Search

Robert E. Tallman

Examiner (ID: 6476, Phone: (571)270-3958 , Office: P/2872 )

Most Active Art Unit
2872
Art Unit(s)
2872
Total Applications
927
Issued Applications
717
Pending Applications
91
Abandoned Applications
143

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5730332 [patent_doc_number] => 20060255446 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-16 [patent_title] => 'Stacked modules and method' [patent_app_type] => utility [patent_app_number] => 11/403081 [patent_app_country] => US [patent_app_date] => 2006-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 49 [patent_figures_cnt] => 49 [patent_no_of_words] => 13226 [patent_no_of_claims] => 67 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0255/20060255446.pdf [firstpage_image] =>[orig_patent_app_number] => 11403081 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/403081
Stacked modules and method Apr 11, 2006 Abandoned
Array ( [id] => 5680944 [patent_doc_number] => 20060197211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-07 [patent_title] => 'Semiconductor device and method of stacking semiconductor chips' [patent_app_type] => utility [patent_app_number] => 11/398636 [patent_app_country] => US [patent_app_date] => 2006-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8793 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20060197211.pdf [firstpage_image] =>[orig_patent_app_number] => 11398636 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/398636
Semiconductor device and method of stacking semiconductor chips Apr 5, 2006 Abandoned
Array ( [id] => 5757404 [patent_doc_number] => 20060208349 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'Semiconductor device and manufacturing method for the same' [patent_app_type] => utility [patent_app_number] => 11/392853 [patent_app_country] => US [patent_app_date] => 2006-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7041 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0208/20060208349.pdf [firstpage_image] =>[orig_patent_app_number] => 11392853 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/392853
Semiconductor device and manufacturing method for the same Mar 29, 2006 Abandoned
Array ( [id] => 5060449 [patent_doc_number] => 20070222086 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-27 [patent_title] => 'On-die bond wires system and method for enhancing routability of a redistribution layer' [patent_app_type] => utility [patent_app_number] => 11/391625 [patent_app_country] => US [patent_app_date] => 2006-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4850 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20070222086.pdf [firstpage_image] =>[orig_patent_app_number] => 11391625 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/391625
On-die bond wires system and method for enhancing routability of a redistribution layer Mar 26, 2006 Issued
Array ( [id] => 5700175 [patent_doc_number] => 20060216860 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Flip chip interconnection having narrow interconnection sites on the substrate' [patent_app_type] => utility [patent_app_number] => 11/388755 [patent_app_country] => US [patent_app_date] => 2006-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 9313 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0216/20060216860.pdf [firstpage_image] =>[orig_patent_app_number] => 11388755 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/388755
Flip chip interconnection having narrow interconnection sites on the substrate Mar 23, 2006 Abandoned
Array ( [id] => 4462361 [patent_doc_number] => 07880256 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Semiconductor device with passivation layer covering wiring layer' [patent_app_type] => utility [patent_app_number] => 11/386106 [patent_app_country] => US [patent_app_date] => 2006-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 42 [patent_no_of_words] => 7656 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880256.pdf [firstpage_image] =>[orig_patent_app_number] => 11386106 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/386106
Semiconductor device with passivation layer covering wiring layer Mar 21, 2006 Issued
Array ( [id] => 5593922 [patent_doc_number] => 20060157838 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-20 [patent_title] => 'Multimedia card and transfer molding method' [patent_app_type] => utility [patent_app_number] => 11/386154 [patent_app_country] => US [patent_app_date] => 2006-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5634 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20060157838.pdf [firstpage_image] =>[orig_patent_app_number] => 11386154 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/386154
Multimedia card and transfer molding method Mar 20, 2006 Abandoned
Array ( [id] => 72765 [patent_doc_number] => 07755194 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-07-13 [patent_title] => 'Composite barrier layers with controlled copper interface surface roughness' [patent_app_type] => utility [patent_app_number] => 11/376190 [patent_app_country] => US [patent_app_date] => 2006-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5454 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/755/07755194.pdf [firstpage_image] =>[orig_patent_app_number] => 11376190 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/376190
Composite barrier layers with controlled copper interface surface roughness Mar 15, 2006 Issued
Array ( [id] => 5628811 [patent_doc_number] => 20060145279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-06 [patent_title] => 'Electro-optic integrated circuits with connectors and methods for the production thereof' [patent_app_type] => utility [patent_app_number] => 11/365328 [patent_app_country] => US [patent_app_date] => 2006-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 72 [patent_figures_cnt] => 72 [patent_no_of_words] => 21203 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20060145279.pdf [firstpage_image] =>[orig_patent_app_number] => 11365328 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/365328
Electro-optic integrated circuits with connectors and methods for the production thereof Feb 27, 2006 Abandoned
Array ( [id] => 178336 [patent_doc_number] => 07656045 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-02-02 [patent_title] => 'Cap layer for an aluminum copper bond pad' [patent_app_type] => utility [patent_app_number] => 11/360336 [patent_app_country] => US [patent_app_date] => 2006-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3020 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/656/07656045.pdf [firstpage_image] =>[orig_patent_app_number] => 11360336 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/360336
Cap layer for an aluminum copper bond pad Feb 22, 2006 Issued
Array ( [id] => 370192 [patent_doc_number] => 07476967 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-13 [patent_title] => 'Composite carbon nanotube thermal interface device' [patent_app_type] => utility [patent_app_number] => 11/360096 [patent_app_country] => US [patent_app_date] => 2006-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 20 [patent_no_of_words] => 5557 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/476/07476967.pdf [firstpage_image] =>[orig_patent_app_number] => 11360096 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/360096
Composite carbon nanotube thermal interface device Feb 21, 2006 Issued
Array ( [id] => 8676084 [patent_doc_number] => 08384200 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-02-26 [patent_title] => 'Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies' [patent_app_type] => utility [patent_app_number] => 11/359985 [patent_app_country] => US [patent_app_date] => 2006-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 9480 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 318 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11359985 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/359985
Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies Feb 21, 2006 Issued
Array ( [id] => 5652896 [patent_doc_number] => 20060138631 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-29 [patent_title] => 'Multi-chip package structure' [patent_app_type] => utility [patent_app_number] => 11/353903 [patent_app_country] => US [patent_app_date] => 2006-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 6011 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20060138631.pdf [firstpage_image] =>[orig_patent_app_number] => 11353903 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/353903
Multi-chip package structure Feb 13, 2006 Abandoned
Array ( [id] => 5912997 [patent_doc_number] => 20060128059 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-15 [patent_title] => 'Compact system module with built-in thermoelectric cooling' [patent_app_type] => utility [patent_app_number] => 11/345253 [patent_app_country] => US [patent_app_date] => 2006-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8309 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20060128059.pdf [firstpage_image] =>[orig_patent_app_number] => 11345253 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/345253
Compact system module with built-in thermoelectric cooling Jan 31, 2006 Abandoned
Array ( [id] => 5183134 [patent_doc_number] => 20070054488 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-08 [patent_title] => 'Low resistance and reliable copper interconnects by variable doping' [patent_app_type] => utility [patent_app_number] => 11/341827 [patent_app_country] => US [patent_app_date] => 2006-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2231 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20070054488.pdf [firstpage_image] =>[orig_patent_app_number] => 11341827 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/341827
Low resistance and reliable copper interconnects by variable doping Jan 26, 2006 Issued
Array ( [id] => 5838166 [patent_doc_number] => 20060118824 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-08 [patent_title] => 'Semiconductor device with reduced leakage current, and method of fabrication' [patent_app_type] => utility [patent_app_number] => 11/341276 [patent_app_country] => US [patent_app_date] => 2006-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 8677 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0118/20060118824.pdf [firstpage_image] =>[orig_patent_app_number] => 11341276 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/341276
Nitride-based semiconductor device with reduced leakage current Jan 26, 2006 Issued
Array ( [id] => 4866917 [patent_doc_number] => 20080145976 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-19 [patent_title] => 'Packaging of Micro Devices' [patent_app_type] => utility [patent_app_number] => 11/795865 [patent_app_country] => US [patent_app_date] => 2006-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3517 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20080145976.pdf [firstpage_image] =>[orig_patent_app_number] => 11795865 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/795865
Packaging of Micro Devices Jan 23, 2006 Abandoned
Array ( [id] => 191286 [patent_doc_number] => 07642599 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-01-05 [patent_title] => 'Semiconductor device and junction termination structure' [patent_app_type] => utility [patent_app_number] => 11/331160 [patent_app_country] => US [patent_app_date] => 2006-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 22 [patent_no_of_words] => 6222 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/642/07642599.pdf [firstpage_image] =>[orig_patent_app_number] => 11331160 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/331160
Semiconductor device and junction termination structure Jan 12, 2006 Issued
Array ( [id] => 4597143 [patent_doc_number] => 07982290 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-07-19 [patent_title] => 'Contact spring application to semiconductor devices' [patent_app_type] => utility [patent_app_number] => 11/331656 [patent_app_country] => US [patent_app_date] => 2006-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 1998 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/982/07982290.pdf [firstpage_image] =>[orig_patent_app_number] => 11331656 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/331656
Contact spring application to semiconductor devices Jan 11, 2006 Issued
Array ( [id] => 4988846 [patent_doc_number] => 20070155185 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-05 [patent_title] => 'Electrical sensor for real-time feedback control of plasma nitridation' [patent_app_type] => utility [patent_app_number] => 11/324425 [patent_app_country] => US [patent_app_date] => 2006-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4388 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20070155185.pdf [firstpage_image] =>[orig_patent_app_number] => 11324425 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/324425
Electrical sensor for real-time feedback control of plasma nitridation Jan 2, 2006 Issued
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