
Rocio Del Mar Perez-velez
Examiner (ID: 4591, Phone: (571)270-5935 , Office: P/2132 )
| Most Active Art Unit | 2132 |
| Art Unit(s) | 2182, 2100, 2187, 2117, 2133, 2132 |
| Total Applications | 254 |
| Issued Applications | 200 |
| Pending Applications | 5 |
| Abandoned Applications | 50 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 330846
[patent_doc_number] => 07511344
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-31
[patent_title] => 'Field effect transistor'
[patent_app_type] => utility
[patent_app_number] => 11/623963
[patent_app_country] => US
[patent_app_date] => 2007-01-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/511/07511344.pdf
[firstpage_image] =>[orig_patent_app_number] => 11623963
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/623963 | Field effect transistor | Jan 16, 2007 | Issued |
Array
(
[id] => 4805976
[patent_doc_number] => 20080169554
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-17
[patent_title] => 'PLASTIC SEMICONDUCTOR PACKAGES HAVING IMPROVED METAL LAND-LOCKING FEATURES'
[patent_app_type] => utility
[patent_app_number] => 11/623374
[patent_app_country] => US
[patent_app_date] => 2007-01-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0169/20080169554.pdf
[firstpage_image] =>[orig_patent_app_number] => 11623374
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/623374 | Plastic semiconductor packages having improved metal land-locking features | Jan 15, 2007 | Issued |
Array
(
[id] => 5217358
[patent_doc_number] => 20070158669
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Chip coated light emitting diode package and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/651524
[patent_app_country] => US
[patent_app_date] => 2007-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 11651524
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/651524 | Chip coated light emitting diode package and manufacturing method thereof | Jan 9, 2007 | Issued |
Array
(
[id] => 5088749
[patent_doc_number] => 20070228388
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-04
[patent_title] => 'Nitride-based semiconductor light emitting diode'
[patent_app_type] => utility
[patent_app_number] => 11/651023
[patent_app_country] => US
[patent_app_date] => 2007-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4528
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[pdf_file] => publications/A1/0228/20070228388.pdf
[firstpage_image] =>[orig_patent_app_number] => 11651023
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/651023 | Nitride-based semiconductor light emitting device | Jan 8, 2007 | Issued |
Array
(
[id] => 4925230
[patent_doc_number] => 20080164593
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-10
[patent_title] => 'METHOD OF PACKAGING SEMICONDUCTOR DEVICES'
[patent_app_type] => utility
[patent_app_number] => 11/620074
[patent_app_country] => US
[patent_app_date] => 2007-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/620074 | Method of packaging semiconductor devices | Jan 4, 2007 | Issued |
Array
(
[id] => 143170
[patent_doc_number] => 07692274
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-06
[patent_title] => 'Reinforced semiconductor structures'
[patent_app_type] => utility
[patent_app_number] => 11/649244
[patent_app_country] => US
[patent_app_date] => 2007-01-04
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[pdf_file] => patents/07/692/07692274.pdf
[firstpage_image] =>[orig_patent_app_number] => 11649244
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/649244 | Reinforced semiconductor structures | Jan 3, 2007 | Issued |
Array
(
[id] => 4749230
[patent_doc_number] => 20080157301
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY'
[patent_app_type] => utility
[patent_app_number] => 11/619563
[patent_app_country] => US
[patent_app_date] => 2007-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => publications/A1/0157/20080157301.pdf
[firstpage_image] =>[orig_patent_app_number] => 11619563
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/619563 | Leadframe package for MEMS microphone assembly | Jan 2, 2007 | Issued |
Array
(
[id] => 5217369
[patent_doc_number] => 20070158680
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Semiconductor device having IGBT and diode'
[patent_app_type] => utility
[patent_app_number] => 11/648894
[patent_app_country] => US
[patent_app_date] => 2007-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => publications/A1/0158/20070158680.pdf
[firstpage_image] =>[orig_patent_app_number] => 11648894
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/648894 | Semiconductor device having IGBT and diode | Jan 2, 2007 | Issued |
Array
(
[id] => 5186007
[patent_doc_number] => 20070164314
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-19
[patent_title] => 'Nitrogen polar III-nitride heterojunction JFET'
[patent_app_type] => utility
[patent_app_number] => 11/649014
[patent_app_country] => US
[patent_app_date] => 2007-01-03
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0164/20070164314.pdf
[firstpage_image] =>[orig_patent_app_number] => 11649014
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/649014 | Nitrogen polar III-nitride heterojunction JFET | Jan 2, 2007 | Issued |
Array
(
[id] => 4930474
[patent_doc_number] => 20080001249
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-03
[patent_title] => 'Method of forming isolation structure of semiconductor device for preventing excessive loss during recess gate formation'
[patent_app_type] => utility
[patent_app_number] => 11/647764
[patent_app_country] => US
[patent_app_date] => 2006-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => publications/A1/0001/20080001249.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/647764 | Method of forming isolation structure of semiconductor device for preventing excessive loss during recess gate formation | Dec 28, 2006 | Issued |
Array
(
[id] => 4752257
[patent_doc_number] => 20080160330
[patent_country] => US
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[patent_issue_date] => 2008-07-03
[patent_title] => 'Copper-elastomer hybrid thermal interface material to cool under-substrate silicon'
[patent_app_type] => utility
[patent_app_number] => 11/648214
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[pdf_file] => publications/A1/0160/20080160330.pdf
[firstpage_image] =>[orig_patent_app_number] => 11648214
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/648214 | Copper-elastomer hybrid thermal interface material to cool under-substrate silicon | Dec 28, 2006 | Abandoned |
Array
(
[id] => 4941798
[patent_doc_number] => 20080079121
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[patent_title] => 'Through-silicon via and method for forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/647954
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Array
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Array
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[id] => 6383510
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[patent_title] => 'Microelectromechanical Apparatus and Method for Producing the Same'
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Array
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Array
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Array
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Array
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Array
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