
Robert E. Tallman
Examiner (ID: 6476, Phone: (571)270-3958 , Office: P/2872 )
| Most Active Art Unit | 2872 |
| Art Unit(s) | 2872 |
| Total Applications | 927 |
| Issued Applications | 717 |
| Pending Applications | 91 |
| Abandoned Applications | 143 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9818368
[patent_doc_number] => 08928157
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-01-06
[patent_title] => 'Encapsulation techniques for leadless semiconductor packages'
[patent_app_type] => utility
[patent_app_number] => 12/401549
[patent_app_country] => US
[patent_app_date] => 2009-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2151
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 268
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12401549
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/401549 | Encapsulation techniques for leadless semiconductor packages | Mar 9, 2009 | Issued |
Array
(
[id] => 6433338
[patent_doc_number] => 20100187699
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-29
[patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/524998
[patent_app_country] => US
[patent_app_date] => 2009-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 22
[patent_no_of_words] => 7147
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0187/20100187699.pdf
[firstpage_image] =>[orig_patent_app_number] => 12524998
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/524998 | Semiconductor integrated circuit device having a dummy metal wiring line | Feb 23, 2009 | Issued |
Array
(
[id] => 5544996
[patent_doc_number] => 20090154873
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-18
[patent_title] => 'ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/357363
[patent_app_country] => US
[patent_app_date] => 2009-01-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 72
[patent_figures_cnt] => 72
[patent_no_of_words] => 21333
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0154/20090154873.pdf
[firstpage_image] =>[orig_patent_app_number] => 12357363
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/357363 | ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF | Jan 20, 2009 | Abandoned |
Array
(
[id] => 5383178
[patent_doc_number] => 20090224422
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-10
[patent_title] => 'Methods of fabricating a composite carbon nanotube thermal interface device'
[patent_app_type] => utility
[patent_app_number] => 12/319626
[patent_app_country] => US
[patent_app_date] => 2009-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 5522
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0224/20090224422.pdf
[firstpage_image] =>[orig_patent_app_number] => 12319626
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/319626 | Methods of fabricating a composite carbon nanotube thermal interface device | Jan 8, 2009 | Abandoned |
Array
(
[id] => 6368972
[patent_doc_number] => 20100314723
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-16
[patent_title] => 'MANUFACTURING OF OPTICAL STRUCTURES BY ELECTROTHERMAL FOCUSSING'
[patent_app_type] => utility
[patent_app_number] => 12/747660
[patent_app_country] => US
[patent_app_date] => 2008-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 16411
[patent_no_of_claims] => 85
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0314/20100314723.pdf
[firstpage_image] =>[orig_patent_app_number] => 12747660
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/747660 | MANUFACTURING OF OPTICAL STRUCTURES BY ELECTROTHERMAL FOCUSSING | Dec 11, 2008 | Abandoned |
Array
(
[id] => 5544636
[patent_doc_number] => 20090154513
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-18
[patent_title] => 'MULTILAYER BOARD AND LIGHT-EMITTING MODULE HAVING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/331734
[patent_app_country] => US
[patent_app_date] => 2008-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2593
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0154/20090154513.pdf
[firstpage_image] =>[orig_patent_app_number] => 12331734
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/331734 | Multilayer board and light-emitting module having the same | Dec 9, 2008 | Issued |
Array
(
[id] => 5542672
[patent_doc_number] => 20090152549
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-18
[patent_title] => 'MEMORY DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/327406
[patent_app_country] => US
[patent_app_date] => 2008-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 25226
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20090152549.pdf
[firstpage_image] =>[orig_patent_app_number] => 12327406
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/327406 | Antifuse memory device | Dec 2, 2008 | Issued |
Array
(
[id] => 5564254
[patent_doc_number] => 20090137107
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-28
[patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/323977
[patent_app_country] => US
[patent_app_date] => 2008-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 9882
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0137/20090137107.pdf
[firstpage_image] =>[orig_patent_app_number] => 12323977
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/323977 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Nov 25, 2008 | Abandoned |
Array
(
[id] => 5490489
[patent_doc_number] => 20090291560
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-11-26
[patent_title] => 'FORMING METHOD OF ETCHING MASK, CONTROL PROGRAM AND PROGRAM STORAGE MEDIUM'
[patent_app_type] => utility
[patent_app_number] => 12/441823
[patent_app_country] => US
[patent_app_date] => 2008-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2676
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0291/20090291560.pdf
[firstpage_image] =>[orig_patent_app_number] => 12441823
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/441823 | Forming method of etching mask, control program and program storage medium | Oct 22, 2008 | Issued |
Array
(
[id] => 6471597
[patent_doc_number] => 20100207282
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-08-19
[patent_title] => 'PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/733635
[patent_app_country] => US
[patent_app_date] => 2008-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 8808
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0207/20100207282.pdf
[firstpage_image] =>[orig_patent_app_number] => 12733635
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/733635 | Primer resin for semiconductor device and semiconductor device | Sep 17, 2008 | Issued |
Array
(
[id] => 5439374
[patent_doc_number] => 20090091013
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-09
[patent_title] => 'LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/210312
[patent_app_country] => US
[patent_app_date] => 2008-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 12303
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0091/20090091013.pdf
[firstpage_image] =>[orig_patent_app_number] => 12210312
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/210312 | Lead frame, electronic component including the lead frame, and manufacturing method thereof | Sep 14, 2008 | Issued |
Array
(
[id] => 5268629
[patent_doc_number] => 20090072404
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-19
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME'
[patent_app_type] => utility
[patent_app_number] => 12/210702
[patent_app_country] => US
[patent_app_date] => 2008-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 12565
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0072/20090072404.pdf
[firstpage_image] =>[orig_patent_app_number] => 12210702
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/210702 | Semiconductor device and method of manufacturing same | Sep 14, 2008 | Issued |
Array
(
[id] => 5364909
[patent_doc_number] => 20090302468
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-10
[patent_title] => 'Printed circuit board comprising semiconductor chip and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 12/232252
[patent_app_country] => US
[patent_app_date] => 2008-09-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4615
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0302/20090302468.pdf
[firstpage_image] =>[orig_patent_app_number] => 12232252
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/232252 | Printed circuit board comprising semiconductor chip and method of manufacturing the same | Sep 11, 2008 | Abandoned |
Array
(
[id] => 5473739
[patent_doc_number] => 20090246905
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-01
[patent_title] => 'ELECTRO-OPTIC INTEGRATED CIRCUITS AND METHODS FOR THE PRODUCTION THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/198867
[patent_app_country] => US
[patent_app_date] => 2008-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 72
[patent_figures_cnt] => 72
[patent_no_of_words] => 21327
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0246/20090246905.pdf
[firstpage_image] =>[orig_patent_app_number] => 12198867
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/198867 | Electro-optic integrated circuits and methods for the production thereof | Aug 25, 2008 | Issued |
Array
(
[id] => 5446527
[patent_doc_number] => 20090047753
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-19
[patent_title] => 'Scaffold-organized clusters and electronic devices made using such clusters'
[patent_app_type] => utility
[patent_app_number] => 12/220580
[patent_app_country] => US
[patent_app_date] => 2008-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 18439
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0047/20090047753.pdf
[firstpage_image] =>[orig_patent_app_number] => 12220580
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/220580 | Scaffold-organized clusters and electronic devices made using such clusters | Jul 24, 2008 | Abandoned |
Array
(
[id] => 7730959
[patent_doc_number] => 08102061
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-01-24
[patent_title] => 'Semiconductor device bonding wire and wire bonding method'
[patent_app_type] => utility
[patent_app_number] => 12/670253
[patent_app_country] => US
[patent_app_date] => 2008-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 23159
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/102/08102061.pdf
[firstpage_image] =>[orig_patent_app_number] => 12670253
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/670253 | Semiconductor device bonding wire and wire bonding method | Jul 23, 2008 | Issued |
Array
(
[id] => 5307616
[patent_doc_number] => 20090014897
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-15
[patent_title] => 'Semiconductor chip package and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 12/219211
[patent_app_country] => US
[patent_app_date] => 2008-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4706
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0014/20090014897.pdf
[firstpage_image] =>[orig_patent_app_number] => 12219211
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/219211 | Semiconductor chip package and method of manufacturing the same | Jul 16, 2008 | Abandoned |
Array
(
[id] => 6193142
[patent_doc_number] => 20110024896
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-02-03
[patent_title] => 'POWER SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/934127
[patent_app_country] => US
[patent_app_date] => 2008-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 3496
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0024/20110024896.pdf
[firstpage_image] =>[orig_patent_app_number] => 12934127
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/934127 | POWER SEMICONDUCTOR DEVICE | Jul 6, 2008 | Abandoned |
Array
(
[id] => 6316117
[patent_doc_number] => 20100195299
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-08-05
[patent_title] => 'Integrated multicomponent device in a semiconducting die'
[patent_app_type] => utility
[patent_app_number] => 12/602846
[patent_app_country] => US
[patent_app_date] => 2008-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5317
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0195/20100195299.pdf
[firstpage_image] =>[orig_patent_app_number] => 12602846
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/602846 | Integrated multicomponent device in a semiconducting die | Jun 4, 2008 | Issued |
Array
(
[id] => 4708235
[patent_doc_number] => 20080296761
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-04
[patent_title] => 'Cylindrical Bonding Structure and method of manufacture'
[patent_app_type] => utility
[patent_app_number] => 12/132628
[patent_app_country] => US
[patent_app_date] => 2008-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 5811
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0296/20080296761.pdf
[firstpage_image] =>[orig_patent_app_number] => 12132628
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/132628 | Cylindrical bonding structure and method of manufacture | Jun 3, 2008 | Issued |