Roy Karl Potter

Array ( [id] => 3797714 [patent_doc_number] => 05726490 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-10 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/531119 [patent_app_country] => US [patent_app_date] => 1995-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3003 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/726/05726490.pdf [firstpage_image] =>[orig_patent_app_number] => 531119 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3710833 [patent_doc_number] => 05654585 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-05 [patent_title] => 'Semiconductor device with at least one lead having a plurality of bent portions' [patent_app_type] => 1 [patent_app_number] => 8/531121 [patent_app_country] => US [patent_app_date] => 1995-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 27 [patent_no_of_words] => 4394 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/654/05654585.pdf [firstpage_image] =>[orig_patent_app_number] => 531121 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3797700 [patent_doc_number] => 05726489 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-10 [patent_title] => 'Film carrier semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/531271 [patent_app_country] => US [patent_app_date] => 1995-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2971 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/726/05726489.pdf [firstpage_image] =>[orig_patent_app_number] => 531271 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3882854 [patent_doc_number] => 05747874 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-05 [patent_title] => 'Semiconductor device, base member for semiconductor device and semiconductor device unit' [patent_app_type] => 1 [patent_app_number] => 8/529784 [patent_app_country] => US [patent_app_date] => 1995-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 34 [patent_no_of_words] => 10936 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/747/05747874.pdf [firstpage_image] =>[orig_patent_app_number] => 529784 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3705911 [patent_doc_number] => 05646442 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-08 [patent_title] => 'Contact structure for IC socket' [patent_app_type] => 1 [patent_app_number] => 8/528150 [patent_app_country] => US [patent_app_date] => 1995-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 2935 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/646/05646442.pdf [firstpage_image] =>[orig_patent_app_number] => 528150 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3638319 [patent_doc_number] => 05610439 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-03-11 [patent_title] => 'Press-contact type semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/526320 [patent_app_country] => US [patent_app_date] => 1995-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 39 [patent_no_of_words] => 8466 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/610/05610439.pdf [firstpage_image] =>[orig_patent_app_number] => 526320 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3847415 [patent_doc_number] => 05708300 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-13 [patent_title] => 'Semiconductor device having contoured package body profile' [patent_app_type] => 1 [patent_app_number] => 8/523664 [patent_app_country] => US [patent_app_date] => 1995-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 2173 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/708/05708300.pdf [firstpage_image] =>[orig_patent_app_number] => 523664 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3699999 [patent_doc_number] => 05596227 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-01-21 [patent_title] => 'Ball grid array type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/522550 [patent_app_country] => US [patent_app_date] => 1995-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 2509 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/596/05596227.pdf [firstpage_image] =>[orig_patent_app_number] => 522550 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1568469 [patent_doc_number] => 06376911 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-23 [patent_title] => 'Planarized final passivation for semiconductor devices' [patent_app_type] => B1 [patent_app_number] => 08/518209 [patent_app_country] => US [patent_app_date] => 1995-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 1482 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/376/06376911.pdf [firstpage_image] =>[orig_patent_app_number] => 08518209 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3761314 [patent_doc_number] => 05721452 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-24 [patent_title] => 'Angularly offset stacked die multichip device and method of manufacture' [patent_app_type] => 1 [patent_app_number] => 8/515542 [patent_app_country] => US [patent_app_date] => 1995-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2398 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/721/05721452.pdf [firstpage_image] =>[orig_patent_app_number] => 515542 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3624734 [patent_doc_number] => 05641992 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-24 [patent_title] => 'Metal interconnect structure for an integrated circuit with improved electromigration reliability' [patent_app_type] => 1 [patent_app_number] => 8/513494 [patent_app_country] => US [patent_app_date] => 1995-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2809 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/641/05641992.pdf [firstpage_image] =>[orig_patent_app_number] => 513494 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3594922 [patent_doc_number] => 05567990 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-22 [patent_title] => 'Resin-encapsulated semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/511866 [patent_app_country] => US [patent_app_date] => 1995-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2750 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/567/05567990.pdf [firstpage_image] =>[orig_patent_app_number] => 511866 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4190735 [patent_doc_number] => 06160307 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-12-12 [patent_title] => 'Semiconductor packages having split die pad' [patent_app_type] => 1 [patent_app_number] => 8/512014 [patent_app_country] => US [patent_app_date] => 1995-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 3485 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/160/06160307.pdf [firstpage_image] =>[orig_patent_app_number] => 512014 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3624694 [patent_doc_number] => 05641990 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-24 [patent_title] => 'Laminated solder column' [patent_app_type] => 1 [patent_app_number] => 8/512024 [patent_app_country] => US [patent_app_date] => 1995-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3555 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/641/05641990.pdf [firstpage_image] =>[orig_patent_app_number] => 512024 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3666127 [patent_doc_number] => 05648679 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-15 [patent_title] => 'Tape ball lead integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/511395 [patent_app_country] => US [patent_app_date] => 1995-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 5198 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 344 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/648/05648679.pdf [firstpage_image] =>[orig_patent_app_number] => 511395 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3865961 [patent_doc_number] => 05796158 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-18 [patent_title] => 'Lead frame coining for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/509216 [patent_app_country] => US [patent_app_date] => 1995-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1257 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/796/05796158.pdf [firstpage_image] =>[orig_patent_app_number] => 509216 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3666197 [patent_doc_number] => 05648684 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-15 [patent_title] => 'Endcap chip with conductive, monolithic L-connect for multichip stack' [patent_app_type] => 1 [patent_app_number] => 8/506939 [patent_app_country] => US [patent_app_date] => 1995-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 4219 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/648/05648684.pdf [firstpage_image] =>[orig_patent_app_number] => 506939 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3791188 [patent_doc_number] => 05736789 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-04-07 [patent_title] => 'Ball grid array casing for integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/506656 [patent_app_country] => US [patent_app_date] => 1995-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 3768 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/736/05736789.pdf [firstpage_image] =>[orig_patent_app_number] => 506656 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3672139 [patent_doc_number] => 05600180 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-04 [patent_title] => 'Sealing structure for bumps on a semiconductor integrated circuit chip' [patent_app_type] => 1 [patent_app_number] => 8/505152 [patent_app_country] => US [patent_app_date] => 1995-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 16 [patent_no_of_words] => 5254 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/600/05600180.pdf [firstpage_image] =>[orig_patent_app_number] => 505152 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3706015 [patent_doc_number] => 05646449 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-08 [patent_title] => 'Semiconductor device having a multi-layered conductive structure which includes an aluminum alloy layer, a high melting temperature metal layer, and a high melting temperature nitride layer' [patent_app_type] => 1 [patent_app_number] => 8/504062 [patent_app_country] => US [patent_app_date] => 1995-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3355 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/646/05646449.pdf [firstpage_image] =>[orig_patent_app_number] => 504062 [rel_patent_id] =>[rel_patent_doc_number] =>)