Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3980849 [patent_doc_number] => 05917238 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-29 [patent_title] => 'Liquid crystal display driver' [patent_app_type] => 1 [patent_app_number] => 8/552622 [patent_app_country] => US [patent_app_date] => 1995-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3887 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/917/05917238.pdf [firstpage_image] =>[orig_patent_app_number] => 552622 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/552622
Liquid crystal display driver Nov 2, 1995 Issued
Array ( [id] => 3904130 [patent_doc_number] => 05751065 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Integrated circuit with active devices under bond pads' [patent_app_type] => 1 [patent_app_number] => 8/549990 [patent_app_country] => US [patent_app_date] => 1995-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1989 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/751/05751065.pdf [firstpage_image] =>[orig_patent_app_number] => 549990 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/549990
Integrated circuit with active devices under bond pads Oct 29, 1995 Issued
Array ( [id] => 3818069 [patent_doc_number] => 05710448 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-20 [patent_title] => 'Integrated polysilicon diode contact for gain memory cells' [patent_app_type] => 1 [patent_app_number] => 8/549885 [patent_app_country] => US [patent_app_date] => 1995-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2047 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/710/05710448.pdf [firstpage_image] =>[orig_patent_app_number] => 549885 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/549885
Integrated polysilicon diode contact for gain memory cells Oct 26, 1995 Issued
Array ( [id] => 3780461 [patent_doc_number] => 05757070 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-26 [patent_title] => 'Integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/547426 [patent_app_country] => US [patent_app_date] => 1995-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4085 [patent_no_of_claims] => 57 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/757/05757070.pdf [firstpage_image] =>[orig_patent_app_number] => 547426 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/547426
Integrated circuit package Oct 23, 1995 Issued
Array ( [id] => 3693311 [patent_doc_number] => 05663598 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-02 [patent_title] => 'Electrical circuit bonding interconnect component and flip chip interconnect bond' [patent_app_type] => 1 [patent_app_number] => 8/553762 [patent_app_country] => US [patent_app_date] => 1995-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1362 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/663/05663598.pdf [firstpage_image] =>[orig_patent_app_number] => 553762 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/553762
Electrical circuit bonding interconnect component and flip chip interconnect bond Oct 22, 1995 Issued
Array ( [id] => 3693241 [patent_doc_number] => 05663593 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-02 [patent_title] => 'Ball grid array package with lead frame' [patent_app_type] => 1 [patent_app_number] => 8/543978 [patent_app_country] => US [patent_app_date] => 1995-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 1543 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/663/05663593.pdf [firstpage_image] =>[orig_patent_app_number] => 543978 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/543978
Ball grid array package with lead frame Oct 16, 1995 Issued
Array ( [id] => 3857834 [patent_doc_number] => 05767575 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-16 [patent_title] => 'Ball grid array structure and method for packaging an integrated circuit chip' [patent_app_type] => 1 [patent_app_number] => 8/543982 [patent_app_country] => US [patent_app_date] => 1995-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 24 [patent_no_of_words] => 7832 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/767/05767575.pdf [firstpage_image] =>[orig_patent_app_number] => 543982 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/543982
Ball grid array structure and method for packaging an integrated circuit chip Oct 16, 1995 Issued
Array ( [id] => 3668773 [patent_doc_number] => 05598033 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-01-28 [patent_title] => 'Micro BGA stacking scheme' [patent_app_type] => 1 [patent_app_number] => 8/543678 [patent_app_country] => US [patent_app_date] => 1995-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3434 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 301 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/598/05598033.pdf [firstpage_image] =>[orig_patent_app_number] => 543678 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/543678
Micro BGA stacking scheme Oct 15, 1995 Issued
Array ( [id] => 3818206 [patent_doc_number] => 05710457 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-20 [patent_title] => 'Semiconductor integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/541102 [patent_app_country] => US [patent_app_date] => 1995-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 6025 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/710/05710457.pdf [firstpage_image] =>[orig_patent_app_number] => 541102 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/541102
Semiconductor integrated circuit Oct 10, 1995 Issued
Array ( [id] => 3780437 [patent_doc_number] => 05808354 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-15 [patent_title] => 'Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface' [patent_app_type] => 1 [patent_app_number] => 8/544407 [patent_app_country] => US [patent_app_date] => 1995-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 3655 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/808/05808354.pdf [firstpage_image] =>[orig_patent_app_number] => 544407 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/544407
Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface Oct 9, 1995 Issued
Array ( [id] => 3694330 [patent_doc_number] => 05604377 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-18 [patent_title] => 'Semiconductor chip high density packaging' [patent_app_type] => 1 [patent_app_number] => 8/541848 [patent_app_country] => US [patent_app_date] => 1995-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2662 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/604/05604377.pdf [firstpage_image] =>[orig_patent_app_number] => 541848 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/541848
Semiconductor chip high density packaging Oct 9, 1995 Issued
Array ( [id] => 3654406 [patent_doc_number] => 05606199 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-25 [patent_title] => 'Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame' [patent_app_type] => 1 [patent_app_number] => 8/539770 [patent_app_country] => US [patent_app_date] => 1995-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 3237 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/606/05606199.pdf [firstpage_image] =>[orig_patent_app_number] => 539770 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/539770
Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame Oct 4, 1995 Issued
Array ( [id] => 3746138 [patent_doc_number] => 05786631 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-28 [patent_title] => 'Configurable ball grid array package' [patent_app_type] => 1 [patent_app_number] => 8/539188 [patent_app_country] => US [patent_app_date] => 1995-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 19 [patent_no_of_words] => 3954 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/786/05786631.pdf [firstpage_image] =>[orig_patent_app_number] => 539188 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/539188
Configurable ball grid array package Oct 3, 1995 Issued
Array ( [id] => 4257676 [patent_doc_number] => 06208017 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-27 [patent_title] => 'Semiconductor device with lead-on-chip structure' [patent_app_type] => 1 [patent_app_number] => 8/539069 [patent_app_country] => US [patent_app_date] => 1995-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2674 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/208/06208017.pdf [firstpage_image] =>[orig_patent_app_number] => 539069 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/539069
Semiconductor device with lead-on-chip structure Oct 3, 1995 Issued
Array ( [id] => 3559081 [patent_doc_number] => 05543640 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-08-06 [patent_title] => 'Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module' [patent_app_type] => 1 [patent_app_number] => 8/536076 [patent_app_country] => US [patent_app_date] => 1995-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 4747 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/543/05543640.pdf [firstpage_image] =>[orig_patent_app_number] => 536076 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/536076
Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module Sep 28, 1995 Issued
Array ( [id] => 4054347 [patent_doc_number] => 05869887 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-02-09 [patent_title] => 'Semiconductor package fabricated by using automated bonding tape' [patent_app_type] => 1 [patent_app_number] => 8/537261 [patent_app_country] => US [patent_app_date] => 1995-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 28 [patent_no_of_words] => 4351 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/869/05869887.pdf [firstpage_image] =>[orig_patent_app_number] => 537261 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/537261
Semiconductor package fabricated by using automated bonding tape Sep 28, 1995 Issued
Array ( [id] => 3672125 [patent_doc_number] => 05600179 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-04 [patent_title] => 'Package for packaging a semiconductor device suitable for being connected to a connection object by soldering' [patent_app_type] => 1 [patent_app_number] => 8/534316 [patent_app_country] => US [patent_app_date] => 1995-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 6191 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/600/05600179.pdf [firstpage_image] =>[orig_patent_app_number] => 534316 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/534316
Package for packaging a semiconductor device suitable for being connected to a connection object by soldering Sep 26, 1995 Issued
Array ( [id] => 4037806 [patent_doc_number] => RE036469 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-28 [patent_title] => 'Packaging for semiconductor logic devices' [patent_app_type] => 2 [patent_app_number] => 8/534177 [patent_app_country] => US [patent_app_date] => 1995-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 6889 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/036/RE036469.pdf [firstpage_image] =>[orig_patent_app_number] => 534177 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/534177
Packaging for semiconductor logic devices Sep 25, 1995 Issued
Array ( [id] => 3979996 [patent_doc_number] => RE036325 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-05 [patent_title] => 'Directly bonded SIMM module' [patent_app_type] => 2 [patent_app_number] => 8/534176 [patent_app_country] => US [patent_app_date] => 1995-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 8 [patent_no_of_words] => 4343 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 333 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/036/RE036325.pdf [firstpage_image] =>[orig_patent_app_number] => 534176 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/534176
Directly bonded SIMM module Sep 25, 1995 Issued
Array ( [id] => 3666865 [patent_doc_number] => 05625230 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-29 [patent_title] => 'Integrated circuit chip structure' [patent_app_type] => 1 [patent_app_number] => 8/532984 [patent_app_country] => US [patent_app_date] => 1995-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 16 [patent_no_of_words] => 2278 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/625/05625230.pdf [firstpage_image] =>[orig_patent_app_number] => 532984 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/532984
Integrated circuit chip structure Sep 21, 1995 Issued
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