Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | |
Art Unit(s) | |
Total Applications | |
Issued Applications | |
Pending Applications | |
Abandoned Applications |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
14/446240 | WAFER LEVEL PHOSPHOR COATING TECHNIQUE FOR WARM LIGHT EMITTING DIODES | Jul 28, 2014 | Abandoned |
14/284709 | Method of fabricating semiconductor device and semiconductor device | May 21, 2014 | Issued |
90/013236 | Power Supply for Simultaneously Providing Operating Voltages to a Plurality of Devices | May 8, 2014 | Issued |
14/267201 | Semiconductor device and manufacturing method therefor | Apr 30, 2014 | Issued |
14/231943 | VARIABLE INITIAL PROGRAM VOLTAGE MAGNITUDE FOR NONVOLATILE STORAGE | Mar 31, 2014 | Abandoned |
14/204508 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | Mar 10, 2014 | Abandoned |
14/194128 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Feb 27, 2014 | Abandoned |
14/181194 | Storage medium and semiconductor package | Feb 13, 2014 | Issued |
14/158621 | SEMICONDUCTOR DEVICE HAVING PROJECTING ELECTRODE FORMED BY ELECTROLYTIC PLATING, AND MANUFACTURING METHOD THEREOF | Jan 16, 2014 | Abandoned |
14/103864 | Semiconductor component and method for contacting said semiconductor component | Dec 11, 2013 | Issued |
90/013069 | Connector and Method of Operation | Nov 26, 2013 | Issued |
90/020043 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Nov 18, 2013 | Issued |
90/020040 | COL-TSOP WITH NONCONDUCTIVE MATERIAL FOR REDUCING PACKAGECAPACITANCE | Nov 18, 2013 | Issued |
90/020044 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Nov 18, 2013 | Issued |
90/020039 | HIGHLY DIRECTIONAL LIGHT EMITTING DIODE USING PHOTONIC BANDGAPWAVEGUIDES | Nov 18, 2013 | Issued |
14/069136 | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device | Oct 30, 2013 | Issued |
14/025073 | METHOD OF PREVENTING BOWING IN A VIA FORMATION PROCESS | Sep 11, 2013 | Abandoned |
13/963994 | MULTI-LAYER SEMICONDUCTOR PACKAGE WITH VERTICAL CONNECTORS AND METHOD OF MANUFACTURE THEREOF | Aug 8, 2013 | Abandoned |
13/941226 | Method of forming semiconductor patterns | Jul 11, 2013 | Issued |
13/929406 | Back-to-back metal/semiconductor/metal (MSM) Schottky diode | Jun 26, 2013 | Issued |