Roy Karl Potter

Array ( [id] => 3782293 [patent_doc_number] => 05818102 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'System having integrated circuit package with lead frame having internal power and ground busses' [patent_app_type] => 1 [patent_app_number] => 8/580800 [patent_app_country] => US [patent_app_date] => 1995-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4620 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 260 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/818/05818102.pdf [firstpage_image] =>[orig_patent_app_number] => 580800 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3950494 [patent_doc_number] => 05990546 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-23 [patent_title] => 'Chip scale package type of semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/581260 [patent_app_country] => US [patent_app_date] => 1995-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 29 [patent_no_of_words] => 5990 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/990/05990546.pdf [firstpage_image] =>[orig_patent_app_number] => 581260 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4180192 [patent_doc_number] => 06084302 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-04 [patent_title] => 'Barrier layer cladding around copper interconnect lines' [patent_app_type] => 1 [patent_app_number] => 8/580457 [patent_app_country] => US [patent_app_date] => 1995-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2462 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/084/06084302.pdf [firstpage_image] =>[orig_patent_app_number] => 580457 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3633400 [patent_doc_number] => 05686762 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-11 [patent_title] => 'Semiconductor device with improved bond pads' [patent_app_type] => 1 [patent_app_number] => 8/577911 [patent_app_country] => US [patent_app_date] => 1995-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 1566 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/686/05686762.pdf [firstpage_image] =>[orig_patent_app_number] => 577911 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3698675 [patent_doc_number] => 05650660 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-22 [patent_title] => 'Circuit pattern for a ball grid array integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/575338 [patent_app_country] => US [patent_app_date] => 1995-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 1530 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/650/05650660.pdf [firstpage_image] =>[orig_patent_app_number] => 575338 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3761345 [patent_doc_number] => 05721454 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-24 [patent_title] => 'Integrated circuit package with a plurality of vias that are electrically connected to an internal ground plane and thermally connected to an external heat slug' [patent_app_type] => 1 [patent_app_number] => 8/575222 [patent_app_country] => US [patent_app_date] => 1995-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1269 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/721/05721454.pdf [firstpage_image] =>[orig_patent_app_number] => 575222 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3852927 [patent_doc_number] => 05719440 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-17 [patent_title] => 'Flip chip adaptor package for bare die' [patent_app_type] => 1 [patent_app_number] => 8/574662 [patent_app_country] => US [patent_app_date] => 1995-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2810 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/719/05719440.pdf [firstpage_image] =>[orig_patent_app_number] => 574662 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3874716 [patent_doc_number] => 05838060 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-17 [patent_title] => 'Stacked assemblies of semiconductor packages containing programmable interconnect' [patent_app_type] => 1 [patent_app_number] => 8/571290 [patent_app_country] => US [patent_app_date] => 1995-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 10505 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 383 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/838/05838060.pdf [firstpage_image] =>[orig_patent_app_number] => 571290 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3799806 [patent_doc_number] => 05780925 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-14 [patent_title] => 'Lead frame package for electronic devices' [patent_app_type] => 1 [patent_app_number] => 8/569561 [patent_app_country] => US [patent_app_date] => 1995-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 3060 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/780/05780925.pdf [firstpage_image] =>[orig_patent_app_number] => 569561 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3788865 [patent_doc_number] => 05821619 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-13 [patent_title] => 'Replaceable power module' [patent_app_type] => 1 [patent_app_number] => 8/568854 [patent_app_country] => US [patent_app_date] => 1995-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2268 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/821/05821619.pdf [firstpage_image] =>[orig_patent_app_number] => 568854 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4326183 [patent_doc_number] => 06331731 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-18 [patent_title] => 'Column for module component' [patent_app_type] => 1 [patent_app_number] => 8/568847 [patent_app_country] => US [patent_app_date] => 1995-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2221 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/331/06331731.pdf [firstpage_image] =>[orig_patent_app_number] => 568847 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3651888 [patent_doc_number] => 05637919 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-10 [patent_title] => 'Perimeter independent precision locating member' [patent_app_type] => 1 [patent_app_number] => 8/568097 [patent_app_country] => US [patent_app_date] => 1995-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3957 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/637/05637919.pdf [firstpage_image] =>[orig_patent_app_number] => 568097 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4111454 [patent_doc_number] => 06023091 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-08 [patent_title] => 'Semiconductor heater and method for making' [patent_app_type] => 1 [patent_app_number] => 8/565735 [patent_app_country] => US [patent_app_date] => 1995-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3646 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/023/06023091.pdf [firstpage_image] =>[orig_patent_app_number] => 565735 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3862092 [patent_doc_number] => 05705848 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-06 [patent_title] => 'Power semiconductor module having a plurality of submodules' [patent_app_type] => 1 [patent_app_number] => 8/562454 [patent_app_country] => US [patent_app_date] => 1995-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2601 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/705/05705848.pdf [firstpage_image] =>[orig_patent_app_number] => 562454 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3693255 [patent_doc_number] => 05663594 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-02 [patent_title] => 'Ball grid array type of semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/558804 [patent_app_country] => US [patent_app_date] => 1995-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2324 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/663/05663594.pdf [firstpage_image] =>[orig_patent_app_number] => 558804 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3845702 [patent_doc_number] => 05744861 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-04-28 [patent_title] => 'Power semiconductor module' [patent_app_type] => 1 [patent_app_number] => 8/558021 [patent_app_country] => US [patent_app_date] => 1995-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1415 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/744/05744861.pdf [firstpage_image] =>[orig_patent_app_number] => 558021 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3852955 [patent_doc_number] => 05719442 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-17 [patent_title] => 'Resin sealing type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/555016 [patent_app_country] => US [patent_app_date] => 1995-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 19 [patent_no_of_words] => 6657 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/719/05719442.pdf [firstpage_image] =>[orig_patent_app_number] => 555016 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4105290 [patent_doc_number] => 06066890 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-23 [patent_title] => 'Separate circuit devices in an intra-package configuration and assembly techniques' [patent_app_type] => 1 [patent_app_number] => 8/556369 [patent_app_country] => US [patent_app_date] => 1995-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 4076 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/066/06066890.pdf [firstpage_image] =>[orig_patent_app_number] => 556369 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3880464 [patent_doc_number] => 05825090 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-20 [patent_title] => 'High power semiconductor device and method of making same' [patent_app_type] => 1 [patent_app_number] => 8/554600 [patent_app_country] => US [patent_app_date] => 1995-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 4090 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 253 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/825/05825090.pdf [firstpage_image] =>[orig_patent_app_number] => 554600 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3836861 [patent_doc_number] => 05846879 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Contact structure for vertical chip connections' [patent_app_type] => 1 [patent_app_number] => 8/545647 [patent_app_country] => US [patent_app_date] => 1995-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 6775 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/846/05846879.pdf [firstpage_image] =>[orig_patent_app_number] => 545647 [rel_patent_id] =>[rel_patent_doc_number] =>)