packaging system for die-up connection of a die-down oriented integrated circuit'
[patent_app_type] => new
[patent_app_number] => 09/823600
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[patent_app_date] => 2001-03-30
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[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0140/20020140070.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/823600 | Packaging system for die-up connection of a die-down oriented integrated circuit | Mar 29, 2001 | Issued |
Array
(
[id] => 5901100
[patent_doc_number] => 20020140081
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-03
[patent_title] => 'Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices'
[patent_app_type] => new
[patent_app_number] => 09/823844
[patent_app_country] => US
[patent_app_date] => 2001-03-30
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/823844 | Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices | Mar 29, 2001 | Abandoned |
Array
(
[id] => 5901168
[patent_doc_number] => 20020140112
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-03
[patent_title] => 'Insulated bond wire assembly process technology for integrated circuits'
[patent_app_type] => new
[patent_app_number] => 09/822944
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/822944 | Insulated bond wire assembly for integrated circuits | Mar 29, 2001 | Issued |
Array
(
[id] => 5901169
[patent_doc_number] => 20020140113
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[patent_issue_date] => 2002-10-03
[patent_title] => 'ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME'
[patent_app_type] => new
[patent_app_number] => 09/817264
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/817264 | Encapsulated semiconductor die package | Mar 26, 2001 | Issued |
Array
(
[id] => 613167
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[patent_issue_date] => 2006-12-12
[patent_title] => 'Method and structure for an organic package with improved BGA life'
[patent_app_type] => utility
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Array
(
[id] => 1393445
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[patent_title] => 'Fabricating a molecular electronic device having a protective barrier layer'
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Array
(
[id] => 6881682
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[patent_title] => 'Three commonly housed diverse semiconductor dice'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/812464 | Three commonly housed diverse semiconductor dice | Mar 19, 2001 | Issued |
Array
(
[id] => 6506932
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[patent_issue_date] => 2002-09-26
[patent_title] => 'ELECTRONIC PACKAGE WITH SURFACE-MOUNTABLE DEVICE BUILT THEREIN'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/811394 | Electronic package with surface-mountable device built therein | Mar 19, 2001 | Issued |
Array
(
[id] => 1128473
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[patent_title] => 'Heat radiating semiconductor device'
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Array
(
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/763573 | Mounting structure for semiconductor device having entirely flat leads | Feb 25, 2001 | Issued |