Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3511308 [patent_doc_number] => 05569960 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-29 [patent_title] => 'Electronic component, electronic component assembly and electronic component unit' [patent_app_type] => 1 [patent_app_number] => 8/438466 [patent_app_country] => US [patent_app_date] => 1995-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 6016 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/569/05569960.pdf [firstpage_image] =>[orig_patent_app_number] => 438466 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/438466
Electronic component, electronic component assembly and electronic component unit May 9, 1995 Issued
Array ( [id] => 3586268 [patent_doc_number] => 05581119 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-12-03 [patent_title] => 'IC having heat spreader attached by glob-topping' [patent_app_type] => 1 [patent_app_number] => 8/437838 [patent_app_country] => US [patent_app_date] => 1995-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 2076 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/581/05581119.pdf [firstpage_image] =>[orig_patent_app_number] => 437838 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/437838
IC having heat spreader attached by glob-topping May 8, 1995 Issued
Array ( [id] => 3702308 [patent_doc_number] => 05677566 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-10-14 [patent_title] => 'Semiconductor chip package' [patent_app_type] => 1 [patent_app_number] => 8/436522 [patent_app_country] => US [patent_app_date] => 1995-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2485 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/677/05677566.pdf [firstpage_image] =>[orig_patent_app_number] => 436522 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/436522
Semiconductor chip package May 7, 1995 Issued
Array ( [id] => 3985175 [patent_doc_number] => 05949132 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-07 [patent_title] => 'Dambarless leadframe for molded component encapsulation' [patent_app_type] => 1 [patent_app_number] => 8/434137 [patent_app_country] => US [patent_app_date] => 1995-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 7333 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/949/05949132.pdf [firstpage_image] =>[orig_patent_app_number] => 434137 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/434137
Dambarless leadframe for molded component encapsulation May 1, 1995 Issued
Array ( [id] => 3699949 [patent_doc_number] => 05596224 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-01-21 [patent_title] => 'Molded-in lead frames' [patent_app_type] => 1 [patent_app_number] => 8/431792 [patent_app_country] => US [patent_app_date] => 1995-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 28 [patent_no_of_words] => 4826 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/596/05596224.pdf [firstpage_image] =>[orig_patent_app_number] => 431792 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/431792
Molded-in lead frames Apr 30, 1995 Issued
Array ( [id] => 3653349 [patent_doc_number] => 05640046 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-17 [patent_title] => 'Cooling structure for integrated circuit element modules, electronic device and heat sink block' [patent_app_type] => 1 [patent_app_number] => 8/431978 [patent_app_country] => US [patent_app_date] => 1995-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 29 [patent_no_of_words] => 6582 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/640/05640046.pdf [firstpage_image] =>[orig_patent_app_number] => 431978 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/431978
Cooling structure for integrated circuit element modules, electronic device and heat sink block Apr 30, 1995 Issued
Array ( [id] => 3662344 [patent_doc_number] => 05627407 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-05-06 [patent_title] => 'Electronic package with reduced bending stress' [patent_app_type] => 1 [patent_app_number] => 8/430664 [patent_app_country] => US [patent_app_date] => 1995-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2527 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/627/05627407.pdf [firstpage_image] =>[orig_patent_app_number] => 430664 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/430664
Electronic package with reduced bending stress Apr 27, 1995 Issued
Array ( [id] => 3698689 [patent_doc_number] => 05650661 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-22 [patent_title] => 'Protective coating combination for lead frames' [patent_app_type] => 1 [patent_app_number] => 8/429670 [patent_app_country] => US [patent_app_date] => 1995-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2305 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/650/05650661.pdf [firstpage_image] =>[orig_patent_app_number] => 429670 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/429670
Protective coating combination for lead frames Apr 26, 1995 Issued
Array ( [id] => 3652919 [patent_doc_number] => 05684325 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-04 [patent_title] => 'Light-transmissive resin sealed semiconductor' [patent_app_type] => 1 [patent_app_number] => 8/429036 [patent_app_country] => US [patent_app_date] => 1995-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 6838 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/684/05684325.pdf [firstpage_image] =>[orig_patent_app_number] => 429036 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/429036
Light-transmissive resin sealed semiconductor Apr 25, 1995 Issued
Array ( [id] => 3686923 [patent_doc_number] => 05633532 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-05-27 [patent_title] => 'Semiconductor device interconnection' [patent_app_type] => 1 [patent_app_number] => 8/426074 [patent_app_country] => US [patent_app_date] => 1995-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 26 [patent_no_of_words] => 6245 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/633/05633532.pdf [firstpage_image] =>[orig_patent_app_number] => 426074 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/426074
Semiconductor device interconnection Apr 20, 1995 Issued
Array ( [id] => 3496421 [patent_doc_number] => 05561325 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-01 [patent_title] => 'Mounting structure and fastener for heat sink' [patent_app_type] => 1 [patent_app_number] => 8/426894 [patent_app_country] => US [patent_app_date] => 1995-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 22 [patent_no_of_words] => 3943 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/561/05561325.pdf [firstpage_image] =>[orig_patent_app_number] => 426894 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/426894
Mounting structure and fastener for heat sink Apr 19, 1995 Issued
Array ( [id] => 3721578 [patent_doc_number] => 05616957 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-01 [patent_title] => 'Plastic package type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/424795 [patent_app_country] => US [patent_app_date] => 1995-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3118 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/616/05616957.pdf [firstpage_image] =>[orig_patent_app_number] => 424795 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/424795
Plastic package type semiconductor device Apr 18, 1995 Issued
Array ( [id] => 3662109 [patent_doc_number] => 05659200 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-19 [patent_title] => 'Semiconductor device having radiator structure' [patent_app_type] => 1 [patent_app_number] => 8/421448 [patent_app_country] => US [patent_app_date] => 1995-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 3238 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/659/05659200.pdf [firstpage_image] =>[orig_patent_app_number] => 421448 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/421448
Semiconductor device having radiator structure Apr 12, 1995 Issued
Array ( [id] => 3686860 [patent_doc_number] => 05633528 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-05-27 [patent_title] => 'Lead frame structure for IC devices with strengthened encapsulation adhesion' [patent_app_type] => 1 [patent_app_number] => 8/419224 [patent_app_country] => US [patent_app_date] => 1995-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3646 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/633/05633528.pdf [firstpage_image] =>[orig_patent_app_number] => 419224 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/419224
Lead frame structure for IC devices with strengthened encapsulation adhesion Apr 9, 1995 Issued
Array ( [id] => 3953249 [patent_doc_number] => 05998859 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-07 [patent_title] => 'Packaging and interconnect system for integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/420844 [patent_app_country] => US [patent_app_date] => 1995-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 5429 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/998/05998859.pdf [firstpage_image] =>[orig_patent_app_number] => 420844 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/420844
Packaging and interconnect system for integrated circuits Apr 9, 1995 Issued
Array ( [id] => 3663172 [patent_doc_number] => 05592019 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-01-07 [patent_title] => 'Semiconductor device and module' [patent_app_type] => 1 [patent_app_number] => 8/416196 [patent_app_country] => US [patent_app_date] => 1995-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 30 [patent_no_of_words] => 4766 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/592/05592019.pdf [firstpage_image] =>[orig_patent_app_number] => 416196 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/416196
Semiconductor device and module Apr 3, 1995 Issued
Array ( [id] => 4412976 [patent_doc_number] => 06239479 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-29 [patent_title] => 'Thermal neutron shielded integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/415399 [patent_app_country] => US [patent_app_date] => 1995-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2326 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/239/06239479.pdf [firstpage_image] =>[orig_patent_app_number] => 415399 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/415399
Thermal neutron shielded integrated circuits Apr 2, 1995 Issued
08/414726 THIN PROFILE INTEGRATED CIRCUIT PACKAGE Mar 30, 1995 Abandoned
08/413906 SEMICONDUCTOR DEVICE HAVING TAB-LEADS Mar 29, 1995 Abandoned
Array ( [id] => 3500891 [patent_doc_number] => 05532516 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-07-02 [patent_title] => 'Techniques for via formation and filling' [patent_app_type] => 1 [patent_app_number] => 8/411496 [patent_app_country] => US [patent_app_date] => 1995-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 4120 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/532/05532516.pdf [firstpage_image] =>[orig_patent_app_number] => 411496 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/411496
Techniques for via formation and filling Mar 27, 1995 Issued
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