
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4319991
[patent_doc_number] => 06242802
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-05
[patent_title] => 'Moisture enhanced ball grid array package'
[patent_app_type] => 1
[patent_app_number] => 8/502993
[patent_app_country] => US
[patent_app_date] => 1995-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1952
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/242/06242802.pdf
[firstpage_image] =>[orig_patent_app_number] => 502993
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/502993 | Moisture enhanced ball grid array package | Jul 16, 1995 | Issued |
Array
(
[id] => 3794832
[patent_doc_number] => 05841192
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-24
[patent_title] => 'Injection molded ball grid array casing'
[patent_app_type] => 1
[patent_app_number] => 8/502206
[patent_app_country] => US
[patent_app_date] => 1995-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 2539
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/841/05841192.pdf
[firstpage_image] =>[orig_patent_app_number] => 502206
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/502206 | Injection molded ball grid array casing | Jul 12, 1995 | Issued |
| 08/496354 | BALL GRID ARRAY PACKAGE UTILIZING SOLDER COATED SPHERES | Jun 28, 1995 | Abandoned |
Array
(
[id] => 3707238
[patent_doc_number] => 05675177
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-07
[patent_title] => 'Ultra-thin noble metal coatings for electronic packaging'
[patent_app_type] => 1
[patent_app_number] => 8/494476
[patent_app_country] => US
[patent_app_date] => 1995-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 4407
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/675/05675177.pdf
[firstpage_image] =>[orig_patent_app_number] => 494476
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/494476 | Ultra-thin noble metal coatings for electronic packaging | Jun 25, 1995 | Issued |
Array
(
[id] => 3663090
[patent_doc_number] => 05592014
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-07
[patent_title] => 'High breakdown voltage semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/484864
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 14
[patent_no_of_words] => 5250
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 183
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/592/05592014.pdf
[firstpage_image] =>[orig_patent_app_number] => 484864
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/484864 | High breakdown voltage semiconductor device | Jun 6, 1995 | Issued |
Array
(
[id] => 3662151
[patent_doc_number] => 05659203
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-19
[patent_title] => 'Reworkable polymer chip encapsulant'
[patent_app_type] => 1
[patent_app_number] => 8/477062
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 3145
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/659/05659203.pdf
[firstpage_image] =>[orig_patent_app_number] => 477062
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/477062 | Reworkable polymer chip encapsulant | Jun 6, 1995 | Issued |
Array
(
[id] => 3818193
[patent_doc_number] => 05710456
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-20
[patent_title] => 'Silver spot/palladium plate lead frame finish'
[patent_app_type] => 1
[patent_app_number] => 8/483664
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 523
[patent_no_of_claims] => 7
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/710/05710456.pdf
[firstpage_image] =>[orig_patent_app_number] => 483664
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/483664 | Silver spot/palladium plate lead frame finish | Jun 6, 1995 | Issued |
Array
(
[id] => 3835984
[patent_doc_number] => 05739584
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-14
[patent_title] => 'Multiple pin die package'
[patent_app_type] => 1
[patent_app_number] => 8/485060
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3420
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/739/05739584.pdf
[firstpage_image] =>[orig_patent_app_number] => 485060
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/485060 | Multiple pin die package | Jun 6, 1995 | Issued |
Array
(
[id] => 3515032
[patent_doc_number] => 05563443
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-08
[patent_title] => 'Packaged semiconductor device utilizing leadframe attached on a semiconductor chip'
[patent_app_type] => 1
[patent_app_number] => 8/476996
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 3016
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 192
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/563/05563443.pdf
[firstpage_image] =>[orig_patent_app_number] => 476996
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/476996 | Packaged semiconductor device utilizing leadframe attached on a semiconductor chip | Jun 6, 1995 | Issued |
Array
(
[id] => 7647048
[patent_doc_number] => 06476470
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-05
[patent_title] => 'Integrated circuit packaging'
[patent_app_type] => B1
[patent_app_number] => 08/477027
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 2014
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/476/06476470.pdf
[firstpage_image] =>[orig_patent_app_number] => 08477027
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/477027 | Integrated circuit packaging | Jun 6, 1995 | Issued |
Array
(
[id] => 3883574
[patent_doc_number] => 05729054
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-17
[patent_title] => 'Conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes'
[patent_app_type] => 1
[patent_app_number] => 8/473464
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 17
[patent_no_of_words] => 6706
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 20
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/729/05729054.pdf
[firstpage_image] =>[orig_patent_app_number] => 473464
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/473464 | Conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes | Jun 6, 1995 | Issued |
Array
(
[id] => 3653268
[patent_doc_number] => 05640040
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-17
[patent_title] => 'High breakdown voltage semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/481097
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 90
[patent_figures_cnt] => 187
[patent_no_of_words] => 22506
[patent_no_of_claims] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/640/05640040.pdf
[firstpage_image] =>[orig_patent_app_number] => 481097
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/481097 | High breakdown voltage semiconductor device | Jun 6, 1995 | Issued |
Array
(
[id] => 3652156
[patent_doc_number] => 05629560
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-13
[patent_title] => 'Integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/468187
[patent_app_country] => US
[patent_app_date] => 1995-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 3305
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 7
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/629/05629560.pdf
[firstpage_image] =>[orig_patent_app_number] => 468187
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/468187 | Integrated circuit package | Jun 5, 1995 | Issued |
Array
(
[id] => 3686875
[patent_doc_number] => 05633529
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-27
[patent_title] => 'Resin sealing type semiconductor device and method of making the same'
[patent_app_type] => 1
[patent_app_number] => 8/461442
[patent_app_country] => US
[patent_app_date] => 1995-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 28
[patent_no_of_words] => 9560
[patent_no_of_claims] => 59
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/633/05633529.pdf
[firstpage_image] =>[orig_patent_app_number] => 461442
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/461442 | Resin sealing type semiconductor device and method of making the same | Jun 4, 1995 | Issued |
Array
(
[id] => 3727828
[patent_doc_number] => 05682062
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-28
[patent_title] => 'System for interconnecting stacked integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/462876
[patent_app_country] => US
[patent_app_date] => 1995-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 9406
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/682/05682062.pdf
[firstpage_image] =>[orig_patent_app_number] => 462876
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/462876 | System for interconnecting stacked integrated circuits | Jun 4, 1995 | Issued |
Array
(
[id] => 3972631
[patent_doc_number] => 05886396
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-23
[patent_title] => 'Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package'
[patent_app_type] => 1
[patent_app_number] => 8/463112
[patent_app_country] => US
[patent_app_date] => 1995-06-05
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[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/886/05886396.pdf
[firstpage_image] =>[orig_patent_app_number] => 463112
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/463112 | Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package | Jun 4, 1995 | Issued |
Array
(
[id] => 3668990
[patent_doc_number] => 05668409
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Integrated circuit with edge connections and method'
[patent_app_type] => 1
[patent_app_number] => 8/463388
[patent_app_country] => US
[patent_app_date] => 1995-06-05
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[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/668/05668409.pdf
[firstpage_image] =>[orig_patent_app_number] => 463388
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/463388 | Integrated circuit with edge connections and method | Jun 4, 1995 | Issued |
Array
(
[id] => 3524254
[patent_doc_number] => 05530291
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-25
[patent_title] => 'Electronic package assembly and connector for use therewith'
[patent_app_type] => 1
[patent_app_number] => 8/457915
[patent_app_country] => US
[patent_app_date] => 1995-06-01
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/530/05530291.pdf
[firstpage_image] =>[orig_patent_app_number] => 457915
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/457915 | Electronic package assembly and connector for use therewith | May 31, 1995 | Issued |
Array
(
[id] => 3575789
[patent_doc_number] => 05539247
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-23
[patent_title] => 'Selective metal via plug growth technology for deep sub-micrometer ULSI'
[patent_app_type] => 1
[patent_app_number] => 8/447870
[patent_app_country] => US
[patent_app_date] => 1995-05-24
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[pdf_file] => patents/05/539/05539247.pdf
[firstpage_image] =>[orig_patent_app_number] => 447870
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/447870 | Selective metal via plug growth technology for deep sub-micrometer ULSI | May 23, 1995 | Issued |
Array
(
[id] => 3638186
[patent_doc_number] => 05610431
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-03-11
[patent_title] => 'Covers for micromechanical sensors and other semiconductor devices'
[patent_app_type] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/610/05610431.pdf
[firstpage_image] =>[orig_patent_app_number] => 440528
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/440528 | Covers for micromechanical sensors and other semiconductor devices | May 11, 1995 | Issued |