Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 6895231
[patent_doc_number] => 20010026021
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-10-04
[patent_title] => 'Flip-chip type semiconductor device and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 09/789864
[patent_app_country] => US
[patent_app_date] => 2001-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 6440
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0026/20010026021.pdf
[firstpage_image] =>[orig_patent_app_number] => 09789864
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/789864 | Recyclable flip-chip semiconductor device | Feb 20, 2001 | Issued |
Array
(
[id] => 6893120
[patent_doc_number] => 20010015486
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-08-23
[patent_title] => 'Semicondutor device with resin package'
[patent_app_type] => new
[patent_app_number] => 09/783984
[patent_app_country] => US
[patent_app_date] => 2001-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1669
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0015/20010015486.pdf
[firstpage_image] =>[orig_patent_app_number] => 09783984
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/783984 | Semiconductor device with resin package | Feb 15, 2001 | Issued |
Array
(
[id] => 1060196
[patent_doc_number] => 06853070
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-02-08
[patent_title] => 'Die-down ball grid array package with die-attached heat spreader and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 09/783034
[patent_app_country] => US
[patent_app_date] => 2001-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 12
[patent_no_of_words] => 6323
[patent_no_of_claims] => 50
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 13
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/853/06853070.pdf
[firstpage_image] =>[orig_patent_app_number] => 09783034
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/783034 | Die-down ball grid array package with die-attached heat spreader and method for making the same | Feb 14, 2001 | Issued |
Array
(
[id] => 5918080
[patent_doc_number] => 20020113300
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-22
[patent_title] => 'System and method for suppressing RF resonance in a semiconductor package'
[patent_app_type] => new
[patent_app_number] => 09/781994
[patent_app_country] => US
[patent_app_date] => 2001-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2024
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 40
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0113/20020113300.pdf
[firstpage_image] =>[orig_patent_app_number] => 09781994
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/781994 | System and method for suppressing RF resonance in a semiconductor package | Feb 13, 2001 | Abandoned |
Array
(
[id] => 1384914
[patent_doc_number] => 06559535
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-05-06
[patent_title] => 'Lead structure for sealing package'
[patent_app_type] => B2
[patent_app_number] => 09/781423
[patent_app_country] => US
[patent_app_date] => 2001-02-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 8
[patent_no_of_words] => 3368
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 194
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/559/06559535.pdf
[firstpage_image] =>[orig_patent_app_number] => 09781423
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/781423 | Lead structure for sealing package | Feb 12, 2001 | Issued |
Array
(
[id] => 1183298
[patent_doc_number] => 06737754
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-05-18
[patent_title] => 'COF packaged semiconductor'
[patent_app_type] => B2
[patent_app_number] => 09/777833
[patent_app_country] => US
[patent_app_date] => 2001-02-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2643
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 217
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/737/06737754.pdf
[firstpage_image] =>[orig_patent_app_number] => 09777833
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/777833 | COF packaged semiconductor | Feb 4, 2001 | Issued |
Array
(
[id] => 6961393
[patent_doc_number] => 20010012690
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-08-09
[patent_title] => 'Optimized metal etch process to enable the use of aluminum plugs'
[patent_app_type] => new
[patent_app_number] => 09/775370
[patent_app_country] => US
[patent_app_date] => 2001-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4889
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 124
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20010012690.pdf
[firstpage_image] =>[orig_patent_app_number] => 09775370
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/775370 | Optimized metal etch process to enable the use of aluminum plugs | Jan 31, 2001 | Abandoned |
Array
(
[id] => 1452186
[patent_doc_number] => 06455889
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-09-24
[patent_title] => 'Semiconductor memory device having memory cells each having a conductive body of booster plate and a method for manufacturing the same'
[patent_app_type] => B2
[patent_app_number] => 09/756803
[patent_app_country] => US
[patent_app_date] => 2001-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 32
[patent_no_of_words] => 9586
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/455/06455889.pdf
[firstpage_image] =>[orig_patent_app_number] => 09756803
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/756803 | Semiconductor memory device having memory cells each having a conductive body of booster plate and a method for manufacturing the same | Jan 9, 2001 | Issued |
Array
(
[id] => 461356
[patent_doc_number] => 07242088
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-07-10
[patent_title] => 'IC package pressure release apparatus and method'
[patent_app_type] => utility
[patent_app_number] => 09/751214
[patent_app_country] => US
[patent_app_date] => 2000-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3237
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/242/07242088.pdf
[firstpage_image] =>[orig_patent_app_number] => 09751214
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/751214 | IC package pressure release apparatus and method | Dec 28, 2000 | Issued |
Array
(
[id] => 1421514
[patent_doc_number] => 06522020
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-02-18
[patent_title] => 'Wafer-level package'
[patent_app_type] => B2
[patent_app_number] => 09/735640
[patent_app_country] => US
[patent_app_date] => 2000-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 2801
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/522/06522020.pdf
[firstpage_image] =>[orig_patent_app_number] => 09735640
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/735640 | Wafer-level package | Dec 13, 2000 | Issued |
Array
(
[id] => 1063796
[patent_doc_number] => 06849957
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-02-01
[patent_title] => 'Photomask including auxiliary mark area, semiconductor device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 09/725853
[patent_app_country] => US
[patent_app_date] => 2000-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 50
[patent_no_of_words] => 11804
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/849/06849957.pdf
[firstpage_image] =>[orig_patent_app_number] => 09725853
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/725853 | Photomask including auxiliary mark area, semiconductor device and manufacturing method thereof | Nov 29, 2000 | Issued |
Array
(
[id] => 1396369
[patent_doc_number] => 06548894
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-15
[patent_title] => 'Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication'
[patent_app_type] => B2
[patent_app_number] => 09/726909
[patent_app_country] => US
[patent_app_date] => 2000-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/548/06548894.pdf
[firstpage_image] =>[orig_patent_app_number] => 09726909
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/726909 | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication | Nov 29, 2000 | Issued |
Array
(
[id] => 6883995
[patent_doc_number] => 20010038150
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-11-08
[patent_title] => 'Semiconductor device manufactured by package group molding and dicing method'
[patent_app_type] => new
[patent_app_number] => 09/726980
[patent_app_country] => US
[patent_app_date] => 2000-11-30
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0038/20010038150.pdf
[firstpage_image] =>[orig_patent_app_number] => 09726980
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/726980 | Semiconductor device manufactured by package group molding and dicing method | Nov 29, 2000 | Abandoned |
Array
(
[id] => 1580208
[patent_doc_number] => 06448599
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-10
[patent_title] => 'Semiconductor device for preventing process-induced charging damages'
[patent_app_type] => B1
[patent_app_number] => 09/725070
[patent_app_country] => US
[patent_app_date] => 2000-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/448/06448599.pdf
[firstpage_image] =>[orig_patent_app_number] => 09725070
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/725070 | Semiconductor device for preventing process-induced charging damages | Nov 28, 2000 | Issued |
Array
(
[id] => 1387223
[patent_doc_number] => 06555911
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-29
[patent_title] => 'Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios'
[patent_app_type] => B1
[patent_app_number] => 09/716464
[patent_app_country] => US
[patent_app_date] => 2000-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 3869
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/555/06555911.pdf
[firstpage_image] =>[orig_patent_app_number] => 09716464
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/716464 | Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios | Nov 20, 2000 | Issued |
09/714944 | SEMICONDUCTOR DEVICE WITH ETCH ROUGHENED BUMPS FOR BONDING SEMICONDUCTOR CHIP TO LEADS | Nov 19, 2000 | Abandoned |
Array
(
[id] => 1246606
[patent_doc_number] => 06677619
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-01-13
[patent_title] => 'Nitride semiconductor device'
[patent_app_type] => B1
[patent_app_number] => 09/714143
[patent_app_country] => US
[patent_app_date] => 2000-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 42049
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/677/06677619.pdf
[firstpage_image] =>[orig_patent_app_number] => 09714143
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/714143 | Nitride semiconductor device | Nov 16, 2000 | Issued |
09/715454 | High Quality printed inductor on a package | Nov 16, 2000 | Abandoned |
Array
(
[id] => 1476446
[patent_doc_number] => 06388339
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-14
[patent_title] => 'Sealed-by-resin type semiconductor device and liquid crystal display module including the same'
[patent_app_type] => B1
[patent_app_number] => 09/697599
[patent_app_country] => US
[patent_app_date] => 2000-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
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[pdf_file] => patents/06/388/06388339.pdf
[firstpage_image] =>[orig_patent_app_number] => 09697599
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/697599 | Sealed-by-resin type semiconductor device and liquid crystal display module including the same | Oct 26, 2000 | Issued |
Array
(
[id] => 1468594
[patent_doc_number] => 06459145
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-01
[patent_title] => 'Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor'
[patent_app_type] => B1
[patent_app_number] => 09/695403
[patent_app_country] => US
[patent_app_date] => 2000-10-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[pdf_file] => patents/06/459/06459145.pdf
[firstpage_image] =>[orig_patent_app_number] => 09695403
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/695403 | Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor | Oct 24, 2000 | Issued |