
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3511308
[patent_doc_number] => 05569960
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-29
[patent_title] => 'Electronic component, electronic component assembly and electronic component unit'
[patent_app_type] => 1
[patent_app_number] => 8/438466
[patent_app_country] => US
[patent_app_date] => 1995-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 6016
[patent_no_of_claims] => 38
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 181
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/569/05569960.pdf
[firstpage_image] =>[orig_patent_app_number] => 438466
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/438466 | Electronic component, electronic component assembly and electronic component unit | May 9, 1995 | Issued |
Array
(
[id] => 3586268
[patent_doc_number] => 05581119
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-03
[patent_title] => 'IC having heat spreader attached by glob-topping'
[patent_app_type] => 1
[patent_app_number] => 8/437838
[patent_app_country] => US
[patent_app_date] => 1995-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 2076
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/581/05581119.pdf
[firstpage_image] =>[orig_patent_app_number] => 437838
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/437838 | IC having heat spreader attached by glob-topping | May 8, 1995 | Issued |
Array
(
[id] => 3702308
[patent_doc_number] => 05677566
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-14
[patent_title] => 'Semiconductor chip package'
[patent_app_type] => 1
[patent_app_number] => 8/436522
[patent_app_country] => US
[patent_app_date] => 1995-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 2485
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/677/05677566.pdf
[firstpage_image] =>[orig_patent_app_number] => 436522
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/436522 | Semiconductor chip package | May 7, 1995 | Issued |
Array
(
[id] => 3985175
[patent_doc_number] => 05949132
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-07
[patent_title] => 'Dambarless leadframe for molded component encapsulation'
[patent_app_type] => 1
[patent_app_number] => 8/434137
[patent_app_country] => US
[patent_app_date] => 1995-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 7333
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/949/05949132.pdf
[firstpage_image] =>[orig_patent_app_number] => 434137
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/434137 | Dambarless leadframe for molded component encapsulation | May 1, 1995 | Issued |
Array
(
[id] => 3699949
[patent_doc_number] => 05596224
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-21
[patent_title] => 'Molded-in lead frames'
[patent_app_type] => 1
[patent_app_number] => 8/431792
[patent_app_country] => US
[patent_app_date] => 1995-05-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 28
[patent_no_of_words] => 4826
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 21
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/596/05596224.pdf
[firstpage_image] =>[orig_patent_app_number] => 431792
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/431792 | Molded-in lead frames | Apr 30, 1995 | Issued |
Array
(
[id] => 3653349
[patent_doc_number] => 05640046
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-17
[patent_title] => 'Cooling structure for integrated circuit element modules, electronic device and heat sink block'
[patent_app_type] => 1
[patent_app_number] => 8/431978
[patent_app_country] => US
[patent_app_date] => 1995-05-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 29
[patent_no_of_words] => 6582
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/640/05640046.pdf
[firstpage_image] =>[orig_patent_app_number] => 431978
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/431978 | Cooling structure for integrated circuit element modules, electronic device and heat sink block | Apr 30, 1995 | Issued |
Array
(
[id] => 3662344
[patent_doc_number] => 05627407
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-06
[patent_title] => 'Electronic package with reduced bending stress'
[patent_app_type] => 1
[patent_app_number] => 8/430664
[patent_app_country] => US
[patent_app_date] => 1995-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2527
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/627/05627407.pdf
[firstpage_image] =>[orig_patent_app_number] => 430664
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/430664 | Electronic package with reduced bending stress | Apr 27, 1995 | Issued |
Array
(
[id] => 3698689
[patent_doc_number] => 05650661
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-22
[patent_title] => 'Protective coating combination for lead frames'
[patent_app_type] => 1
[patent_app_number] => 8/429670
[patent_app_country] => US
[patent_app_date] => 1995-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2305
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 43
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/650/05650661.pdf
[firstpage_image] =>[orig_patent_app_number] => 429670
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/429670 | Protective coating combination for lead frames | Apr 26, 1995 | Issued |
Array
(
[id] => 3652919
[patent_doc_number] => 05684325
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-04
[patent_title] => 'Light-transmissive resin sealed semiconductor'
[patent_app_type] => 1
[patent_app_number] => 8/429036
[patent_app_country] => US
[patent_app_date] => 1995-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 6838
[patent_no_of_claims] => 41
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 54
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/684/05684325.pdf
[firstpage_image] =>[orig_patent_app_number] => 429036
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/429036 | Light-transmissive resin sealed semiconductor | Apr 25, 1995 | Issued |
Array
(
[id] => 3686923
[patent_doc_number] => 05633532
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-27
[patent_title] => 'Semiconductor device interconnection'
[patent_app_type] => 1
[patent_app_number] => 8/426074
[patent_app_country] => US
[patent_app_date] => 1995-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 26
[patent_no_of_words] => 6245
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/633/05633532.pdf
[firstpage_image] =>[orig_patent_app_number] => 426074
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/426074 | Semiconductor device interconnection | Apr 20, 1995 | Issued |
Array
(
[id] => 3496421
[patent_doc_number] => 05561325
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-01
[patent_title] => 'Mounting structure and fastener for heat sink'
[patent_app_type] => 1
[patent_app_number] => 8/426894
[patent_app_country] => US
[patent_app_date] => 1995-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 22
[patent_no_of_words] => 3943
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 64
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/561/05561325.pdf
[firstpage_image] =>[orig_patent_app_number] => 426894
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/426894 | Mounting structure and fastener for heat sink | Apr 19, 1995 | Issued |
Array
(
[id] => 3721578
[patent_doc_number] => 05616957
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-01
[patent_title] => 'Plastic package type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/424795
[patent_app_country] => US
[patent_app_date] => 1995-04-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 3118
[patent_no_of_claims] => 34
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/616/05616957.pdf
[firstpage_image] =>[orig_patent_app_number] => 424795
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/424795 | Plastic package type semiconductor device | Apr 18, 1995 | Issued |
Array
(
[id] => 3662109
[patent_doc_number] => 05659200
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-19
[patent_title] => 'Semiconductor device having radiator structure'
[patent_app_type] => 1
[patent_app_number] => 8/421448
[patent_app_country] => US
[patent_app_date] => 1995-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 14
[patent_no_of_words] => 3238
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 201
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/659/05659200.pdf
[firstpage_image] =>[orig_patent_app_number] => 421448
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/421448 | Semiconductor device having radiator structure | Apr 12, 1995 | Issued |
Array
(
[id] => 3686860
[patent_doc_number] => 05633528
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-27
[patent_title] => 'Lead frame structure for IC devices with strengthened encapsulation adhesion'
[patent_app_type] => 1
[patent_app_number] => 8/419224
[patent_app_country] => US
[patent_app_date] => 1995-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 3646
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 160
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/633/05633528.pdf
[firstpage_image] =>[orig_patent_app_number] => 419224
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/419224 | Lead frame structure for IC devices with strengthened encapsulation adhesion | Apr 9, 1995 | Issued |
Array
(
[id] => 3953249
[patent_doc_number] => 05998859
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-07
[patent_title] => 'Packaging and interconnect system for integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/420844
[patent_app_country] => US
[patent_app_date] => 1995-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 12
[patent_no_of_words] => 5429
[patent_no_of_claims] => 4
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/998/05998859.pdf
[firstpage_image] =>[orig_patent_app_number] => 420844
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/420844 | Packaging and interconnect system for integrated circuits | Apr 9, 1995 | Issued |
Array
(
[id] => 3663172
[patent_doc_number] => 05592019
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-07
[patent_title] => 'Semiconductor device and module'
[patent_app_type] => 1
[patent_app_number] => 8/416196
[patent_app_country] => US
[patent_app_date] => 1995-04-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 30
[patent_no_of_words] => 4766
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[patent_words_short_claim] => 176
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/592/05592019.pdf
[firstpage_image] =>[orig_patent_app_number] => 416196
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/416196 | Semiconductor device and module | Apr 3, 1995 | Issued |
Array
(
[id] => 4412976
[patent_doc_number] => 06239479
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-29
[patent_title] => 'Thermal neutron shielded integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/415399
[patent_app_country] => US
[patent_app_date] => 1995-04-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 2326
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 40
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/239/06239479.pdf
[firstpage_image] =>[orig_patent_app_number] => 415399
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/415399 | Thermal neutron shielded integrated circuits | Apr 2, 1995 | Issued |
| 08/414726 | THIN PROFILE INTEGRATED CIRCUIT PACKAGE | Mar 30, 1995 | Abandoned |
| 08/413906 | SEMICONDUCTOR DEVICE HAVING TAB-LEADS | Mar 29, 1995 | Abandoned |
Array
(
[id] => 3500891
[patent_doc_number] => 05532516
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-02
[patent_title] => 'Techniques for via formation and filling'
[patent_app_type] => 1
[patent_app_number] => 8/411496
[patent_app_country] => US
[patent_app_date] => 1995-03-28
[patent_effective_date] => 0000-00-00
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/532/05532516.pdf
[firstpage_image] =>[orig_patent_app_number] => 411496
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/411496 | Techniques for via formation and filling | Mar 27, 1995 | Issued |