
Robert E. Sellers
Examiner (ID: 8742, Phone: (571)272-1093 , Office: P/1765 )
| Most Active Art Unit | 1712 |
| Art Unit(s) | 1501, 1712, 1765, 1796, 2899 |
| Total Applications | 2877 |
| Issued Applications | 1915 |
| Pending Applications | 92 |
| Abandoned Applications | 868 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 756358
[patent_doc_number] => 07014790
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-03-21
[patent_title] => 'Room temperature cured high temperature and load dimensionally stable acrylate adhesives'
[patent_app_type] => utility
[patent_app_number] => 10/706148
[patent_app_country] => US
[patent_app_date] => 2003-11-12
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[pdf_file] => patents/07/014/07014790.pdf
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Array
(
[id] => 432393
[patent_doc_number] => 07265167
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-09-04
[patent_title] => 'Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same'
[patent_app_type] => utility
[patent_app_number] => 10/703494
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[patent_app_date] => 2003-11-10
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Array
(
[id] => 5656691
[patent_doc_number] => 20060142427
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-29
[patent_title] => 'Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler'
[patent_app_type] => utility
[patent_app_number] => 10/534137
[patent_app_country] => US
[patent_app_date] => 2003-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/534137 | Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler | Nov 6, 2003 | Issued |
Array
(
[id] => 436004
[patent_doc_number] => 07262261
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[patent_kind] => B2
[patent_issue_date] => 2007-08-28
[patent_title] => 'Binders and a method of use thereof as coating material for metal containers'
[patent_app_type] => utility
[patent_app_number] => 10/702671
[patent_app_country] => US
[patent_app_date] => 2003-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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Array
(
[id] => 516850
[patent_doc_number] => 07193016
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[patent_kind] => B1
[patent_issue_date] => 2007-03-20
[patent_title] => 'Epoxy-extended polyacrylate toughening agent'
[patent_app_type] => utility
[patent_app_number] => 10/692935
[patent_app_country] => US
[patent_app_date] => 2003-10-27
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/692935 | Epoxy-extended polyacrylate toughening agent | Oct 26, 2003 | Issued |
Array
(
[id] => 7291763
[patent_doc_number] => 20040110908
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-10
[patent_title] => 'Epoxy resin composition'
[patent_app_type] => new
[patent_app_number] => 10/693693
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/693693 | Epoxy resin composition | Oct 26, 2003 | Issued |
Array
(
[id] => 6978739
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[patent_issue_date] => 2005-12-29
[patent_title] => 'Co-curable compositions'
[patent_app_type] => utility
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[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 10531723
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/531723 | Co-curable compositions | Oct 19, 2003 | Abandoned |
Array
(
[id] => 724884
[patent_doc_number] => 07045562
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-05-16
[patent_title] => 'Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls'
[patent_app_type] => utility
[patent_app_number] => 10/688689
[patent_app_country] => US
[patent_app_date] => 2003-10-16
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/045/07045562.pdf
[firstpage_image] =>[orig_patent_app_number] => 10688689
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/688689 | Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls | Oct 15, 2003 | Issued |
Array
(
[id] => 7470630
[patent_doc_number] => 20040102597
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-27
[patent_title] => 'Thermally-conductive epoxy resin molded article and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/685905
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/685905 | Thermally-conductive epoxy resin molded article and method of manufacturing the same | Oct 13, 2003 | Abandoned |
Array
(
[id] => 7162013
[patent_doc_number] => 20040075802
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[patent_kind] => A1
[patent_issue_date] => 2004-04-22
[patent_title] => 'Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element'
[patent_app_type] => new
[patent_app_number] => 10/682438
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/682438 | Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element | Oct 9, 2003 | Abandoned |
Array
(
[id] => 676292
[patent_doc_number] => 07087663
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-08-08
[patent_title] => 'Adducts of epoxy resins and phosphorus-derived acids and a process for their preparation'
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Array
(
[id] => 733204
[patent_doc_number] => 07037958
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[patent_issue_date] => 2006-05-02
[patent_title] => 'Epoxy coating'
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Array
(
[id] => 7674438
[patent_doc_number] => 20040127680
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[patent_kind] => A1
[patent_issue_date] => 2004-07-01
[patent_title] => 'Vinyl ester adhesive compositions'
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Array
(
[id] => 720378
[patent_doc_number] => 07049354
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[patent_kind] => B2
[patent_issue_date] => 2006-05-23
[patent_title] => 'Oxazolidone ring-containing epoxy resin'
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Array
(
[id] => 7226416
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Array
(
[id] => 672293
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Array
(
[id] => 544351
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Array
(
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Array
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Array
(
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[patent_title] => 'Methods and compositions for treating subterranean formations using high ionic strength gelling agent polymers'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/670410 | Methods and compositions for treating subterranean formations using high ionic strength gelling agent polymers | Sep 23, 2003 | Abandoned |