
Robert Wayne Horn
Examiner (ID: 7557, Phone: (571)272-8591 , Office: P/2837 )
| Most Active Art Unit | 2837 |
| Art Unit(s) | 2832, 2837 |
| Total Applications | 1919 |
| Issued Applications | 1653 |
| Pending Applications | 29 |
| Abandoned Applications | 267 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19191518
[patent_doc_number] => 20240170431
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-23
[patent_title] => BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PACKAGE DEVICE, AND METHOD FOR MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/228746
[patent_app_country] => US
[patent_app_date] => 2023-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5706
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18228746
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/228746 | BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PACKAGE DEVICE, AND METHOD FOR MANUFACTURING THE SAME | Jul 31, 2023 | Pending |
Array
(
[id] => 20553071
[patent_doc_number] => 12563882
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-02-24
[patent_title] => Electronic device
[patent_app_type] => utility
[patent_app_number] => 18/361400
[patent_app_country] => US
[patent_app_date] => 2023-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 12
[patent_no_of_words] => 11223
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 180
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18361400
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/361400 | Electronic device | Jul 27, 2023 | Issued |
Array
(
[id] => 18774362
[patent_doc_number] => 20230369193
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-16
[patent_title] => Package Substrate Insulation Opening Design
[patent_app_type] => utility
[patent_app_number] => 18/357757
[patent_app_country] => US
[patent_app_date] => 2023-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6518
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357757
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/357757 | Package substrate insulation opening design | Jul 23, 2023 | Issued |
Array
(
[id] => 18774546
[patent_doc_number] => 20230369377
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-16
[patent_title] => METHOD FOR FORMING AN IMAGE SENSOR
[patent_app_type] => utility
[patent_app_number] => 18/354859
[patent_app_country] => US
[patent_app_date] => 2023-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12996
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354859
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/354859 | Method for forming an image sensor | Jul 18, 2023 | Issued |
Array
(
[id] => 19728683
[patent_doc_number] => 20250031434
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-01-23
[patent_title] => INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/353389
[patent_app_country] => US
[patent_app_date] => 2023-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 14989
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353389
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/353389 | Integrated circuit packages and methods of forming the same | Jul 16, 2023 | Issued |
Array
(
[id] => 19696479
[patent_doc_number] => 20250015024
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-01-09
[patent_title] => INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS
[patent_app_type] => utility
[patent_app_number] => 18/346701
[patent_app_country] => US
[patent_app_date] => 2023-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10366
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346701
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/346701 | Integrated device comprising metallization interconnects | Jul 2, 2023 | Issued |
Array
(
[id] => 19116460
[patent_doc_number] => 20240128210
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-04-18
[patent_title] => Thermally Conductive IC Spacer with Integrated Electrical Isolation
[patent_app_type] => utility
[patent_app_number] => 18/217039
[patent_app_country] => US
[patent_app_date] => 2023-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6206
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18217039
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/217039 | Thermally Conductive IC Spacer with Integrated Electrical Isolation | Jun 29, 2023 | Pending |
Array
(
[id] => 18898633
[patent_doc_number] => 20240014118
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-11
[patent_title] => FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/214572
[patent_app_country] => US
[patent_app_date] => 2023-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2416
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 209
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18214572
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/214572 | Flip chip package and substrate thereof | Jun 26, 2023 | Issued |
Array
(
[id] => 19781558
[patent_doc_number] => 12230596
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-02-18
[patent_title] => Electronics assemblies employing copper in multiple locations
[patent_app_type] => utility
[patent_app_number] => 18/339865
[patent_app_country] => US
[patent_app_date] => 2023-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 16
[patent_no_of_words] => 23287
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18339865
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/339865 | Electronics assemblies employing copper in multiple locations | Jun 21, 2023 | Issued |
Array
(
[id] => 19733812
[patent_doc_number] => 12211814
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-01-28
[patent_title] => Semiconductor interconnect structures with conductive elements, and associated systems and methods
[patent_app_type] => utility
[patent_app_number] => 18/212665
[patent_app_country] => US
[patent_app_date] => 2023-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 26
[patent_no_of_words] => 6849
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212665
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/212665 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Jun 20, 2023 | Issued |
Array
(
[id] => 18906096
[patent_doc_number] => 20240021581
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-18
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/212453
[patent_app_country] => US
[patent_app_date] => 2023-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7963
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/212453 | Semiconductor package | Jun 20, 2023 | Issued |
Array
(
[id] => 19414864
[patent_doc_number] => 12080701
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-03
[patent_title] => Semiconductor package
[patent_app_type] => utility
[patent_app_number] => 18/210132
[patent_app_country] => US
[patent_app_date] => 2023-06-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 26
[patent_no_of_words] => 9197
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 163
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18210132
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/210132 | Semiconductor package | Jun 14, 2023 | Issued |
Array
(
[id] => 20435045
[patent_doc_number] => 12506099
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-23
[patent_title] => Semiconductor package and manufacturing method thereof
[patent_app_type] => utility
[patent_app_number] => 18/327831
[patent_app_country] => US
[patent_app_date] => 2023-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 36
[patent_figures_cnt] => 36
[patent_no_of_words] => 8011
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327831
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/327831 | Semiconductor package and manufacturing method thereof | May 31, 2023 | Issued |
Array
(
[id] => 18661388
[patent_doc_number] => 20230307402
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-28
[patent_title] => SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR
[patent_app_type] => utility
[patent_app_number] => 18/327178
[patent_app_country] => US
[patent_app_date] => 2023-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3723
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327178
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/327178 | SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR | May 31, 2023 | Abandoned |
Array
(
[id] => 18661371
[patent_doc_number] => 20230307385
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-28
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/325136
[patent_app_country] => US
[patent_app_date] => 2023-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9869
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 55
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18325136
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/325136 | Semiconductor package | May 29, 2023 | Issued |
Array
(
[id] => 18661314
[patent_doc_number] => 20230307327
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-28
[patent_title] => CONDUCTIVE MEMBER CAVITIES
[patent_app_type] => utility
[patent_app_number] => 18/324673
[patent_app_country] => US
[patent_app_date] => 2023-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4744
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324673
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/324673 | Conductive member cavities | May 25, 2023 | Issued |
Array
(
[id] => 20612916
[patent_doc_number] => 12588538
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-03-24
[patent_title] => Semiconductor device having wired under bump structure and method therefor
[patent_app_type] => utility
[patent_app_number] => 18/322658
[patent_app_country] => US
[patent_app_date] => 2023-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 0
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18322658
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/322658 | Semiconductor device having wired under bump structure and method therefor | May 23, 2023 | Issued |
Array
(
[id] => 19575279
[patent_doc_number] => 20240379571
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-14
[patent_title] => SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY
[patent_app_type] => utility
[patent_app_number] => 18/195058
[patent_app_country] => US
[patent_app_date] => 2023-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5980
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195058
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/195058 | SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY | May 8, 2023 | Pending |
Array
(
[id] => 18600251
[patent_doc_number] => 20230275052
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-31
[patent_title] => SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/313560
[patent_app_country] => US
[patent_app_date] => 2023-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9632
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313560
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/313560 | Semiconductor devices and semiconductor packages including the same | May 7, 2023 | Issued |
Array
(
[id] => 18570600
[patent_doc_number] => 20230260937
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-17
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/138752
[patent_app_country] => US
[patent_app_date] => 2023-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 1602
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -7
[patent_words_short_claim] => 48
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138752
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/138752 | Semiconductor device and method for fabricating the same | Apr 24, 2023 | Issued |