Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5870698 [patent_doc_number] => 20020047200 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-25 [patent_title] => 'Low profile optically-sensitive semiconductor package' [patent_app_type] => new [patent_app_number] => 09/837804 [patent_app_country] => US [patent_app_date] => 2001-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3361 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 260 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20020047200.pdf [firstpage_image] =>[orig_patent_app_number] => 09837804 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/837804
Low profile optically-sensitive semiconductor package Apr 17, 2001 Issued
Array ( [id] => 6445067 [patent_doc_number] => 20020149108 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-17 [patent_title] => 'Low-loss coplanar waveguides and method of fabrication' [patent_app_type] => new [patent_app_number] => 09/835643 [patent_app_country] => US [patent_app_date] => 2001-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3053 [patent_no_of_claims] => 91 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0149/20020149108.pdf [firstpage_image] =>[orig_patent_app_number] => 09835643 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/835643
Method of forming low-loss coplanar waveguides Apr 16, 2001 Issued
Array ( [id] => 1420373 [patent_doc_number] => 06521916 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-18 [patent_title] => 'Radiation emitter device having an encapsulant with different zones of thermal conductivity' [patent_app_type] => B2 [patent_app_number] => 09/835278 [patent_app_country] => US [patent_app_date] => 2001-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 11617 [patent_no_of_claims] => 72 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/521/06521916.pdf [firstpage_image] =>[orig_patent_app_number] => 09835278 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/835278
Radiation emitter device having an encapsulant with different zones of thermal conductivity Apr 12, 2001 Issued
Array ( [id] => 6690946 [patent_doc_number] => 20030038378 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-27 [patent_title] => 'Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein' [patent_app_type] => new [patent_app_number] => 09/834014 [patent_app_country] => US [patent_app_date] => 2001-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 9276 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20030038378.pdf [firstpage_image] =>[orig_patent_app_number] => 09834014 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/834014
Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein Apr 11, 2001 Abandoned
Array ( [id] => 7090951 [patent_doc_number] => 20010033009 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-25 [patent_title] => 'Display driver module and mounting structure therefor' [patent_app_type] => new [patent_app_number] => 09/826930 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5982 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0033/20010033009.pdf [firstpage_image] =>[orig_patent_app_number] => 09826930 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/826930
Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis Apr 5, 2001 Issued
Array ( [id] => 6153934 [patent_doc_number] => 20020145192 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-10 [patent_title] => 'Heat-resisting high-power diode' [patent_app_type] => new [patent_app_number] => 09/827144 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1140 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20020145192.pdf [firstpage_image] =>[orig_patent_app_number] => 09827144 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/827144
Heat-resisting high-power diode Apr 5, 2001 Abandoned
Array ( [id] => 6153981 [patent_doc_number] => 20020145203 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-10 [patent_title] => 'Method and structure for economical high density chip carrier' [patent_app_type] => new [patent_app_number] => 09/827014 [patent_app_country] => US [patent_app_date] => 2001-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5934 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20020145203.pdf [firstpage_image] =>[orig_patent_app_number] => 09827014 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/827014
Economical high density chip carrier Apr 4, 2001 Issued
Array ( [id] => 5885875 [patent_doc_number] => 20020011661 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-31 [patent_title] => 'Push-in type semiconductor device including heat spreader' [patent_app_type] => new [patent_app_number] => 09/824001 [patent_app_country] => US [patent_app_date] => 2001-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5869 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0011/20020011661.pdf [firstpage_image] =>[orig_patent_app_number] => 09824001 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/824001
Push-in type semiconductor device including heat spreader Apr 2, 2001 Abandoned
Array ( [id] => 5901089 [patent_doc_number] => 20020140070 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Packaging system for die-up connection of a die-down oriented integrated circuit' [patent_app_type] => new [patent_app_number] => 09/823600 [patent_app_country] => US [patent_app_date] => 2001-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2252 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140070.pdf [firstpage_image] =>[orig_patent_app_number] => 09823600 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/823600
Packaging system for die-up connection of a die-down oriented integrated circuit Mar 29, 2001 Issued
Array ( [id] => 5901100 [patent_doc_number] => 20020140081 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices' [patent_app_type] => new [patent_app_number] => 09/823844 [patent_app_country] => US [patent_app_date] => 2001-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4856 [patent_no_of_claims] => 56 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140081.pdf [firstpage_image] =>[orig_patent_app_number] => 09823844 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/823844
Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices Mar 29, 2001 Abandoned
Array ( [id] => 5901168 [patent_doc_number] => 20020140112 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Insulated bond wire assembly process technology for integrated circuits' [patent_app_type] => new [patent_app_number] => 09/822944 [patent_app_country] => US [patent_app_date] => 2001-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2760 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140112.pdf [firstpage_image] =>[orig_patent_app_number] => 09822944 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/822944
Insulated bond wire assembly for integrated circuits Mar 29, 2001 Issued
Array ( [id] => 5901169 [patent_doc_number] => 20020140113 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME' [patent_app_type] => new [patent_app_number] => 09/817264 [patent_app_country] => US [patent_app_date] => 2001-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1422 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140113.pdf [firstpage_image] =>[orig_patent_app_number] => 09817264 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/817264
Encapsulated semiconductor die package Mar 26, 2001 Issued
Array ( [id] => 613167 [patent_doc_number] => 07148566 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-12 [patent_title] => 'Method and structure for an organic package with improved BGA life' [patent_app_type] => utility [patent_app_number] => 09/817843 [patent_app_country] => US [patent_app_date] => 2001-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 3552 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/148/07148566.pdf [firstpage_image] =>[orig_patent_app_number] => 09817843 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/817843
Method and structure for an organic package with improved BGA life Mar 25, 2001 Issued
Array ( [id] => 1393445 [patent_doc_number] => 06541309 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-04-01 [patent_title] => 'Fabricating a molecular electronic device having a protective barrier layer' [patent_app_type] => B2 [patent_app_number] => 09/815844 [patent_app_country] => US [patent_app_date] => 2001-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 3466 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/541/06541309.pdf [firstpage_image] =>[orig_patent_app_number] => 09815844 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/815844
Fabricating a molecular electronic device having a protective barrier layer Mar 20, 2001 Issued
Array ( [id] => 6881682 [patent_doc_number] => 20010048154 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-06 [patent_title] => 'Three commonly housed diverse semiconductor dice' [patent_app_type] => new [patent_app_number] => 09/812464 [patent_app_country] => US [patent_app_date] => 2001-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2346 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0048/20010048154.pdf [firstpage_image] =>[orig_patent_app_number] => 09812464 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/812464
Three commonly housed diverse semiconductor dice Mar 19, 2001 Issued
Array ( [id] => 6506932 [patent_doc_number] => 20020135049 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-26 [patent_title] => 'ELECTRONIC PACKAGE WITH SURFACE-MOUNTABLE DEVICE BUILT THEREIN' [patent_app_type] => new [patent_app_number] => 09/811394 [patent_app_country] => US [patent_app_date] => 2001-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2853 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0135/20020135049.pdf [firstpage_image] =>[orig_patent_app_number] => 09811394 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/811394
Electronic package with surface-mountable device built therein Mar 19, 2001 Issued
Array ( [id] => 1128473 [patent_doc_number] => 06791199 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-14 [patent_title] => 'Heat radiating semiconductor device' [patent_app_type] => B2 [patent_app_number] => 09/810104 [patent_app_country] => US [patent_app_date] => 2001-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 17 [patent_no_of_words] => 4909 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 17 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/791/06791199.pdf [firstpage_image] =>[orig_patent_app_number] => 09810104 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/810104
Heat radiating semiconductor device Mar 15, 2001 Issued
Array ( [id] => 6888539 [patent_doc_number] => 20010023994 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-09-27 [patent_title] => 'Semiconductor device and the method for manufacturing the same' [patent_app_type] => new [patent_app_number] => 09/799803 [patent_app_country] => US [patent_app_date] => 2001-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4506 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20010023994.pdf [firstpage_image] =>[orig_patent_app_number] => 09799803 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/799803
Semiconductor device and the method for manufacturing the same Mar 6, 2001 Abandoned
Array ( [id] => 1347557 [patent_doc_number] => 06586842 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-01 [patent_title] => 'Dual damascene integration scheme for preventing copper contamination of dielectric layer' [patent_app_type] => B1 [patent_app_number] => 09/793993 [patent_app_country] => US [patent_app_date] => 2001-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 27 [patent_no_of_words] => 6980 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/586/06586842.pdf [firstpage_image] =>[orig_patent_app_number] => 09793993 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/793993
Dual damascene integration scheme for preventing copper contamination of dielectric layer Feb 27, 2001 Issued
Array ( [id] => 1207169 [patent_doc_number] => 06717256 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-04-06 [patent_title] => 'Mounting structure for semiconductor device having entirely flat leads' [patent_app_type] => B1 [patent_app_number] => 09/763573 [patent_app_country] => US [patent_app_date] => 2001-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 22 [patent_no_of_words] => 6052 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 284 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/717/06717256.pdf [firstpage_image] =>[orig_patent_app_number] => 09763573 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/763573
Mounting structure for semiconductor device having entirely flat leads Feb 25, 2001 Issued
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