Search

Rocio Del Mar Perez-velez

Examiner (ID: 4591, Phone: (571)270-5935 , Office: P/2132 )

Most Active Art Unit
2132
Art Unit(s)
2182, 2100, 2187, 2117, 2133, 2132
Total Applications
254
Issued Applications
200
Pending Applications
5
Abandoned Applications
50

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17055859 [patent_doc_number] => 20210265293 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-26 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/009234 [patent_app_country] => US [patent_app_date] => 2020-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10990 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17009234 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/009234
Semiconductor device including bonding pads and method of manufacturing the same Aug 31, 2020 Issued
Array ( [id] => 16827823 [patent_doc_number] => 20210143116 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-13 [patent_title] => SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/007223 [patent_app_country] => US [patent_app_date] => 2020-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8592 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17007223 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/007223
Semiconductor packages having improved reliability in bonds between connection conductors and pads Aug 30, 2020 Issued
Array ( [id] => 17559168 [patent_doc_number] => 11315890 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-26 [patent_title] => Methods of forming microvias with reduced diameter [patent_app_type] => utility [patent_app_number] => 17/006277 [patent_app_country] => US [patent_app_date] => 2020-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 5301 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17006277 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/006277
Methods of forming microvias with reduced diameter Aug 27, 2020 Issued
Array ( [id] => 17457459 [patent_doc_number] => 11272335 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-03-08 [patent_title] => Systems, methods, and devices for utilizing radar with smart devices [patent_app_type] => utility [patent_app_number] => 17/002655 [patent_app_country] => US [patent_app_date] => 2020-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 25937 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17002655 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/002655
Systems, methods, and devices for utilizing radar with smart devices Aug 24, 2020 Issued
Array ( [id] => 18533287 [patent_doc_number] => 20230238363 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-27 [patent_title] => LED DISPLAY MODULE AND LED DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 18/015427 [patent_app_country] => US [patent_app_date] => 2020-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5703 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18015427 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/015427
LED DISPLAY MODULE AND LED DISPLAY DEVICE Aug 19, 2020 Issued
Array ( [id] => 17332387 [patent_doc_number] => 11222855 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-01-11 [patent_title] => Moisture barrier for bond pads and integrated circuit having the same [patent_app_type] => utility [patent_app_number] => 16/992405 [patent_app_country] => US [patent_app_date] => 2020-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 15 [patent_no_of_words] => 10086 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16992405 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/992405
Moisture barrier for bond pads and integrated circuit having the same Aug 12, 2020 Issued
Array ( [id] => 16692149 [patent_doc_number] => 20210074628 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-03-11 [patent_title] => Interconnect Clip with Angled Contact Surface and Raised Bridge [patent_app_type] => utility [patent_app_number] => 16/991532 [patent_app_country] => US [patent_app_date] => 2020-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9953 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16991532 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/991532
Interconnect clip with angled contact surface and raised bridge Aug 11, 2020 Issued
Array ( [id] => 17493849 [patent_doc_number] => 11283170 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-03-22 [patent_title] => Apparatus and methods for dynamic management of antenna arrays [patent_app_type] => utility [patent_app_number] => 16/986045 [patent_app_country] => US [patent_app_date] => 2020-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 25 [patent_no_of_words] => 13578 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16986045 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/986045
Apparatus and methods for dynamic management of antenna arrays Aug 4, 2020 Issued
Array ( [id] => 17410225 [patent_doc_number] => 11251122 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-02-15 [patent_title] => Semiconductor device having a bonding pad area of a first wiring layer overlaps a bonding pad electrode of a second wiring layer [patent_app_type] => utility [patent_app_number] => 16/984208 [patent_app_country] => US [patent_app_date] => 2020-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 27 [patent_no_of_words] => 7338 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16984208 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/984208
Semiconductor device having a bonding pad area of a first wiring layer overlaps a bonding pad electrode of a second wiring layer Aug 3, 2020 Issued
Array ( [id] => 17405433 [patent_doc_number] => 11246289 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-02-15 [patent_title] => Systems and methods for walking pets [patent_app_type] => utility [patent_app_number] => 16/984037 [patent_app_country] => US [patent_app_date] => 2020-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 24315 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16984037 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/984037
Systems and methods for walking pets Aug 2, 2020 Issued
Array ( [id] => 17100237 [patent_doc_number] => 20210288028 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => STACKED TYPE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE STACKED TYPE SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 16/942290 [patent_app_country] => US [patent_app_date] => 2020-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7497 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16942290 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/942290
Stacked type semiconductor device including through electrode Jul 28, 2020 Issued
Array ( [id] => 17373756 [patent_doc_number] => 20220028808 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-27 [patent_title] => MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY [patent_app_type] => utility [patent_app_number] => 16/940040 [patent_app_country] => US [patent_app_date] => 2020-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4271 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16940040 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/940040
Memory devices with backside bond pads under a memory array Jul 26, 2020 Issued
Array ( [id] => 16858456 [patent_doc_number] => 20210159201 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-27 [patent_title] => SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 16/935175 [patent_app_country] => US [patent_app_date] => 2020-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16976 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16935175 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/935175
Semiconductor structure comprising at least one system-on-integrated-circuit component Jul 20, 2020 Issued
Array ( [id] => 17825715 [patent_doc_number] => 11430669 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-30 [patent_title] => Forming a lock structure in a semiconductor chip pad [patent_app_type] => utility [patent_app_number] => 16/931973 [patent_app_country] => US [patent_app_date] => 2020-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5700 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16931973 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/931973
Forming a lock structure in a semiconductor chip pad Jul 16, 2020 Issued
Array ( [id] => 17529961 [patent_doc_number] => 11302661 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-12 [patent_title] => Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 16/930517 [patent_app_country] => US [patent_app_date] => 2020-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 16 [patent_no_of_words] => 6650 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16930517 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/930517
Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same Jul 15, 2020 Issued
Array ( [id] => 17544109 [patent_doc_number] => 11309243 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-19 [patent_title] => Package having different metal densities in different regions and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 16/929118 [patent_app_country] => US [patent_app_date] => 2020-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 16 [patent_no_of_words] => 9061 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16929118 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/929118
Package having different metal densities in different regions and manufacturing method thereof Jul 14, 2020 Issued
Array ( [id] => 16677456 [patent_doc_number] => 20210066222 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-03-04 [patent_title] => BONDING STRUCTURE AND METHOD OF FORMING SAME [patent_app_type] => utility [patent_app_number] => 16/929708 [patent_app_country] => US [patent_app_date] => 2020-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15892 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16929708 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/929708
Bond pad structure for semiconductor device and method of forming same Jul 14, 2020 Issued
Array ( [id] => 17437110 [patent_doc_number] => 11262436 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-03-01 [patent_title] => Multi-chip transceiver testing in a radar system [patent_app_type] => utility [patent_app_number] => 16/927445 [patent_app_country] => US [patent_app_date] => 2020-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 4881 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16927445 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/927445
Multi-chip transceiver testing in a radar system Jul 12, 2020 Issued
Array ( [id] => 17107487 [patent_doc_number] => 11127713 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-09-21 [patent_title] => High bandwidth memories and systems including the same [patent_app_type] => utility [patent_app_number] => 16/926189 [patent_app_country] => US [patent_app_date] => 2020-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 24 [patent_no_of_words] => 10250 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 224 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16926189 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/926189
High bandwidth memories and systems including the same Jul 9, 2020 Issued
Array ( [id] => 16812190 [patent_doc_number] => 20210134745 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-06 [patent_title] => SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 16/922828 [patent_app_country] => US [patent_app_date] => 2020-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14795 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16922828 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/922828
Semiconductor chip formed using a cover insulation layer and semiconductor package including the same Jul 6, 2020 Issued
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