Robert Middleton Spear
Examiner (ID: 1367, Phone: (571)272-2645 , Office: P/2915 )
Most Active Art Unit | 2913 |
Art Unit(s) | 2903, 2918, 2913, 2911, 2915, 2910 |
Total Applications | 5325 |
Issued Applications | 5166 |
Pending Applications | 1 |
Abandoned Applications | 158 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 1364381
[patent_doc_number] => 06569921
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-05-27
[patent_title] => 'Pigment pastes, production thereof and coating agents that can be cathodically deposited, containing said pigment pastes'
[patent_app_type] => B1
[patent_app_number] => 10/031307
[patent_app_country] => US
[patent_app_date] => 2002-01-15
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/569/06569921.pdf
[firstpage_image] =>[orig_patent_app_number] => 10031307
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/031307 | Pigment pastes, production thereof and coating agents that can be cathodically deposited, containing said pigment pastes | Jan 14, 2002 | Issued |
Array
(
[id] => 1241299
[patent_doc_number] => 06683122
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-01-27
[patent_title] => 'Filler mixtures'
[patent_app_type] => B1
[patent_app_number] => 10/031134
[patent_app_country] => US
[patent_app_date] => 2002-01-14
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[pdf_file] => patents/06/683/06683122.pdf
[firstpage_image] =>[orig_patent_app_number] => 10031134
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/031134 | Filler mixtures | Jan 13, 2002 | Issued |
Array
(
[id] => 1293001
[patent_doc_number] => 06618933
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-16
[patent_title] => 'Liquid thermosetting insulating resin composition and method for permanently filling holes in printed circuit board by the use thereof'
[patent_app_type] => B2
[patent_app_number] => 10/035173
[patent_app_country] => US
[patent_app_date] => 2002-01-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[patent_no_of_words] => 7625
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[pdf_file] => patents/06/618/06618933.pdf
[firstpage_image] =>[orig_patent_app_number] => 10035173
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/035173 | Liquid thermosetting insulating resin composition and method for permanently filling holes in printed circuit board by the use thereof | Jan 3, 2002 | Issued |
Array
(
[id] => 1406190
[patent_doc_number] => 06534601
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-18
[patent_title] => 'Flame retardant epoxy resin modified with phosphorus and silicon'
[patent_app_type] => B1
[patent_app_number] => 10/029854
[patent_app_country] => US
[patent_app_date] => 2001-12-31
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 3381
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[pdf_file] => patents/06/534/06534601.pdf
[firstpage_image] =>[orig_patent_app_number] => 10029854
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/029854 | Flame retardant epoxy resin modified with phosphorus and silicon | Dec 30, 2001 | Issued |
Array
(
[id] => 1298571
[patent_doc_number] => 06627684
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-30
[patent_title] => 'Dielectric compositions having two steps of laminating temperatures'
[patent_app_type] => B2
[patent_app_number] => 10/025346
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[patent_app_date] => 2001-12-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/025346 | Dielectric compositions having two steps of laminating temperatures | Dec 17, 2001 | Issued |
Array
(
[id] => 1418071
[patent_doc_number] => 06512075
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-01-28
[patent_title] => 'High Tg brominated epoxy resin for glass fiber laminate'
[patent_app_type] => B1
[patent_app_number] => 10/014574
[patent_app_country] => US
[patent_app_date] => 2001-12-14
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/512/06512075.pdf
[firstpage_image] =>[orig_patent_app_number] => 10014574
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/014574 | High Tg brominated epoxy resin for glass fiber laminate | Dec 13, 2001 | Issued |
Array
(
[id] => 5860073
[patent_doc_number] => 20020123602
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-05
[patent_title] => 'Crystallized epoxy resins, their production method, and curable compositions comprising them'
[patent_app_type] => new
[patent_app_number] => 10/012323
[patent_app_country] => US
[patent_app_date] => 2001-12-12
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[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0123/20020123602.pdf
[firstpage_image] =>[orig_patent_app_number] => 10012323
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/012323 | Crystallized epoxy resins, their production method, and curable compositions comprising them | Dec 11, 2001 | Issued |
Array
(
[id] => 6441683
[patent_doc_number] => 20020128428
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-12
[patent_title] => 'Epoxy resins and process for making the same'
[patent_app_type] => new
[patent_app_number] => 10/007518
[patent_app_country] => US
[patent_app_date] => 2001-12-05
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0128/20020128428.pdf
[firstpage_image] =>[orig_patent_app_number] => 10007518
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/007518 | Epoxy resins and process for making the same | Dec 4, 2001 | Issued |
Array
(
[id] => 5828062
[patent_doc_number] => 20020068174
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-06
[patent_title] => 'Mixtures comprising epoxide compounds and their use'
[patent_app_type] => new
[patent_app_number] => 09/997625
[patent_app_country] => US
[patent_app_date] => 2001-11-29
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[firstpage_image] =>[orig_patent_app_number] => 09997625
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/997625 | Mixtures comprising epoxide compounds and their use | Nov 28, 2001 | Issued |
Array
(
[id] => 1261958
[patent_doc_number] => 06664307
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-16
[patent_title] => 'Low-shrinkage epoxy resin formulation'
[patent_app_type] => B2
[patent_app_number] => 09/996535
[patent_app_country] => US
[patent_app_date] => 2001-11-28
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[pdf_file] => patents/06/664/06664307.pdf
[firstpage_image] =>[orig_patent_app_number] => 09996535
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/996535 | Low-shrinkage epoxy resin formulation | Nov 27, 2001 | Issued |
Array
(
[id] => 1308948
[patent_doc_number] => 06613437
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-02
[patent_title] => 'Two-component preparations containing epoxy compounds'
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[patent_app_number] => 09/936822
[patent_app_country] => US
[patent_app_date] => 2001-11-28
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[pdf_file] => patents/06/613/06613437.pdf
[firstpage_image] =>[orig_patent_app_number] => 09936822
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/936822 | Two-component preparations containing epoxy compounds | Nov 27, 2001 | Issued |
09/979273 | Resin composition and process for producing the same | Nov 20, 2001 | Abandoned |
Array
(
[id] => 6131901
[patent_doc_number] => 20020077427
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[patent_kind] => A1
[patent_issue_date] => 2002-06-20
[patent_title] => 'Process for producing epoxidized organic polymer, thermoplastic resin composition, primer composition, unvulcanized rubber composition, rubber moldings, and process for producing the moldings'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/987922 | Process for producing epoxidized organic polymer, thermoplastic resin composition, primer composition, unvulcanized rubber composition, rubber moldings, and process for producing the moldings | Nov 15, 2001 | Abandoned |
Array
(
[id] => 1300656
[patent_doc_number] => 06624213
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[patent_kind] => B2
[patent_issue_date] => 2003-09-23
[patent_title] => 'High temperature epoxy adhesive films'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/005556 | High temperature epoxy adhesive films | Nov 7, 2001 | Issued |
Array
(
[id] => 1531430
[patent_doc_number] => 06410127
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[patent_kind] => B1
[patent_issue_date] => 2002-06-25
[patent_title] => 'Epoxy resin compositions, epoxy resin compositions for fiber-reinforced composite materials, and fiber-reinforced composite materials comprising the same'
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Array
(
[id] => 1389930
[patent_doc_number] => 06548576
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[patent_title] => 'Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/045461 | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components | Nov 6, 2001 | Issued |
Array
(
[id] => 1138868
[patent_doc_number] => 06776869
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[patent_issue_date] => 2004-08-17
[patent_title] => 'Impact-resistant epoxide resin compositions'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/868566 | Impact-resistant epoxide resin compositions | Nov 6, 2001 | Issued |
Array
(
[id] => 6637988
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[patent_title] => 'Self-crosslinking water-dilutable binders'
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Array
(
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[patent_title] => 'Aqueous binders based on epoxy resins'
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Array
(
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[patent_title] => 'Epoxy adhesive'
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