Ramsey Refai

Array ( [id] => 19038180 [patent_doc_number] => 20240087995 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/453639 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6242 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 227 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18453639 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19788595 [patent_doc_number] => 20250062274 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-20 [patent_title] => BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE USING THE APPARATUS [patent_app_type] => utility [patent_app_number] => 18/451982 [patent_app_country] => US [patent_app_date] => 2023-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9241 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18451982 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19161212 [patent_doc_number] => 20240153919 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-09 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/451197 [patent_app_country] => US [patent_app_date] => 2023-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7068 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18451197 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18812665 [patent_doc_number] => 20230387002 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => DIAGONAL VIA STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/448125 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11475 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18448125 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19531792 [patent_doc_number] => 20240355694 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-24 [patent_title] => MEMORY, FABRICATION METHOD THEREOF AND MEMORY SYSTEM [patent_app_type] => utility [patent_app_number] => 18/366112 [patent_app_country] => US [patent_app_date] => 2023-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4752 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18366112 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19427266 [patent_doc_number] => 12086689 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2024-09-10 [patent_title] => Scalable quantum processor design [patent_app_type] => utility [patent_app_number] => 18/229071 [patent_app_country] => US [patent_app_date] => 2023-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 10613 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18229071 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18774452 [patent_doc_number] => 20230369283 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG [patent_app_type] => utility [patent_app_number] => 18/358969 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13471 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18358969 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18774265 [patent_doc_number] => 20230369096 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE [patent_app_type] => utility [patent_app_number] => 18/225249 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7061 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18225249 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19610928 [patent_doc_number] => 12159809 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-03 [patent_title] => System and method for measuring device inside through-silicon via surroundings [patent_app_type] => utility [patent_app_number] => 18/357780 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 10783 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357780 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19842817 [patent_doc_number] => 12255219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-18 [patent_title] => Image sensor with overlap of backside trench isolation structure and vertical transfer gate [patent_app_type] => utility [patent_app_number] => 18/355481 [patent_app_country] => US [patent_app_date] => 2023-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 24 [patent_no_of_words] => 7651 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355481 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19351273 [patent_doc_number] => 20240260237 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-01 [patent_title] => SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION [patent_app_type] => utility [patent_app_number] => 18/222776 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6620 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18222776 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19285748 [patent_doc_number] => 20240222225 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => Liquid Immersion-Cooled Power Module [patent_app_type] => utility [patent_app_number] => 18/347313 [patent_app_country] => US [patent_app_date] => 2023-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4769 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18347313 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19605340 [patent_doc_number] => 20240396220 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-28 [patent_title] => RADIO FREQUENCY DEVICE [patent_app_type] => utility [patent_app_number] => 18/215839 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4889 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18215839 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18714850 [patent_doc_number] => 20230337495 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => METHOD OF MANUFACTURING A DISPLAY APPARATUS [patent_app_type] => utility [patent_app_number] => 18/342091 [patent_app_country] => US [patent_app_date] => 2023-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14579 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18342091 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19663960 [patent_doc_number] => 20240431025 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-26 [patent_title] => CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS [patent_app_type] => utility [patent_app_number] => 18/214159 [patent_app_country] => US [patent_app_date] => 2023-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5086 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18214159 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20776582 [patent_doc_number] => 12660274 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-06-16 [patent_title] => Silicon carbide semiconductor device and method of manufacturing semiconductor device [patent_app_type] => utility [patent_app_number] => 18/340323 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 16 [patent_no_of_words] => 6054 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340323 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19662057 [patent_doc_number] => 20240429122 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-26 [patent_title] => THERMALLY CONDUCTIVE INTERPOSER, A DEVICE IMPLEMENTING A THERMALLY CONDUCTIVE INTERPOSER, AND PROCESSES FOR IMPLEMENTING THE SAME [patent_app_type] => utility [patent_app_number] => 18/340607 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11383 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340607 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18865880 [patent_doc_number] => 20230420317 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS [patent_app_type] => utility [patent_app_number] => 18/211898 [patent_app_country] => US [patent_app_date] => 2023-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5592 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18211898 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20583174 [patent_doc_number] => 12575437 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-10 [patent_title] => Redistribution substrate, semiconductor package including the same, and method of fabricating redistribution substrate [patent_app_type] => utility [patent_app_number] => 18/208415 [patent_app_country] => US [patent_app_date] => 2023-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 17 [patent_no_of_words] => 4475 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18208415 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18696456 [patent_doc_number] => 20230326895 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => Semiconductor Die Connection System and Method [patent_app_type] => utility [patent_app_number] => 18/332990 [patent_app_country] => US [patent_app_date] => 2023-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6988 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18332990 [rel_patent_id] =>[rel_patent_doc_number] =>)