Search

Robert E. Tallman

Examiner (ID: 6476, Phone: (571)270-3958 , Office: P/2872 )

Most Active Art Unit
2872
Art Unit(s)
2872
Total Applications
927
Issued Applications
717
Pending Applications
91
Abandoned Applications
143

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9818368 [patent_doc_number] => 08928157 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-01-06 [patent_title] => 'Encapsulation techniques for leadless semiconductor packages' [patent_app_type] => utility [patent_app_number] => 12/401549 [patent_app_country] => US [patent_app_date] => 2009-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2151 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 268 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12401549 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/401549
Encapsulation techniques for leadless semiconductor packages Mar 9, 2009 Issued
Array ( [id] => 6433338 [patent_doc_number] => 20100187699 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-07-29 [patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE' [patent_app_type] => utility [patent_app_number] => 12/524998 [patent_app_country] => US [patent_app_date] => 2009-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 7147 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0187/20100187699.pdf [firstpage_image] =>[orig_patent_app_number] => 12524998 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/524998
Semiconductor integrated circuit device having a dummy metal wiring line Feb 23, 2009 Issued
Array ( [id] => 5544996 [patent_doc_number] => 20090154873 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF' [patent_app_type] => utility [patent_app_number] => 12/357363 [patent_app_country] => US [patent_app_date] => 2009-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 72 [patent_figures_cnt] => 72 [patent_no_of_words] => 21333 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0154/20090154873.pdf [firstpage_image] =>[orig_patent_app_number] => 12357363 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/357363
ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF Jan 20, 2009 Abandoned
Array ( [id] => 5383178 [patent_doc_number] => 20090224422 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-09-10 [patent_title] => 'Methods of fabricating a composite carbon nanotube thermal interface device' [patent_app_type] => utility [patent_app_number] => 12/319626 [patent_app_country] => US [patent_app_date] => 2009-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5522 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20090224422.pdf [firstpage_image] =>[orig_patent_app_number] => 12319626 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/319626
Methods of fabricating a composite carbon nanotube thermal interface device Jan 8, 2009 Abandoned
Array ( [id] => 6368972 [patent_doc_number] => 20100314723 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-16 [patent_title] => 'MANUFACTURING OF OPTICAL STRUCTURES BY ELECTROTHERMAL FOCUSSING' [patent_app_type] => utility [patent_app_number] => 12/747660 [patent_app_country] => US [patent_app_date] => 2008-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 16411 [patent_no_of_claims] => 85 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0314/20100314723.pdf [firstpage_image] =>[orig_patent_app_number] => 12747660 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/747660
MANUFACTURING OF OPTICAL STRUCTURES BY ELECTROTHERMAL FOCUSSING Dec 11, 2008 Abandoned
Array ( [id] => 5544636 [patent_doc_number] => 20090154513 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'MULTILAYER BOARD AND LIGHT-EMITTING MODULE HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/331734 [patent_app_country] => US [patent_app_date] => 2008-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2593 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0154/20090154513.pdf [firstpage_image] =>[orig_patent_app_number] => 12331734 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/331734
Multilayer board and light-emitting module having the same Dec 9, 2008 Issued
Array ( [id] => 5542672 [patent_doc_number] => 20090152549 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'MEMORY DEVICE' [patent_app_type] => utility [patent_app_number] => 12/327406 [patent_app_country] => US [patent_app_date] => 2008-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 25226 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0152/20090152549.pdf [firstpage_image] =>[orig_patent_app_number] => 12327406 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/327406
Antifuse memory device Dec 2, 2008 Issued
Array ( [id] => 5564254 [patent_doc_number] => 20090137107 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-28 [patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/323977 [patent_app_country] => US [patent_app_date] => 2008-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 9882 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20090137107.pdf [firstpage_image] =>[orig_patent_app_number] => 12323977 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/323977
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Nov 25, 2008 Abandoned
Array ( [id] => 5490489 [patent_doc_number] => 20090291560 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-26 [patent_title] => 'FORMING METHOD OF ETCHING MASK, CONTROL PROGRAM AND PROGRAM STORAGE MEDIUM' [patent_app_type] => utility [patent_app_number] => 12/441823 [patent_app_country] => US [patent_app_date] => 2008-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2676 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0291/20090291560.pdf [firstpage_image] =>[orig_patent_app_number] => 12441823 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/441823
Forming method of etching mask, control program and program storage medium Oct 22, 2008 Issued
Array ( [id] => 6471597 [patent_doc_number] => 20100207282 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-08-19 [patent_title] => 'PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/733635 [patent_app_country] => US [patent_app_date] => 2008-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 8808 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20100207282.pdf [firstpage_image] =>[orig_patent_app_number] => 12733635 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/733635
Primer resin for semiconductor device and semiconductor device Sep 17, 2008 Issued
Array ( [id] => 5439374 [patent_doc_number] => 20090091013 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-09 [patent_title] => 'LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/210312 [patent_app_country] => US [patent_app_date] => 2008-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 12303 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0091/20090091013.pdf [firstpage_image] =>[orig_patent_app_number] => 12210312 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/210312
Lead frame, electronic component including the lead frame, and manufacturing method thereof Sep 14, 2008 Issued
Array ( [id] => 5268629 [patent_doc_number] => 20090072404 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-19 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 12/210702 [patent_app_country] => US [patent_app_date] => 2008-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 12565 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0072/20090072404.pdf [firstpage_image] =>[orig_patent_app_number] => 12210702 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/210702
Semiconductor device and method of manufacturing same Sep 14, 2008 Issued
Array ( [id] => 5364909 [patent_doc_number] => 20090302468 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-10 [patent_title] => 'Printed circuit board comprising semiconductor chip and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/232252 [patent_app_country] => US [patent_app_date] => 2008-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4615 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0302/20090302468.pdf [firstpage_image] =>[orig_patent_app_number] => 12232252 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/232252
Printed circuit board comprising semiconductor chip and method of manufacturing the same Sep 11, 2008 Abandoned
Array ( [id] => 5473739 [patent_doc_number] => 20090246905 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-01 [patent_title] => 'ELECTRO-OPTIC INTEGRATED CIRCUITS AND METHODS FOR THE PRODUCTION THEREOF' [patent_app_type] => utility [patent_app_number] => 12/198867 [patent_app_country] => US [patent_app_date] => 2008-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 72 [patent_figures_cnt] => 72 [patent_no_of_words] => 21327 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20090246905.pdf [firstpage_image] =>[orig_patent_app_number] => 12198867 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/198867
Electro-optic integrated circuits and methods for the production thereof Aug 25, 2008 Issued
Array ( [id] => 5446527 [patent_doc_number] => 20090047753 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-19 [patent_title] => 'Scaffold-organized clusters and electronic devices made using such clusters' [patent_app_type] => utility [patent_app_number] => 12/220580 [patent_app_country] => US [patent_app_date] => 2008-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 18439 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20090047753.pdf [firstpage_image] =>[orig_patent_app_number] => 12220580 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/220580
Scaffold-organized clusters and electronic devices made using such clusters Jul 24, 2008 Abandoned
Array ( [id] => 7730959 [patent_doc_number] => 08102061 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-01-24 [patent_title] => 'Semiconductor device bonding wire and wire bonding method' [patent_app_type] => utility [patent_app_number] => 12/670253 [patent_app_country] => US [patent_app_date] => 2008-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 23159 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/102/08102061.pdf [firstpage_image] =>[orig_patent_app_number] => 12670253 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/670253
Semiconductor device bonding wire and wire bonding method Jul 23, 2008 Issued
Array ( [id] => 5307616 [patent_doc_number] => 20090014897 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-15 [patent_title] => 'Semiconductor chip package and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/219211 [patent_app_country] => US [patent_app_date] => 2008-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4706 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0014/20090014897.pdf [firstpage_image] =>[orig_patent_app_number] => 12219211 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/219211
Semiconductor chip package and method of manufacturing the same Jul 16, 2008 Abandoned
Array ( [id] => 6193142 [patent_doc_number] => 20110024896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-03 [patent_title] => 'POWER SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/934127 [patent_app_country] => US [patent_app_date] => 2008-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 3496 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0024/20110024896.pdf [firstpage_image] =>[orig_patent_app_number] => 12934127 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/934127
POWER SEMICONDUCTOR DEVICE Jul 6, 2008 Abandoned
Array ( [id] => 6316117 [patent_doc_number] => 20100195299 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-08-05 [patent_title] => 'Integrated multicomponent device in a semiconducting die' [patent_app_type] => utility [patent_app_number] => 12/602846 [patent_app_country] => US [patent_app_date] => 2008-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5317 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0195/20100195299.pdf [firstpage_image] =>[orig_patent_app_number] => 12602846 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/602846
Integrated multicomponent device in a semiconducting die Jun 4, 2008 Issued
Array ( [id] => 4708235 [patent_doc_number] => 20080296761 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-04 [patent_title] => 'Cylindrical Bonding Structure and method of manufacture' [patent_app_type] => utility [patent_app_number] => 12/132628 [patent_app_country] => US [patent_app_date] => 2008-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5811 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20080296761.pdf [firstpage_image] =>[orig_patent_app_number] => 12132628 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/132628
Cylindrical bonding structure and method of manufacture Jun 3, 2008 Issued
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