| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 2798817
[patent_doc_number] => 05124175
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-06-23
[patent_title] => 'Method of patterned metal reflow on interconnect substrates'
[patent_app_type] => 1
[patent_app_number] => 7/614340
[patent_app_country] => US
[patent_app_date] => 1990-11-15
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[pdf_file] => patents/05/124/05124175.pdf
[firstpage_image] =>[orig_patent_app_number] => 614340
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/614340 | Method of patterned metal reflow on interconnect substrates | Nov 14, 1990 | Issued |
Array
(
[id] => 3092982
[patent_doc_number] => 05318803
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-06-07
[patent_title] => 'Conditioning of a substrate for electroless plating thereon'
[patent_app_type] => 1
[patent_app_number] => 7/614669
[patent_app_country] => US
[patent_app_date] => 1990-11-13
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[pdf_file] => patents/05/318/05318803.pdf
[firstpage_image] =>[orig_patent_app_number] => 614669
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/614669 | Conditioning of a substrate for electroless plating thereon | Nov 12, 1990 | Issued |
Array
(
[id] => 2801336
[patent_doc_number] => 05114744
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-05-19
[patent_title] => 'Method for applying a conductive trace pattern to a substrate'
[patent_app_type] => 1
[patent_app_number] => 7/614067
[patent_app_country] => US
[patent_app_date] => 1990-11-07
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/114/05114744.pdf
[firstpage_image] =>[orig_patent_app_number] => 614067
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/614067 | Method for applying a conductive trace pattern to a substrate | Nov 6, 1990 | Issued |
Array
(
[id] => 2918717
[patent_doc_number] => 05192582
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-09
[patent_title] => 'Procedure for processing joints to be soldered'
[patent_app_type] => 1
[patent_app_number] => 7/609400
[patent_app_country] => US
[patent_app_date] => 1990-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 6024
[patent_no_of_claims] => 41
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[pdf_file] => patents/05/192/05192582.pdf
[firstpage_image] =>[orig_patent_app_number] => 609400
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/609400 | Procedure for processing joints to be soldered | Nov 4, 1990 | Issued |
Array
(
[id] => 2916283
[patent_doc_number] => 05234745
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-10
[patent_title] => 'Method of forming an insulating layer on a printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 7/606553
[patent_app_country] => US
[patent_app_date] => 1990-10-31
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/234/05234745.pdf
[firstpage_image] =>[orig_patent_app_number] => 606553
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/606553 | Method of forming an insulating layer on a printed circuit board | Oct 30, 1990 | Issued |
Array
(
[id] => 2913124
[patent_doc_number] => 05178914
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-01-12
[patent_title] => 'Means of seeding and metallizing polymide'
[patent_app_type] => 1
[patent_app_number] => 7/606015
[patent_app_country] => US
[patent_app_date] => 1990-10-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/178/05178914.pdf
[firstpage_image] =>[orig_patent_app_number] => 606015
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/606015 | Means of seeding and metallizing polymide | Oct 29, 1990 | Issued |
Array
(
[id] => 2878892
[patent_doc_number] => 05108784
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-04-28
[patent_title] => 'Composite polymer/desiccant coatings for IC encapsulation'
[patent_app_type] => 1
[patent_app_number] => 7/604041
[patent_app_country] => US
[patent_app_date] => 1990-10-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[patent_no_of_words] => 3956
[patent_no_of_claims] => 22
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/108/05108784.pdf
[firstpage_image] =>[orig_patent_app_number] => 604041
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/604041 | Composite polymer/desiccant coatings for IC encapsulation | Oct 24, 1990 | Issued |
| 07/598052 | COLOR FILTER AND THE MANUFACTURING METHOD THEREFOR | Oct 8, 1990 | Abandoned |
Array
(
[id] => 2852241
[patent_doc_number] => 05165957
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-11-24
[patent_title] => 'Process for producing multilayer wiring structure'
[patent_app_type] => 1
[patent_app_number] => 7/593309
[patent_app_country] => US
[patent_app_date] => 1990-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 2248
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/165/05165957.pdf
[firstpage_image] =>[orig_patent_app_number] => 593309
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/593309 | Process for producing multilayer wiring structure | Oct 3, 1990 | Issued |
Array
(
[id] => 2845946
[patent_doc_number] => 05104689
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-04-14
[patent_title] => 'Method and apparatus for automated solder deposition at multiple sites'
[patent_app_type] => 1
[patent_app_number] => 7/586652
[patent_app_country] => US
[patent_app_date] => 1990-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/104/05104689.pdf
[firstpage_image] =>[orig_patent_app_number] => 586652
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/586652 | Method and apparatus for automated solder deposition at multiple sites | Sep 23, 1990 | Issued |
Array
(
[id] => 2812638
[patent_doc_number] => 05122390
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-06-16
[patent_title] => 'Method for uniformly coating a probe with dielectric and assembling a coax-to-waveguide transition'
[patent_app_type] => 1
[patent_app_number] => 7/587195
[patent_app_country] => US
[patent_app_date] => 1990-09-24
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/122/05122390.pdf
[firstpage_image] =>[orig_patent_app_number] => 587195
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/587195 | Method for uniformly coating a probe with dielectric and assembling a coax-to-waveguide transition | Sep 23, 1990 | Issued |
Array
(
[id] => 2731081
[patent_doc_number] => 05039552
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-08-13
[patent_title] => 'Method of making thick film gold conductor'
[patent_app_type] => 1
[patent_app_number] => 7/587614
[patent_app_country] => US
[patent_app_date] => 1990-09-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/039/05039552.pdf
[firstpage_image] =>[orig_patent_app_number] => 587614
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/587614 | Method of making thick film gold conductor | Sep 19, 1990 | Issued |
| 07/584771 | CORROSION RESISTANT COATED ARTICLES AND PROCESS FOR MAKING SAME | Sep 18, 1990 | Abandoned |
| 07/584327 | METHOD FOR CONDITIONING HALOGENATED POLYMERIC MATERIALS AND STRUCTURES FABRICATEDD THEREWITH | Sep 17, 1990 | Abandoned |
| 07/581609 | PROCESS FOR SELECTIVELY DEPOSITING ALUMINUM ONTO A SILICON SUBSTRATE | Sep 11, 1990 | Abandoned |
Array
(
[id] => 2956069
[patent_doc_number] => 05198273
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-30
[patent_title] => 'Electroless gold plating solution and method for plating gold therewith'
[patent_app_type] => 1
[patent_app_number] => 7/580877
[patent_app_country] => US
[patent_app_date] => 1990-09-11
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/198/05198273.pdf
[firstpage_image] =>[orig_patent_app_number] => 580877
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/580877 | Electroless gold plating solution and method for plating gold therewith | Sep 10, 1990 | Issued |
| 07/581241 | METALLIZATION FOR SEMICONDUCTOR DEVICES | Sep 6, 1990 | Abandoned |
Array
(
[id] => 2942236
[patent_doc_number] => 05180468
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-01-19
[patent_title] => 'Method for growing a high-melting-point metal film'
[patent_app_type] => 1
[patent_app_number] => 7/575627
[patent_app_country] => US
[patent_app_date] => 1990-08-31
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[firstpage_image] =>[orig_patent_app_number] => 575627
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/575627 | Method for growing a high-melting-point metal film | Aug 30, 1990 | Issued |
Array
(
[id] => 2827664
[patent_doc_number] => 05175023
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-12-29
[patent_title] => 'Method for forming insulating coating material for electronic circuit board'
[patent_app_type] => 1
[patent_app_number] => 7/574519
[patent_app_country] => US
[patent_app_date] => 1990-08-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/175/05175023.pdf
[firstpage_image] =>[orig_patent_app_number] => 574519
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/574519 | Method for forming insulating coating material for electronic circuit board | Aug 27, 1990 | Issued |
Array
(
[id] => 2915560
[patent_doc_number] => 05234709
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-10
[patent_title] => 'Process for producing thermal head'
[patent_app_type] => 1
[patent_app_number] => 7/573533
[patent_app_country] => US
[patent_app_date] => 1990-08-27
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/234/05234709.pdf
[firstpage_image] =>[orig_patent_app_number] => 573533
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/573533 | Process for producing thermal head | Aug 26, 1990 | Issued |