
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3980849
[patent_doc_number] => 05917238
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-29
[patent_title] => 'Liquid crystal display driver'
[patent_app_type] => 1
[patent_app_number] => 8/552622
[patent_app_country] => US
[patent_app_date] => 1995-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 3887
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/917/05917238.pdf
[firstpage_image] =>[orig_patent_app_number] => 552622
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/552622 | Liquid crystal display driver | Nov 2, 1995 | Issued |
Array
(
[id] => 3904130
[patent_doc_number] => 05751065
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-12
[patent_title] => 'Integrated circuit with active devices under bond pads'
[patent_app_type] => 1
[patent_app_number] => 8/549990
[patent_app_country] => US
[patent_app_date] => 1995-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1989
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 24
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/751/05751065.pdf
[firstpage_image] =>[orig_patent_app_number] => 549990
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/549990 | Integrated circuit with active devices under bond pads | Oct 29, 1995 | Issued |
Array
(
[id] => 3818069
[patent_doc_number] => 05710448
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-20
[patent_title] => 'Integrated polysilicon diode contact for gain memory cells'
[patent_app_type] => 1
[patent_app_number] => 8/549885
[patent_app_country] => US
[patent_app_date] => 1995-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2047
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/710/05710448.pdf
[firstpage_image] =>[orig_patent_app_number] => 549885
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/549885 | Integrated polysilicon diode contact for gain memory cells | Oct 26, 1995 | Issued |
Array
(
[id] => 3780461
[patent_doc_number] => 05757070
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-26
[patent_title] => 'Integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/547426
[patent_app_country] => US
[patent_app_date] => 1995-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4085
[patent_no_of_claims] => 57
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/757/05757070.pdf
[firstpage_image] =>[orig_patent_app_number] => 547426
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/547426 | Integrated circuit package | Oct 23, 1995 | Issued |
Array
(
[id] => 3693311
[patent_doc_number] => 05663598
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-02
[patent_title] => 'Electrical circuit bonding interconnect component and flip chip interconnect bond'
[patent_app_type] => 1
[patent_app_number] => 8/553762
[patent_app_country] => US
[patent_app_date] => 1995-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1362
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 64
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/663/05663598.pdf
[firstpage_image] =>[orig_patent_app_number] => 553762
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/553762 | Electrical circuit bonding interconnect component and flip chip interconnect bond | Oct 22, 1995 | Issued |
Array
(
[id] => 3693241
[patent_doc_number] => 05663593
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-02
[patent_title] => 'Ball grid array package with lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/543978
[patent_app_country] => US
[patent_app_date] => 1995-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 1543
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/663/05663593.pdf
[firstpage_image] =>[orig_patent_app_number] => 543978
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/543978 | Ball grid array package with lead frame | Oct 16, 1995 | Issued |
Array
(
[id] => 3857834
[patent_doc_number] => 05767575
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-16
[patent_title] => 'Ball grid array structure and method for packaging an integrated circuit chip'
[patent_app_type] => 1
[patent_app_number] => 8/543982
[patent_app_country] => US
[patent_app_date] => 1995-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 24
[patent_no_of_words] => 7832
[patent_no_of_claims] => 38
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/767/05767575.pdf
[firstpage_image] =>[orig_patent_app_number] => 543982
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/543982 | Ball grid array structure and method for packaging an integrated circuit chip | Oct 16, 1995 | Issued |
Array
(
[id] => 3668773
[patent_doc_number] => 05598033
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-28
[patent_title] => 'Micro BGA stacking scheme'
[patent_app_type] => 1
[patent_app_number] => 8/543678
[patent_app_country] => US
[patent_app_date] => 1995-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 3434
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 301
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/598/05598033.pdf
[firstpage_image] =>[orig_patent_app_number] => 543678
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/543678 | Micro BGA stacking scheme | Oct 15, 1995 | Issued |
Array
(
[id] => 3818206
[patent_doc_number] => 05710457
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-20
[patent_title] => 'Semiconductor integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 8/541102
[patent_app_country] => US
[patent_app_date] => 1995-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 16
[patent_no_of_words] => 6025
[patent_no_of_claims] => 6
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[patent_words_short_claim] => 222
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/710/05710457.pdf
[firstpage_image] =>[orig_patent_app_number] => 541102
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/541102 | Semiconductor integrated circuit | Oct 10, 1995 | Issued |
Array
(
[id] => 3780437
[patent_doc_number] => 05808354
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-15
[patent_title] => 'Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface'
[patent_app_type] => 1
[patent_app_number] => 8/544407
[patent_app_country] => US
[patent_app_date] => 1995-10-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 3655
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/808/05808354.pdf
[firstpage_image] =>[orig_patent_app_number] => 544407
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/544407 | Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface | Oct 9, 1995 | Issued |
Array
(
[id] => 3694330
[patent_doc_number] => 05604377
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-18
[patent_title] => 'Semiconductor chip high density packaging'
[patent_app_type] => 1
[patent_app_number] => 8/541848
[patent_app_country] => US
[patent_app_date] => 1995-10-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 2662
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/604/05604377.pdf
[firstpage_image] =>[orig_patent_app_number] => 541848
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/541848 | Semiconductor chip high density packaging | Oct 9, 1995 | Issued |
Array
(
[id] => 3654406
[patent_doc_number] => 05606199
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-25
[patent_title] => 'Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/539770
[patent_app_country] => US
[patent_app_date] => 1995-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3237
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[pdf_file] => patents/05/606/05606199.pdf
[firstpage_image] =>[orig_patent_app_number] => 539770
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/539770 | Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame | Oct 4, 1995 | Issued |
Array
(
[id] => 3746138
[patent_doc_number] => 05786631
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-28
[patent_title] => 'Configurable ball grid array package'
[patent_app_type] => 1
[patent_app_number] => 8/539188
[patent_app_country] => US
[patent_app_date] => 1995-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => patents/05/786/05786631.pdf
[firstpage_image] =>[orig_patent_app_number] => 539188
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/539188 | Configurable ball grid array package | Oct 3, 1995 | Issued |
Array
(
[id] => 4257676
[patent_doc_number] => 06208017
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-27
[patent_title] => 'Semiconductor device with lead-on-chip structure'
[patent_app_type] => 1
[patent_app_number] => 8/539069
[patent_app_country] => US
[patent_app_date] => 1995-10-04
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/208/06208017.pdf
[firstpage_image] =>[orig_patent_app_number] => 539069
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/539069 | Semiconductor device with lead-on-chip structure | Oct 3, 1995 | Issued |
Array
(
[id] => 3559081
[patent_doc_number] => 05543640
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-06
[patent_title] => 'Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module'
[patent_app_type] => 1
[patent_app_number] => 8/536076
[patent_app_country] => US
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[pdf_file] => patents/05/543/05543640.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/536076 | Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module | Sep 28, 1995 | Issued |
Array
(
[id] => 4054347
[patent_doc_number] => 05869887
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[patent_issue_date] => 1999-02-09
[patent_title] => 'Semiconductor package fabricated by using automated bonding tape'
[patent_app_type] => 1
[patent_app_number] => 8/537261
[patent_app_country] => US
[patent_app_date] => 1995-09-29
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[pdf_file] => patents/05/869/05869887.pdf
[firstpage_image] =>[orig_patent_app_number] => 537261
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/537261 | Semiconductor package fabricated by using automated bonding tape | Sep 28, 1995 | Issued |
Array
(
[id] => 3672125
[patent_doc_number] => 05600179
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-04
[patent_title] => 'Package for packaging a semiconductor device suitable for being connected to a connection object by soldering'
[patent_app_type] => 1
[patent_app_number] => 8/534316
[patent_app_country] => US
[patent_app_date] => 1995-09-27
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[pdf_file] => patents/05/600/05600179.pdf
[firstpage_image] =>[orig_patent_app_number] => 534316
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/534316 | Package for packaging a semiconductor device suitable for being connected to a connection object by soldering | Sep 26, 1995 | Issued |
Array
(
[id] => 4037806
[patent_doc_number] => RE036469
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-28
[patent_title] => 'Packaging for semiconductor logic devices'
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[patent_app_number] => 8/534177
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[pdf_file] => patents/RE/036/RE036469.pdf
[firstpage_image] =>[orig_patent_app_number] => 534177
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/534177 | Packaging for semiconductor logic devices | Sep 25, 1995 | Issued |
Array
(
[id] => 3979996
[patent_doc_number] => RE036325
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[pdf_file] => patents/RE/036/RE036325.pdf
[firstpage_image] =>[orig_patent_app_number] => 534176
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/534176 | Directly bonded SIMM module | Sep 25, 1995 | Issued |
Array
(
[id] => 3666865
[patent_doc_number] => 05625230
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-29
[patent_title] => 'Integrated circuit chip structure'
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[patent_app_number] => 8/532984
[patent_app_country] => US
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/625/05625230.pdf
[firstpage_image] =>[orig_patent_app_number] => 532984
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/532984 | Integrated circuit chip structure | Sep 21, 1995 | Issued |