| Application number | Title of the application | Filing Date | Status |
|---|
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Array
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[patent_doc_number] => 20030004270
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[patent_issue_date] => 2003-01-02
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Array
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[patent_doc_number] => 20030224174
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[patent_kind] => A1
[patent_issue_date] => 2003-12-04
[patent_title] => 'Coating compositions with modified particles and methods of using the same'
[patent_app_type] => new
[patent_app_number] => 10/160888
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[patent_issue_date] => 2005-10-13
[patent_title] => 'PHOSPHORUS- CONTAINING EPOXY RESIN, PHOSPHORUS- CONTAINING EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING THE RESIN, SEALANT CONTAINING THE COMPOSITION, MOLDING MATERIAL CONTAINING THE COMPOSITION, AND LAMINATE CONTAINING THE COMPOSITION'
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[patent_issue_date] => 2004-08-19
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[patent_app_number] => 10/480218
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[patent_issue_date] => 2003-05-08
[patent_title] => 'Resin-coated copper foil, and printed wiring board using resin-coated copper foil'
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[patent_app_number] => 10/156339
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/156339 | Resin-coated copper foil, and printed wiring board using resin-coated copper foil | May 23, 2002 | Issued |
| 10/130851 | MEMBER HAVING METALLIC LAYER, ITS MANUFACTURING METHOD, AND ITS APPLICATION | May 22, 2002 | Abandoned |
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[patent_issue_date] => 2003-12-09
[patent_title] => 'Two-part adhesive: part A-monomer, toughener(s), optional adhesion promotor and reducing agent; part B-epoxy resin'
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[patent_issue_date] => 2002-11-28
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