Ralf T Seifert
Examiner (ID: 12518, Phone: (571)272-2657 , Office: P/2914 )
Most Active Art Unit | 2914 |
Art Unit(s) | 2902, 2914, 2904, 2900 |
Total Applications | 7831 |
Issued Applications | 7748 |
Pending Applications | 0 |
Abandoned Applications | 82 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 14451
[patent_doc_number] => 07808064
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-05
[patent_title] => 'Semiconductor package including through-hole electrode and light-transmitting substrate'
[patent_app_type] => utility
[patent_app_number] => 12/508293
[patent_app_country] => US
[patent_app_date] => 2009-07-23
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[patent_no_of_words] => 6956
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/808/07808064.pdf
[firstpage_image] =>[orig_patent_app_number] => 12508293
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/508293 | Semiconductor package including through-hole electrode and light-transmitting substrate | Jul 22, 2009 | Issued |
Array
(
[id] => 4469593
[patent_doc_number] => 07943513
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-17
[patent_title] => 'Conductive through connection and forming method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/506394
[patent_app_country] => US
[patent_app_date] => 2009-07-21
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[firstpage_image] =>[orig_patent_app_number] => 12506394
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/506394 | Conductive through connection and forming method thereof | Jul 20, 2009 | Issued |
Array
(
[id] => 5401415
[patent_doc_number] => 20090236728
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-24
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/453043
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[patent_app_date] => 2009-04-28
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[pdf_file] => publications/A1/0236/20090236728.pdf
[firstpage_image] =>[orig_patent_app_number] => 12453043
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/453043 | Semiconductor device | Apr 27, 2009 | Issued |
Array
(
[id] => 5567431
[patent_doc_number] => 20090250809
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-08
[patent_title] => 'Semiconductor package having thermal stress canceller member'
[patent_app_type] => utility
[patent_app_number] => 12/382613
[patent_app_country] => US
[patent_app_date] => 2009-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
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[patent_no_of_words] => 4151
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[pdf_file] => publications/A1/0250/20090250809.pdf
[firstpage_image] =>[orig_patent_app_number] => 12382613
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/382613 | Semiconductor package having thermal stress canceller member | Mar 18, 2009 | Abandoned |
Array
(
[id] => 6224892
[patent_doc_number] => 20100181664
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-22
[patent_title] => 'INTEGRATED CIRCUIT CHIP PACKAGE MODULE'
[patent_app_type] => utility
[patent_app_number] => 12/400793
[patent_app_country] => US
[patent_app_date] => 2009-03-09
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/400793 | INTEGRATED CIRCUIT CHIP PACKAGE MODULE | Mar 8, 2009 | Abandoned |
Array
(
[id] => 6614873
[patent_doc_number] => 20100224992
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-09-09
[patent_title] => 'SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP'
[patent_app_type] => utility
[patent_app_number] => 12/399083
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[firstpage_image] =>[orig_patent_app_number] => 12399083
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/399083 | System and method for stacked die embedded chip build-up | Mar 5, 2009 | Issued |
Array
(
[id] => 5499354
[patent_doc_number] => 20090160042
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[patent_title] => 'Managed Memory Component'
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[pdf_file] => publications/A1/0160/20090160042.pdf
[firstpage_image] =>[orig_patent_app_number] => 12395984
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/395984 | Managed Memory Component | Mar 1, 2009 | Abandoned |
Array
(
[id] => 4465942
[patent_doc_number] => 07936075
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[patent_kind] => B2
[patent_issue_date] => 2011-05-03
[patent_title] => 'Semiconductor device and semiconductor device manufacturing method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/379364 | Semiconductor device and semiconductor device manufacturing method | Feb 18, 2009 | Issued |
Array
(
[id] => 6471501
[patent_doc_number] => 20100207272
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-08-19
[patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/389103 | Semiconductor device including conductive element | Feb 18, 2009 | Issued |
Array
(
[id] => 6471446
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[patent_title] => 'Method of stiffening coreless package substrate'
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Array
(
[id] => 4462337
[patent_doc_number] => 07880248
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[patent_title] => 'Destructor integrated circuit chip, interposer electronic device and methods'
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Array
(
[id] => 7527364
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Array
(
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Array
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[id] => 7504735
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Array
(
[id] => 4575527
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Array
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Array
(
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Array
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Array
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Array
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