| Application number | Title of the application | Filing Date | Status |
|---|
| 07/526681 | ELECTROLESS DESPOSITION FOR IC FABRICATION | May 20, 1990 | Abandoned |
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[patent_issue_date] => 1992-06-09
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| 07/520635 | ELECTROLESS PLATING OF NICKEL ONTO SURFACES SUCH AS COPPER OR FUSED TUNGSTEN | May 7, 1990 | Abandoned |
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| 07/517154 | METHOD FOR IMPROVING METAL ADHESION TO POLYIMIDE SURFACES | Apr 30, 1990 | Abandoned |
| 07/510334 | PROCESS FOR MAKING ELECTRICALLY CONDUCTIVE PATTERNS | Apr 16, 1990 | Abandoned |
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| 07/506119 | METHOD FOR MANUFACTURING A POLYCRYSTALLINE LAYER ON A SUBSTRATE | Apr 8, 1990 | Abandoned |
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| 07/498712 | PROCESS FOR PLATING A METALLIC DEPOSIT BETWEEN FUNCTIONAL PATTERN LINES ON A SUBSTRATE | Mar 21, 1990 | Abandoned |
| 07/494666 | PROCESS OF FORMING A PATTERNED POLYIMIDE FILM AND ARTICLES INCLUDING SUCH A FILM | Mar 15, 1990 | Abandoned |
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