Search

Rocio Del Mar Perez-velez

Examiner (ID: 4591, Phone: (571)270-5935 , Office: P/2132 )

Most Active Art Unit
2132
Art Unit(s)
2182, 2100, 2187, 2117, 2133, 2132
Total Applications
254
Issued Applications
200
Pending Applications
5
Abandoned Applications
50

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 16545353 [patent_doc_number] => 20200411768 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-31 [patent_title] => Thermally Activated Delayed Fluorescent Material And Application Thereof [patent_app_type] => utility [patent_app_number] => 15/931293 [patent_app_country] => US [patent_app_date] => 2020-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6283 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15931293 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/931293
Thermally activated delayed fluorescent material and application thereof May 12, 2020 Issued
Array ( [id] => 17232329 [patent_doc_number] => 20210358886 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-18 [patent_title] => SEMICONDUCTOR DEVICE INCLUDING VERTICAL BOND PADS [patent_app_type] => utility [patent_app_number] => 16/872613 [patent_app_country] => US [patent_app_date] => 2020-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6870 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16872613 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/872613
Semiconductor device including vertical bond pads May 11, 2020 Issued
Array ( [id] => 17217804 [patent_doc_number] => 20210351142 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-11 [patent_title] => BOND PAD WITH ENHANCED RELIABILITY [patent_app_type] => utility [patent_app_number] => 16/866752 [patent_app_country] => US [patent_app_date] => 2020-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8340 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16866752 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/866752
Bond pad with enhanced reliability May 4, 2020 Issued
Array ( [id] => 16514284 [patent_doc_number] => 20200393542 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-17 [patent_title] => MULTI SENSOR RADIO FREQUENCY DETECTION [patent_app_type] => utility [patent_app_number] => 16/860709 [patent_app_country] => US [patent_app_date] => 2020-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15717 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -24 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16860709 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/860709
Multi sensor radio frequency detection Apr 27, 2020 Issued
Array ( [id] => 20484117 [patent_doc_number] => 12532597 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-20 [patent_title] => Organic light-emitting device [patent_app_type] => utility [patent_app_number] => 16/859763 [patent_app_country] => US [patent_app_date] => 2020-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 23296 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16859763 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/859763
Organic light-emitting device Apr 26, 2020 Issued
Array ( [id] => 20484117 [patent_doc_number] => 12532597 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-20 [patent_title] => Organic light-emitting device [patent_app_type] => utility [patent_app_number] => 16/859763 [patent_app_country] => US [patent_app_date] => 2020-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 23296 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16859763 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/859763
Organic light-emitting device Apr 26, 2020 Issued
Array ( [id] => 16959129 [patent_doc_number] => 11063012 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-07-13 [patent_title] => Semiconductor structure having buffer under bump pad and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 16/857906 [patent_app_country] => US [patent_app_date] => 2020-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 7126 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16857906 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/857906
Semiconductor structure having buffer under bump pad and manufacturing method thereof Apr 23, 2020 Issued
Array ( [id] => 17188853 [patent_doc_number] => 20210335738 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-28 [patent_title] => CAPACITOR INTERPOSER LAYER (CIL) IN A DIE-TO-WAFER THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) [patent_app_type] => utility [patent_app_number] => 16/856132 [patent_app_country] => US [patent_app_date] => 2020-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5518 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16856132 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/856132
Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC) Apr 22, 2020 Issued
Array ( [id] => 16660664 [patent_doc_number] => 20210057301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-02-25 [patent_title] => FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/854679 [patent_app_country] => US [patent_app_date] => 2020-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4853 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16854679 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/854679
Flexible semiconductor package formed by roll-to-roll process Apr 20, 2020 Issued
Array ( [id] => 18828969 [patent_doc_number] => 11844270 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-12 [patent_title] => Compound and organic light emitting device including the same [patent_app_type] => utility [patent_app_number] => 16/850348 [patent_app_country] => US [patent_app_date] => 2020-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 9803 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16850348 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/850348
Compound and organic light emitting device including the same Apr 15, 2020 Issued
Array ( [id] => 17077983 [patent_doc_number] => 11114398 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-09-07 [patent_title] => Integrated circuit device including support patterns and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/848194 [patent_app_country] => US [patent_app_date] => 2020-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 11398 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16848194 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/848194
Integrated circuit device including support patterns and method of manufacturing the same Apr 13, 2020 Issued
Array ( [id] => 16379322 [patent_doc_number] => 20200328165 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-10-15 [patent_title] => WAFER-LEVEL BONDING OF OBSTRUCTIVE ELEMENTS [patent_app_type] => utility [patent_app_number] => 16/846177 [patent_app_country] => US [patent_app_date] => 2020-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9361 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16846177 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/846177
Wafer-level bonding of obstructive elements Apr 9, 2020 Issued
Array ( [id] => 16487664 [patent_doc_number] => 20200381273 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-03 [patent_title] => LIGHT IRRADIATION TYPE HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS [patent_app_type] => utility [patent_app_number] => 16/843948 [patent_app_country] => US [patent_app_date] => 2020-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10700 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16843948 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/843948
Light irradiation type heat treatment method and heat treatment apparatus Apr 8, 2020 Issued
Array ( [id] => 17590726 [patent_doc_number] => 11329003 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-05-10 [patent_title] => Anchoring dies using 3D printing to form reconstructed wafer [patent_app_type] => utility [patent_app_number] => 16/839007 [patent_app_country] => US [patent_app_date] => 2020-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 4949 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16839007 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/839007
Anchoring dies using 3D printing to form reconstructed wafer Apr 1, 2020 Issued
Array ( [id] => 16544936 [patent_doc_number] => 20200411351 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-12-31 [patent_title] => METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING [patent_app_type] => utility [patent_app_number] => 16/838999 [patent_app_country] => US [patent_app_date] => 2020-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5027 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16838999 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/838999
Method for substrate registration and anchoring in inkjet printing Apr 1, 2020 Issued
Array ( [id] => 16364547 [patent_doc_number] => 20200321298 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-10-08 [patent_title] => INTEGRATED CIRCUIT CHIP LAYOUT [patent_app_type] => utility [patent_app_number] => 16/838047 [patent_app_country] => US [patent_app_date] => 2020-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5522 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16838047 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/838047
IC chip layout for minimizing thermal expansion misalignment Apr 1, 2020 Issued
Array ( [id] => 17395915 [patent_doc_number] => 11244939 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-02-08 [patent_title] => Package structure and method of forming the same [patent_app_type] => utility [patent_app_number] => 16/830282 [patent_app_country] => US [patent_app_date] => 2020-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 17806 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16830282 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/830282
Package structure and method of forming the same Mar 25, 2020 Issued
Array ( [id] => 16332288 [patent_doc_number] => 20200303254 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-09-24 [patent_title] => METHODS AND APPARATUS FOR FABRICATION OF SELF-ALIGNING INTERCONNECT STRUCTURE [patent_app_type] => utility [patent_app_number] => 16/827814 [patent_app_country] => US [patent_app_date] => 2020-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11190 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16827814 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/827814
Methods and apparatus for fabrication of self aligning interconnect structure Mar 23, 2020 Issued
Array ( [id] => 16617175 [patent_doc_number] => 20210035828 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-02-04 [patent_title] => APPARATUS AND METHOD FOR COOLING SUBSTRATE [patent_app_type] => utility [patent_app_number] => 16/823338 [patent_app_country] => US [patent_app_date] => 2020-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5309 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823338 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/823338
Apparatus and method for cooling substrate Mar 18, 2020 Issued
Array ( [id] => 16394528 [patent_doc_number] => 20200335469 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-10-22 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 16/822300 [patent_app_country] => US [patent_app_date] => 2020-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14889 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16822300 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/822300
Semiconductor package including multiple semiconductor chips Mar 17, 2020 Issued
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