Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6895231 [patent_doc_number] => 20010026021 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-04 [patent_title] => 'Flip-chip type semiconductor device and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 09/789864 [patent_app_country] => US [patent_app_date] => 2001-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 6440 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0026/20010026021.pdf [firstpage_image] =>[orig_patent_app_number] => 09789864 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/789864
Recyclable flip-chip semiconductor device Feb 20, 2001 Issued
Array ( [id] => 6893120 [patent_doc_number] => 20010015486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-23 [patent_title] => 'Semicondutor device with resin package' [patent_app_type] => new [patent_app_number] => 09/783984 [patent_app_country] => US [patent_app_date] => 2001-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1669 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0015/20010015486.pdf [firstpage_image] =>[orig_patent_app_number] => 09783984 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/783984
Semiconductor device with resin package Feb 15, 2001 Issued
Array ( [id] => 1060196 [patent_doc_number] => 06853070 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-08 [patent_title] => 'Die-down ball grid array package with die-attached heat spreader and method for making the same' [patent_app_type] => utility [patent_app_number] => 09/783034 [patent_app_country] => US [patent_app_date] => 2001-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 12 [patent_no_of_words] => 6323 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 13 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/853/06853070.pdf [firstpage_image] =>[orig_patent_app_number] => 09783034 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/783034
Die-down ball grid array package with die-attached heat spreader and method for making the same Feb 14, 2001 Issued
Array ( [id] => 5918080 [patent_doc_number] => 20020113300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-22 [patent_title] => 'System and method for suppressing RF resonance in a semiconductor package' [patent_app_type] => new [patent_app_number] => 09/781994 [patent_app_country] => US [patent_app_date] => 2001-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2024 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20020113300.pdf [firstpage_image] =>[orig_patent_app_number] => 09781994 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/781994
System and method for suppressing RF resonance in a semiconductor package Feb 13, 2001 Abandoned
Array ( [id] => 1384914 [patent_doc_number] => 06559535 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-05-06 [patent_title] => 'Lead structure for sealing package' [patent_app_type] => B2 [patent_app_number] => 09/781423 [patent_app_country] => US [patent_app_date] => 2001-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3368 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/559/06559535.pdf [firstpage_image] =>[orig_patent_app_number] => 09781423 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/781423
Lead structure for sealing package Feb 12, 2001 Issued
Array ( [id] => 1183298 [patent_doc_number] => 06737754 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-18 [patent_title] => 'COF packaged semiconductor' [patent_app_type] => B2 [patent_app_number] => 09/777833 [patent_app_country] => US [patent_app_date] => 2001-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2643 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/737/06737754.pdf [firstpage_image] =>[orig_patent_app_number] => 09777833 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/777833
COF packaged semiconductor Feb 4, 2001 Issued
Array ( [id] => 6961393 [patent_doc_number] => 20010012690 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-09 [patent_title] => 'Optimized metal etch process to enable the use of aluminum plugs' [patent_app_type] => new [patent_app_number] => 09/775370 [patent_app_country] => US [patent_app_date] => 2001-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4889 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20010012690.pdf [firstpage_image] =>[orig_patent_app_number] => 09775370 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/775370
Optimized metal etch process to enable the use of aluminum plugs Jan 31, 2001 Abandoned
Array ( [id] => 1452186 [patent_doc_number] => 06455889 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-09-24 [patent_title] => 'Semiconductor memory device having memory cells each having a conductive body of booster plate and a method for manufacturing the same' [patent_app_type] => B2 [patent_app_number] => 09/756803 [patent_app_country] => US [patent_app_date] => 2001-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 32 [patent_no_of_words] => 9586 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/455/06455889.pdf [firstpage_image] =>[orig_patent_app_number] => 09756803 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/756803
Semiconductor memory device having memory cells each having a conductive body of booster plate and a method for manufacturing the same Jan 9, 2001 Issued
Array ( [id] => 461356 [patent_doc_number] => 07242088 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-10 [patent_title] => 'IC package pressure release apparatus and method' [patent_app_type] => utility [patent_app_number] => 09/751214 [patent_app_country] => US [patent_app_date] => 2000-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3237 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/242/07242088.pdf [firstpage_image] =>[orig_patent_app_number] => 09751214 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/751214
IC package pressure release apparatus and method Dec 28, 2000 Issued
Array ( [id] => 1421514 [patent_doc_number] => 06522020 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-18 [patent_title] => 'Wafer-level package' [patent_app_type] => B2 [patent_app_number] => 09/735640 [patent_app_country] => US [patent_app_date] => 2000-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 2801 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/522/06522020.pdf [firstpage_image] =>[orig_patent_app_number] => 09735640 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/735640
Wafer-level package Dec 13, 2000 Issued
Array ( [id] => 1063796 [patent_doc_number] => 06849957 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-01 [patent_title] => 'Photomask including auxiliary mark area, semiconductor device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 09/725853 [patent_app_country] => US [patent_app_date] => 2000-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 50 [patent_no_of_words] => 11804 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/849/06849957.pdf [firstpage_image] =>[orig_patent_app_number] => 09725853 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/725853
Photomask including auxiliary mark area, semiconductor device and manufacturing method thereof Nov 29, 2000 Issued
Array ( [id] => 1396369 [patent_doc_number] => 06548894 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-04-15 [patent_title] => 'Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication' [patent_app_type] => B2 [patent_app_number] => 09/726909 [patent_app_country] => US [patent_app_date] => 2000-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3436 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/548/06548894.pdf [firstpage_image] =>[orig_patent_app_number] => 09726909 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/726909
Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication Nov 29, 2000 Issued
Array ( [id] => 6883995 [patent_doc_number] => 20010038150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-08 [patent_title] => 'Semiconductor device manufactured by package group molding and dicing method' [patent_app_type] => new [patent_app_number] => 09/726980 [patent_app_country] => US [patent_app_date] => 2000-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 6907 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20010038150.pdf [firstpage_image] =>[orig_patent_app_number] => 09726980 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/726980
Semiconductor device manufactured by package group molding and dicing method Nov 29, 2000 Abandoned
Array ( [id] => 1580208 [patent_doc_number] => 06448599 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-10 [patent_title] => 'Semiconductor device for preventing process-induced charging damages' [patent_app_type] => B1 [patent_app_number] => 09/725070 [patent_app_country] => US [patent_app_date] => 2000-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3032 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/448/06448599.pdf [firstpage_image] =>[orig_patent_app_number] => 09725070 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/725070
Semiconductor device for preventing process-induced charging damages Nov 28, 2000 Issued
Array ( [id] => 1387223 [patent_doc_number] => 06555911 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-04-29 [patent_title] => 'Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios' [patent_app_type] => B1 [patent_app_number] => 09/716464 [patent_app_country] => US [patent_app_date] => 2000-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 57 [patent_no_of_words] => 3869 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/555/06555911.pdf [firstpage_image] =>[orig_patent_app_number] => 09716464 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/716464
Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios Nov 20, 2000 Issued
09/714944 SEMICONDUCTOR DEVICE WITH ETCH ROUGHENED BUMPS FOR BONDING SEMICONDUCTOR CHIP TO LEADS Nov 19, 2000 Abandoned
Array ( [id] => 1246606 [patent_doc_number] => 06677619 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-01-13 [patent_title] => 'Nitride semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/714143 [patent_app_country] => US [patent_app_date] => 2000-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 42049 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/677/06677619.pdf [firstpage_image] =>[orig_patent_app_number] => 09714143 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/714143
Nitride semiconductor device Nov 16, 2000 Issued
09/715454 High Quality printed inductor on a package Nov 16, 2000 Abandoned
Array ( [id] => 1476446 [patent_doc_number] => 06388339 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-14 [patent_title] => 'Sealed-by-resin type semiconductor device and liquid crystal display module including the same' [patent_app_type] => B1 [patent_app_number] => 09/697599 [patent_app_country] => US [patent_app_date] => 2000-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3637 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/388/06388339.pdf [firstpage_image] =>[orig_patent_app_number] => 09697599 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/697599
Sealed-by-resin type semiconductor device and liquid crystal display module including the same Oct 26, 2000 Issued
Array ( [id] => 1468594 [patent_doc_number] => 06459145 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-01 [patent_title] => 'Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor' [patent_app_type] => B1 [patent_app_number] => 09/695403 [patent_app_country] => US [patent_app_date] => 2000-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 22 [patent_no_of_words] => 8150 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/459/06459145.pdf [firstpage_image] =>[orig_patent_app_number] => 09695403 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/695403
Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor Oct 24, 2000 Issued
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