Search

Robert Middleton Spear

Examiner (ID: 1367, Phone: (571)272-2645 , Office: P/2915 )

Most Active Art Unit
2913
Art Unit(s)
2903, 2918, 2913, 2911, 2915, 2910
Total Applications
5325
Issued Applications
5166
Pending Applications
1
Abandoned Applications
158

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1426048 [patent_doc_number] => 06503967 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-07 [patent_title] => 'Hardener for epoxy resin and epoxy resin composition' [patent_app_type] => B1 [patent_app_number] => 09/868325 [patent_app_country] => US [patent_app_date] => 2001-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5615 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/503/06503967.pdf [firstpage_image] =>[orig_patent_app_number] => 09868325 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/868325
Hardener for epoxy resin and epoxy resin composition Jun 17, 2001 Issued
Array ( [id] => 1421121 [patent_doc_number] => 06515048 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-04 [patent_title] => 'Adhesive powder' [patent_app_type] => B1 [patent_app_number] => 09/857562 [patent_app_country] => US [patent_app_date] => 2001-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1981 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/515/06515048.pdf [firstpage_image] =>[orig_patent_app_number] => 09857562 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/857562
Adhesive powder Jun 5, 2001 Issued
Array ( [id] => 1594420 [patent_doc_number] => 06492027 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-12-10 [patent_title] => 'Cationic resin composition' [patent_app_type] => B2 [patent_app_number] => 09/867623 [patent_app_country] => US [patent_app_date] => 2001-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6412 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/492/06492027.pdf [firstpage_image] =>[orig_patent_app_number] => 09867623 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/867623
Cationic resin composition May 30, 2001 Issued
Array ( [id] => 5801186 [patent_doc_number] => 20020009597 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-24 [patent_title] => 'Connecting material and connection structure' [patent_app_type] => new [patent_app_number] => 09/863288 [patent_app_country] => US [patent_app_date] => 2001-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3211 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0009/20020009597.pdf [firstpage_image] =>[orig_patent_app_number] => 09863288 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/863288
Connecting material and connection structure May 23, 2001 Issued
Array ( [id] => 1490959 [patent_doc_number] => 06417252 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-09 [patent_title] => 'Aqueous resin composition for use as a sealer' [patent_app_type] => B1 [patent_app_number] => 09/847396 [patent_app_country] => US [patent_app_date] => 2001-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7791 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/417/06417252.pdf [firstpage_image] =>[orig_patent_app_number] => 09847396 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/847396
Aqueous resin composition for use as a sealer May 2, 2001 Issued
Array ( [id] => 6477822 [patent_doc_number] => 20020022679 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-21 [patent_title] => 'Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom' [patent_app_type] => new [patent_app_number] => 09/844505 [patent_app_country] => US [patent_app_date] => 2001-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3509 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0022/20020022679.pdf [firstpage_image] =>[orig_patent_app_number] => 09844505 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/844505
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom Apr 26, 2001 Issued
Array ( [id] => 1533482 [patent_doc_number] => 06410617 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-25 [patent_title] => 'Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same' [patent_app_type] => B1 [patent_app_number] => 09/743211 [patent_app_country] => US [patent_app_date] => 2001-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4612 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 294 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/410/06410617.pdf [firstpage_image] =>[orig_patent_app_number] => 09743211 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/743211
Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same Apr 25, 2001 Issued
Array ( [id] => 6538980 [patent_doc_number] => 20020193467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-19 [patent_title] => 'Conductive materials with electrical stability for use in electronics devices' [patent_app_type] => new [patent_app_number] => 09/841980 [patent_app_country] => US [patent_app_date] => 2001-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2331 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0193/20020193467.pdf [firstpage_image] =>[orig_patent_app_number] => 09841980 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/841980
Conductive materials with electrical stability for use in electronics devices Apr 24, 2001 Issued
Array ( [id] => 1418686 [patent_doc_number] => 06518332 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-11 [patent_title] => 'Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith' [patent_app_type] => B2 [patent_app_number] => 09/841046 [patent_app_country] => US [patent_app_date] => 2001-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4105 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518332.pdf [firstpage_image] =>[orig_patent_app_number] => 09841046 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/841046
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith Apr 24, 2001 Issued
Array ( [id] => 1479054 [patent_doc_number] => 06451879 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-17 [patent_title] => 'Phenolic resin, epoxy resin, and processes for producing these' [patent_app_type] => B1 [patent_app_number] => 09/807572 [patent_app_country] => US [patent_app_date] => 2001-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7187 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/451/06451879.pdf [firstpage_image] =>[orig_patent_app_number] => 09807572 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/807572
Phenolic resin, epoxy resin, and processes for producing these Apr 12, 2001 Issued
Array ( [id] => 6934793 [patent_doc_number] => 20010056137 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-27 [patent_title] => 'Aqueous two-component cross-linkable composition' [patent_app_type] => new [patent_app_number] => 09/833992 [patent_app_country] => US [patent_app_date] => 2001-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6813 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20010056137.pdf [firstpage_image] =>[orig_patent_app_number] => 09833992 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/833992
Aqueous two-component cross-linkable composition Apr 11, 2001 Issued
Array ( [id] => 6000751 [patent_doc_number] => 20020028866 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-07 [patent_title] => 'Method of manufacturing powder coating' [patent_app_type] => new [patent_app_number] => 09/828472 [patent_app_country] => US [patent_app_date] => 2001-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7496 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0028/20020028866.pdf [firstpage_image] =>[orig_patent_app_number] => 09828472 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/828472
Method of manufacturing powder coating Apr 8, 2001 Issued
Array ( [id] => 5952111 [patent_doc_number] => 20020006986 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-17 [patent_title] => 'Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same' [patent_app_type] => new [patent_app_number] => 09/826865 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6624 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20020006986.pdf [firstpage_image] =>[orig_patent_app_number] => 09826865 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/826865
Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same Apr 5, 2001 Issued
Array ( [id] => 1412074 [patent_doc_number] => 06521354 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-18 [patent_title] => 'Epoxy resin composition and semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/806733 [patent_app_country] => US [patent_app_date] => 2001-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3853 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/521/06521354.pdf [firstpage_image] =>[orig_patent_app_number] => 09806733 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/806733
Epoxy resin composition and semiconductor device Apr 3, 2001 Issued
Array ( [id] => 1417459 [patent_doc_number] => 06512026 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-28 [patent_title] => 'Powder clear varnish and aqueous powder clear varnish slurry' [patent_app_type] => B1 [patent_app_number] => 09/786593 [patent_app_country] => US [patent_app_date] => 2001-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6621 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/512/06512026.pdf [firstpage_image] =>[orig_patent_app_number] => 09786593 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/786593
Powder clear varnish and aqueous powder clear varnish slurry Apr 1, 2001 Issued
Array ( [id] => 1495936 [patent_doc_number] => 06403714 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Preparation of epoxy-functional resins' [patent_app_type] => B1 [patent_app_number] => 09/819466 [patent_app_country] => US [patent_app_date] => 2001-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2994 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/403/06403714.pdf [firstpage_image] =>[orig_patent_app_number] => 09819466 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/819466
Preparation of epoxy-functional resins Mar 27, 2001 Issued
Array ( [id] => 1296232 [patent_doc_number] => 06627316 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-30 [patent_title] => 'Resin composition for water borne coatings and water borne coating composition' [patent_app_type] => B1 [patent_app_number] => 09/817955 [patent_app_country] => US [patent_app_date] => 2001-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7176 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/627/06627316.pdf [firstpage_image] =>[orig_patent_app_number] => 09817955 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/817955
Resin composition for water borne coatings and water borne coating composition Mar 26, 2001 Issued
Array ( [id] => 6908344 [patent_doc_number] => 20010011111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-02 [patent_title] => 'Molded resin composition exhibiting good adhesion to conductive material on a surface' [patent_app_type] => new [patent_app_number] => 09/815059 [patent_app_country] => US [patent_app_date] => 2001-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4629 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0011/20010011111.pdf [firstpage_image] =>[orig_patent_app_number] => 09815059 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/815059
Molded resin composition exhibiting good adhesion to conductive material on a surface Mar 22, 2001 Abandoned
Array ( [id] => 672875 [patent_doc_number] => RE039232 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2006-08-08 [patent_title] => 'Thermoplastic elastomer composition for powder slush molding and process for preparation of said composition' [patent_app_type] => reissue [patent_app_number] => 09/815414 [patent_app_country] => US [patent_app_date] => 2001-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5370 [patent_no_of_claims] => 49 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/039/RE039232.pdf [firstpage_image] =>[orig_patent_app_number] => 09815414 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/815414
Thermoplastic elastomer composition for powder slush molding and process for preparation of said composition Mar 21, 2001 Issued
Array ( [id] => 7001123 [patent_doc_number] => 20010053817 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-20 [patent_title] => 'Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition' [patent_app_type] => new [patent_app_number] => 09/811511 [patent_app_country] => US [patent_app_date] => 2001-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 5548 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0053/20010053817.pdf [firstpage_image] =>[orig_patent_app_number] => 09811511 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/811511
Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition Mar 19, 2001 Issued
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