Search

Ralf T Seifert

Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )

Most Active Art Unit
2914
Art Unit(s)
2902, 2914, 2904, 2900
Total Applications
7831
Issued Applications
7748
Pending Applications
0
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 14451 [patent_doc_number] => 07808064 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-05 [patent_title] => 'Semiconductor package including through-hole electrode and light-transmitting substrate' [patent_app_type] => utility [patent_app_number] => 12/508293 [patent_app_country] => US [patent_app_date] => 2009-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 21 [patent_no_of_words] => 6956 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/808/07808064.pdf [firstpage_image] =>[orig_patent_app_number] => 12508293 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/508293
Semiconductor package including through-hole electrode and light-transmitting substrate Jul 22, 2009 Issued
Array ( [id] => 4469593 [patent_doc_number] => 07943513 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-17 [patent_title] => 'Conductive through connection and forming method thereof' [patent_app_type] => utility [patent_app_number] => 12/506394 [patent_app_country] => US [patent_app_date] => 2009-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 33 [patent_no_of_words] => 5460 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/943/07943513.pdf [firstpage_image] =>[orig_patent_app_number] => 12506394 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/506394
Conductive through connection and forming method thereof Jul 20, 2009 Issued
Array ( [id] => 5401415 [patent_doc_number] => 20090236728 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-09-24 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/453043 [patent_app_country] => US [patent_app_date] => 2009-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 10271 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0236/20090236728.pdf [firstpage_image] =>[orig_patent_app_number] => 12453043 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/453043
Semiconductor device Apr 27, 2009 Issued
Array ( [id] => 5567431 [patent_doc_number] => 20090250809 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-08 [patent_title] => 'Semiconductor package having thermal stress canceller member' [patent_app_type] => utility [patent_app_number] => 12/382613 [patent_app_country] => US [patent_app_date] => 2009-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4151 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0250/20090250809.pdf [firstpage_image] =>[orig_patent_app_number] => 12382613 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/382613
Semiconductor package having thermal stress canceller member Mar 18, 2009 Abandoned
Array ( [id] => 6224892 [patent_doc_number] => 20100181664 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-07-22 [patent_title] => 'INTEGRATED CIRCUIT CHIP PACKAGE MODULE' [patent_app_type] => utility [patent_app_number] => 12/400793 [patent_app_country] => US [patent_app_date] => 2009-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 822 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0181/20100181664.pdf [firstpage_image] =>[orig_patent_app_number] => 12400793 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/400793
INTEGRATED CIRCUIT CHIP PACKAGE MODULE Mar 8, 2009 Abandoned
Array ( [id] => 6614873 [patent_doc_number] => 20100224992 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-09 [patent_title] => 'SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP' [patent_app_type] => utility [patent_app_number] => 12/399083 [patent_app_country] => US [patent_app_date] => 2009-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5602 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20100224992.pdf [firstpage_image] =>[orig_patent_app_number] => 12399083 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/399083
System and method for stacked die embedded chip build-up Mar 5, 2009 Issued
Array ( [id] => 5499354 [patent_doc_number] => 20090160042 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-25 [patent_title] => 'Managed Memory Component' [patent_app_type] => utility [patent_app_number] => 12/395984 [patent_app_country] => US [patent_app_date] => 2009-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3552 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20090160042.pdf [firstpage_image] =>[orig_patent_app_number] => 12395984 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/395984
Managed Memory Component Mar 1, 2009 Abandoned
Array ( [id] => 4465942 [patent_doc_number] => 07936075 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-03 [patent_title] => 'Semiconductor device and semiconductor device manufacturing method' [patent_app_type] => utility [patent_app_number] => 12/379364 [patent_app_country] => US [patent_app_date] => 2009-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3692 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/936/07936075.pdf [firstpage_image] =>[orig_patent_app_number] => 12379364 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/379364
Semiconductor device and semiconductor device manufacturing method Feb 18, 2009 Issued
Array ( [id] => 6471501 [patent_doc_number] => 20100207272 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-08-19 [patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT' [patent_app_type] => utility [patent_app_number] => 12/389103 [patent_app_country] => US [patent_app_date] => 2009-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5155 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20100207272.pdf [firstpage_image] =>[orig_patent_app_number] => 12389103 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/389103
Semiconductor device including conductive element Feb 18, 2009 Issued
Array ( [id] => 6471446 [patent_doc_number] => 20100207265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-08-19 [patent_title] => 'Method of stiffening coreless package substrate' [patent_app_type] => utility [patent_app_number] => 12/378953 [patent_app_country] => US [patent_app_date] => 2009-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2579 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20100207265.pdf [firstpage_image] =>[orig_patent_app_number] => 12378953 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/378953
Method of stiffening coreless package substrate Feb 18, 2009 Issued
Array ( [id] => 4462337 [patent_doc_number] => 07880248 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-02-01 [patent_title] => 'Destructor integrated circuit chip, interposer electronic device and methods' [patent_app_type] => utility [patent_app_number] => 12/368256 [patent_app_country] => US [patent_app_date] => 2009-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 2842 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880248.pdf [firstpage_image] =>[orig_patent_app_number] => 12368256 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/368256
Destructor integrated circuit chip, interposer electronic device and methods Feb 8, 2009 Issued
Array ( [id] => 7527364 [patent_doc_number] => 08043956 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-25 [patent_title] => 'Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer' [patent_app_type] => utility [patent_app_number] => 12/365963 [patent_app_country] => US [patent_app_date] => 2009-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 23 [patent_no_of_words] => 10847 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/043/08043956.pdf [firstpage_image] =>[orig_patent_app_number] => 12365963 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/365963
Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer Feb 4, 2009 Issued
Array ( [id] => 4624216 [patent_doc_number] => 08003512 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-23 [patent_title] => 'Structure of UBM and solder bumps and methods of fabrication' [patent_app_type] => utility [patent_app_number] => 12/364684 [patent_app_country] => US [patent_app_date] => 2009-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 22 [patent_no_of_words] => 5945 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/003/08003512.pdf [firstpage_image] =>[orig_patent_app_number] => 12364684 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/364684
Structure of UBM and solder bumps and methods of fabrication Feb 2, 2009 Issued
Array ( [id] => 7504735 [patent_doc_number] => 08035179 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-11 [patent_title] => 'Packaged microelectronic imagers and methods of packaging microelectronic imagers' [patent_app_type] => utility [patent_app_number] => 12/364342 [patent_app_country] => US [patent_app_date] => 2009-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 6005 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/035/08035179.pdf [firstpage_image] =>[orig_patent_app_number] => 12364342 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/364342
Packaged microelectronic imagers and methods of packaging microelectronic imagers Feb 1, 2009 Issued
Array ( [id] => 4575527 [patent_doc_number] => 07859115 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-28 [patent_title] => 'Semiconductor package for improving characteristics for transmitting signals and power' [patent_app_type] => utility [patent_app_number] => 12/346963 [patent_app_country] => US [patent_app_date] => 2008-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3877 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/859/07859115.pdf [firstpage_image] =>[orig_patent_app_number] => 12346963 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/346963
Semiconductor package for improving characteristics for transmitting signals and power Dec 30, 2008 Issued
Array ( [id] => 5327916 [patent_doc_number] => 20090108393 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-30 [patent_title] => 'Semiconductor Device With a Plurality of Ground Planes' [patent_app_type] => utility [patent_app_number] => 12/346437 [patent_app_country] => US [patent_app_date] => 2008-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3280 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20090108393.pdf [firstpage_image] =>[orig_patent_app_number] => 12346437 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/346437
Semiconductor device with a plurality of ground planes Dec 29, 2008 Issued
Array ( [id] => 225211 [patent_doc_number] => 07605396 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-10-20 [patent_title] => 'Field effect type organic transistor and process for production t hereof' [patent_app_type] => utility [patent_app_number] => 12/273507 [patent_app_country] => US [patent_app_date] => 2008-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 5414 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/605/07605396.pdf [firstpage_image] =>[orig_patent_app_number] => 12273507 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/273507
Field effect type organic transistor and process for production t hereof Nov 17, 2008 Issued
Array ( [id] => 7523425 [patent_doc_number] => 08026584 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-27 [patent_title] => 'Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 12/251534 [patent_app_country] => US [patent_app_date] => 2008-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 5928 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 248 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/026/08026584.pdf [firstpage_image] =>[orig_patent_app_number] => 12251534 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/251534
Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof Oct 14, 2008 Issued
Array ( [id] => 7535712 [patent_doc_number] => 08049341 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-11-01 [patent_title] => 'Semiconductor package and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/244322 [patent_app_country] => US [patent_app_date] => 2008-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2919 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/049/08049341.pdf [firstpage_image] =>[orig_patent_app_number] => 12244322 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/244322
Semiconductor package and method for manufacturing the same Oct 1, 2008 Issued
Array ( [id] => 6359096 [patent_doc_number] => 20100078829 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-04-01 [patent_title] => 'STACKED DEVICE CONDUCTIVE PATH CONNECTIVITY' [patent_app_type] => utility [patent_app_number] => 12/242325 [patent_app_country] => US [patent_app_date] => 2008-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7159 [patent_no_of_claims] => 49 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0078/20100078829.pdf [firstpage_image] =>[orig_patent_app_number] => 12242325 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/242325
Stacked device conductive path connectivity Sep 29, 2008 Issued
Menu