
Robert E. Tallman
Examiner (ID: 6476, Phone: (571)270-3958 , Office: P/2872 )
| Most Active Art Unit | 2872 |
| Art Unit(s) | 2872 |
| Total Applications | 927 |
| Issued Applications | 717 |
| Pending Applications | 91 |
| Abandoned Applications | 143 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5730332
[patent_doc_number] => 20060255446
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[patent_issue_date] => 2006-11-16
[patent_title] => 'Stacked modules and method'
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Array
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[patent_title] => 'Semiconductor device and method of stacking semiconductor chips'
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Array
(
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[patent_issue_date] => 2006-09-21
[patent_title] => 'Semiconductor device and manufacturing method for the same'
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Array
(
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[patent_title] => 'On-die bond wires system and method for enhancing routability of a redistribution layer'
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Array
(
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Array
(
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[patent_title] => 'Semiconductor device with passivation layer covering wiring layer'
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Array
(
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[patent_title] => 'Multimedia card and transfer molding method'
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Array
(
[id] => 72765
[patent_doc_number] => 07755194
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[patent_kind] => B1
[patent_issue_date] => 2010-07-13
[patent_title] => 'Composite barrier layers with controlled copper interface surface roughness'
[patent_app_type] => utility
[patent_app_number] => 11/376190
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/376190 | Composite barrier layers with controlled copper interface surface roughness | Mar 15, 2006 | Issued |
Array
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[id] => 5628811
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[patent_title] => 'Electro-optic integrated circuits with connectors and methods for the production thereof'
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Array
(
[id] => 178336
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[patent_kind] => B2
[patent_issue_date] => 2010-02-02
[patent_title] => 'Cap layer for an aluminum copper bond pad'
[patent_app_type] => utility
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Array
(
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[patent_title] => 'Composite carbon nanotube thermal interface device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/360096 | Composite carbon nanotube thermal interface device | Feb 21, 2006 | Issued |
Array
(
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Array
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Array
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Array
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Array
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Array
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