
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3596115
[patent_doc_number] => 05521424
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-28
[patent_title] => 'Semiconductor device having a silicon oxide film containing fluorine atoms'
[patent_app_type] => 1
[patent_app_number] => 8/361536
[patent_app_country] => US
[patent_app_date] => 1994-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 13
[patent_no_of_words] => 3900
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/521/05521424.pdf
[firstpage_image] =>[orig_patent_app_number] => 361536
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/361536 | Semiconductor device having a silicon oxide film containing fluorine atoms | Dec 21, 1994 | Issued |
Array
(
[id] => 3521746
[patent_doc_number] => 05506448
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-09
[patent_title] => 'Semiconductor integrated circuit device having an improved packaging structure'
[patent_app_type] => 1
[patent_app_number] => 8/361970
[patent_app_country] => US
[patent_app_date] => 1994-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1913
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 196
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/506/05506448.pdf
[firstpage_image] =>[orig_patent_app_number] => 361970
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/361970 | Semiconductor integrated circuit device having an improved packaging structure | Dec 21, 1994 | Issued |
Array
(
[id] => 3548723
[patent_doc_number] => 05554881
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-10
[patent_title] => 'Constitution of an electrode arrangement in a semiconductor element'
[patent_app_type] => 1
[patent_app_number] => 8/357492
[patent_app_country] => US
[patent_app_date] => 1994-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 19
[patent_no_of_words] => 5150
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/554/05554881.pdf
[firstpage_image] =>[orig_patent_app_number] => 357492
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/357492 | Constitution of an electrode arrangement in a semiconductor element | Dec 14, 1994 | Issued |
Array
(
[id] => 3592615
[patent_doc_number] => 05517042
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-14
[patent_title] => 'Semiconductor device having multi-level wiring structure'
[patent_app_type] => 1
[patent_app_number] => 8/354556
[patent_app_country] => US
[patent_app_date] => 1994-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 1245
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 245
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/517/05517042.pdf
[firstpage_image] =>[orig_patent_app_number] => 354556
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/354556 | Semiconductor device having multi-level wiring structure | Dec 12, 1994 | Issued |
Array
(
[id] => 3652142
[patent_doc_number] => 05629559
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-13
[patent_title] => 'Package for semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/347484
[patent_app_country] => US
[patent_app_date] => 1994-12-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 23
[patent_no_of_words] => 16661
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 336
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/629/05629559.pdf
[firstpage_image] =>[orig_patent_app_number] => 347484
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/347484 | Package for semiconductor device | Dec 5, 1994 | Issued |
Array
(
[id] => 3568282
[patent_doc_number] => 05483101
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-09
[patent_title] => 'Multilayer printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/341202
[patent_app_country] => US
[patent_app_date] => 1994-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1750
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/483/05483101.pdf
[firstpage_image] =>[orig_patent_app_number] => 341202
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/341202 | Multilayer printed circuit board | Dec 4, 1994 | Issued |
Array
(
[id] => 3465769
[patent_doc_number] => 05468993
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-21
[patent_title] => 'Semiconductor device with polygonal shaped die pad'
[patent_app_type] => 1
[patent_app_number] => 8/353345
[patent_app_country] => US
[patent_app_date] => 1994-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2567
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/468/05468993.pdf
[firstpage_image] =>[orig_patent_app_number] => 353345
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/353345 | Semiconductor device with polygonal shaped die pad | Dec 4, 1994 | Issued |
Array
(
[id] => 3698779
[patent_doc_number] => 05661345
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-26
[patent_title] => 'Semiconductor device having a single-crystal metal wiring'
[patent_app_type] => 1
[patent_app_number] => 8/353214
[patent_app_country] => US
[patent_app_date] => 1994-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 40
[patent_figures_cnt] => 94
[patent_no_of_words] => 16471
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 55
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/661/05661345.pdf
[firstpage_image] =>[orig_patent_app_number] => 353214
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/353214 | Semiconductor device having a single-crystal metal wiring | Nov 30, 1994 | Issued |
Array
(
[id] => 3423352
[patent_doc_number] => 05479038
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-12-26
[patent_title] => 'Semiconductor device having a multilevel metallization'
[patent_app_type] => 1
[patent_app_number] => 8/351125
[patent_app_country] => US
[patent_app_date] => 1994-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 31
[patent_no_of_words] => 5290
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 276
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/479/05479038.pdf
[firstpage_image] =>[orig_patent_app_number] => 351125
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/351125 | Semiconductor device having a multilevel metallization | Nov 29, 1994 | Issued |
Array
(
[id] => 3565724
[patent_doc_number] => 05525838
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-11
[patent_title] => 'Semiconductor device with flow preventing member'
[patent_app_type] => 1
[patent_app_number] => 8/347352
[patent_app_country] => US
[patent_app_date] => 1994-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 3918
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/525/05525838.pdf
[firstpage_image] =>[orig_patent_app_number] => 347352
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/347352 | Semiconductor device with flow preventing member | Nov 29, 1994 | Issued |
Array
(
[id] => 3557668
[patent_doc_number] => 05574311
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-12
[patent_title] => 'Device having pins formed of hardened mixture of conductive metal particle and resin'
[patent_app_type] => 1
[patent_app_number] => 8/350986
[patent_app_country] => US
[patent_app_date] => 1994-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 12
[patent_no_of_words] => 5715
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 48
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/574/05574311.pdf
[firstpage_image] =>[orig_patent_app_number] => 350986
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/350986 | Device having pins formed of hardened mixture of conductive metal particle and resin | Nov 28, 1994 | Issued |
Array
(
[id] => 3654435
[patent_doc_number] => 05606201
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-25
[patent_title] => 'Fluid-cooled power transistor arrangement'
[patent_app_type] => 1
[patent_app_number] => 8/341556
[patent_app_country] => US
[patent_app_date] => 1994-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 14
[patent_no_of_words] => 5668
[patent_no_of_claims] => 34
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 242
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/606/05606201.pdf
[firstpage_image] =>[orig_patent_app_number] => 341556
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/341556 | Fluid-cooled power transistor arrangement | Nov 22, 1994 | Issued |
| 08/345449 | LEAD FRAME FOR SEMICONDUCTOR DEVICE HAVING STAMPED LINEAR GROOVES IN INNER LEADS | Nov 20, 1994 | Abandoned |
Array
(
[id] => 3561841
[patent_doc_number] => 05502337
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-03-26
[patent_title] => 'Semiconductor device structure including multiple interconnection layers with interlayer insulating films'
[patent_app_type] => 1
[patent_app_number] => 8/344572
[patent_app_country] => US
[patent_app_date] => 1994-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 16
[patent_no_of_words] => 3566
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/502/05502337.pdf
[firstpage_image] =>[orig_patent_app_number] => 344572
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/344572 | Semiconductor device structure including multiple interconnection layers with interlayer insulating films | Nov 17, 1994 | Issued |
Array
(
[id] => 3553709
[patent_doc_number] => 05548160
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-20
[patent_title] => 'Method and structure for attaching a semiconductor die to a lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/337912
[patent_app_country] => US
[patent_app_date] => 1994-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 1746
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 38
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/548/05548160.pdf
[firstpage_image] =>[orig_patent_app_number] => 337912
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/337912 | Method and structure for attaching a semiconductor die to a lead frame | Nov 13, 1994 | Issued |
| 08/336997 | MULTI-LAYER LEAD FRAME FOR A SEMICONDUCTOR DEVICE | Nov 9, 1994 | Abandoned |
Array
(
[id] => 3496370
[patent_doc_number] => 05561322
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-01
[patent_title] => 'Semiconductor chip package with enhanced thermal conductivity'
[patent_app_type] => 1
[patent_app_number] => 8/336437
[patent_app_country] => US
[patent_app_date] => 1994-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 9
[patent_no_of_words] => 3237
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 215
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/561/05561322.pdf
[firstpage_image] =>[orig_patent_app_number] => 336437
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/336437 | Semiconductor chip package with enhanced thermal conductivity | Nov 8, 1994 | Issued |
Array
(
[id] => 3586314
[patent_doc_number] => 05581122
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-03
[patent_title] => 'Packaging assembly with consolidated common voltage connections for integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/328734
[patent_app_country] => US
[patent_app_date] => 1994-10-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3631
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/581/05581122.pdf
[firstpage_image] =>[orig_patent_app_number] => 328734
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/328734 | Packaging assembly with consolidated common voltage connections for integrated circuits | Oct 24, 1994 | Issued |
Array
(
[id] => 3554537
[patent_doc_number] => 05572065
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-05
[patent_title] => 'Hermetically sealed ceramic integrated circuit heat dissipating package'
[patent_app_type] => 1
[patent_app_number] => 8/328338
[patent_app_country] => US
[patent_app_date] => 1994-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 26
[patent_no_of_words] => 7127
[patent_no_of_claims] => 63
[patent_no_of_ind_claims] => 15
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/572/05572065.pdf
[firstpage_image] =>[orig_patent_app_number] => 328338
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/328338 | Hermetically sealed ceramic integrated circuit heat dissipating package | Oct 23, 1994 | Issued |
Array
(
[id] => 3568236
[patent_doc_number] => 05483098
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-09
[patent_title] => 'Drop-in heat sink package with window frame flag'
[patent_app_type] => 1
[patent_app_number] => 8/326160
[patent_app_country] => US
[patent_app_date] => 1994-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 2913
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 155
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/483/05483098.pdf
[firstpage_image] =>[orig_patent_app_number] => 326160
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/326160 | Drop-in heat sink package with window frame flag | Oct 17, 1994 | Issued |