
Raymond Ngan Phan
Examiner (ID: 5752, Phone: (571)272-3630 , Office: P/2185 )
| Most Active Art Unit | 2111 |
| Art Unit(s) | 2111, 2175, 2186, 2185, 2305, 2781, 2181, 2787 |
| Total Applications | 1868 |
| Issued Applications | 1698 |
| Pending Applications | 98 |
| Abandoned Applications | 95 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5993079
[patent_doc_number] => 20110014732
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[patent_issue_date] => 2011-01-20
[patent_title] => 'LIGHT-EMITTING MODULE FABRICATION METHOD'
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[patent_app_number] => 12/505967
[patent_app_country] => US
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Array
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[patent_issue_date] => 2012-06-05
[patent_title] => 'Substrate processing apparatus and semiconductor device manufacturing method for forming film'
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Array
(
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[patent_title] => 'Method of making a trench MOSFET having improved avalanche capability using three masks process'
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Array
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[patent_issue_date] => 2010-07-08
[patent_title] => 'Three dimensional structure memory'
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Array
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[patent_title] => 'METHOD OF FORMING MONOLITHIC CMOS-MEMS HYBRID INTEGRATED, PACKAGED STRUCTURES'
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Array
(
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[patent_issue_date] => 2009-10-22
[patent_title] => 'DIE TESTING USING TOP SURFACE TEST PADS'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/495060 | Test pads coupled with leads unconnected with die pads | Jun 29, 2009 | Issued |
Array
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[patent_issue_date] => 2010-01-07
[patent_title] => 'METHOD OF PREPARING AN ELECTRICALLY INSULATING FILM AND APPLICATION FOR THE METALLIZATION OF VIAS'
[patent_app_type] => utility
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Array
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[patent_issue_date] => 2012-01-03
[patent_title] => 'Elemental analysis method and semiconductor device manufacturing method'
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Array
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[id] => 6348672
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Array
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Array
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[patent_title] => 'METHOD FOR COATING SEMICONDUCTOR DEVICE USING DROPLET DEPOSITION'
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Array
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Array
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