
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3583792
[patent_doc_number] => 05491361
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-02-13
[patent_title] => 'Hydrogen out venting electronic package'
[patent_app_type] => 1
[patent_app_number] => 8/324070
[patent_app_country] => US
[patent_app_date] => 1994-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3260
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/491/05491361.pdf
[firstpage_image] =>[orig_patent_app_number] => 324070
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/324070 | Hydrogen out venting electronic package | Oct 13, 1994 | Issued |
| 08/324118 | HERMETICALLY SEALED HYBRID CERAMIC INTEGRATED CIRCUIT PACKAGE | Oct 13, 1994 | Abandoned |
Array
(
[id] => 3427560
[patent_doc_number] => 05459350
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-17
[patent_title] => 'Resin sealed type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/318447
[patent_app_country] => US
[patent_app_date] => 1994-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 12
[patent_no_of_words] => 2166
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/459/05459350.pdf
[firstpage_image] =>[orig_patent_app_number] => 318447
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/318447 | Resin sealed type semiconductor device | Oct 4, 1994 | Issued |
Array
(
[id] => 3548488
[patent_doc_number] => 05554864
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-10
[patent_title] => 'Semiconductor device having improved coverage with increased wiring layers'
[patent_app_type] => 1
[patent_app_number] => 8/314968
[patent_app_country] => US
[patent_app_date] => 1994-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 31
[patent_no_of_words] => 6596
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 231
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/554/05554864.pdf
[firstpage_image] =>[orig_patent_app_number] => 314968
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/314968 | Semiconductor device having improved coverage with increased wiring layers | Sep 28, 1994 | Issued |
Array
(
[id] => 4333948
[patent_doc_number] => 06320257
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-20
[patent_title] => 'Chip packaging technique'
[patent_app_type] => 1
[patent_app_number] => 8/312862
[patent_app_country] => US
[patent_app_date] => 1994-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 31
[patent_no_of_words] => 5479
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/320/06320257.pdf
[firstpage_image] =>[orig_patent_app_number] => 312862
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/312862 | Chip packaging technique | Sep 26, 1994 | Issued |
Array
(
[id] => 3463882
[patent_doc_number] => 05442230
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-08-15
[patent_title] => 'High density integrated circuit assembly combining leadframe leads with conductive traces'
[patent_app_type] => 1
[patent_app_number] => 8/307270
[patent_app_country] => US
[patent_app_date] => 1994-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 3906
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/442/05442230.pdf
[firstpage_image] =>[orig_patent_app_number] => 307270
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/307270 | High density integrated circuit assembly combining leadframe leads with conductive traces | Sep 15, 1994 | Issued |
Array
(
[id] => 3624813
[patent_doc_number] => 05641997
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-24
[patent_title] => 'Plastic-encapsulated semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/305478
[patent_app_country] => US
[patent_app_date] => 1994-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 26
[patent_no_of_words] => 28268
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/641/05641997.pdf
[firstpage_image] =>[orig_patent_app_number] => 305478
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/305478 | Plastic-encapsulated semiconductor device | Sep 12, 1994 | Issued |
Array
(
[id] => 3116022
[patent_doc_number] => 05414300
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-09
[patent_title] => 'Lid for semiconductor package and package having the lid'
[patent_app_type] => 1
[patent_app_number] => 8/301186
[patent_app_country] => US
[patent_app_date] => 1994-09-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 5114
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/414/05414300.pdf
[firstpage_image] =>[orig_patent_app_number] => 301186
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/301186 | Lid for semiconductor package and package having the lid | Sep 5, 1994 | Issued |
| 08/299646 | RESIN MOLD TYPE SEMICONDUCTOR DEVICE | Sep 1, 1994 | Abandoned |
Array
(
[id] => 3596012
[patent_doc_number] => 05488256
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-30
[patent_title] => 'Semiconductor device with interconnect substrates'
[patent_app_type] => 1
[patent_app_number] => 8/299964
[patent_app_country] => US
[patent_app_date] => 1994-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 18
[patent_no_of_words] => 4058
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/488/05488256.pdf
[firstpage_image] =>[orig_patent_app_number] => 299964
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/299964 | Semiconductor device with interconnect substrates | Sep 1, 1994 | Issued |
Array
(
[id] => 3698702
[patent_doc_number] => 05650662
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-22
[patent_title] => 'Direct bonded heat spreader'
[patent_app_type] => 1
[patent_app_number] => 8/293510
[patent_app_country] => US
[patent_app_date] => 1994-08-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 4915
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 67
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/650/05650662.pdf
[firstpage_image] =>[orig_patent_app_number] => 293510
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/293510 | Direct bonded heat spreader | Aug 18, 1994 | Issued |
Array
(
[id] => 3699924
[patent_doc_number] => 05596222
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-21
[patent_title] => 'Wafer of transducer chips'
[patent_app_type] => 1
[patent_app_number] => 8/289688
[patent_app_country] => US
[patent_app_date] => 1994-08-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 26
[patent_no_of_words] => 4093
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/596/05596222.pdf
[firstpage_image] =>[orig_patent_app_number] => 289688
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/289688 | Wafer of transducer chips | Aug 11, 1994 | Issued |
Array
(
[id] => 3735228
[patent_doc_number] => 05635764
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-03
[patent_title] => 'Surface treated structure for solder joint'
[patent_app_type] => 1
[patent_app_number] => 8/284684
[patent_app_country] => US
[patent_app_date] => 1994-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 9798
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 35
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/635/05635764.pdf
[firstpage_image] =>[orig_patent_app_number] => 284684
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/284684 | Surface treated structure for solder joint | Aug 8, 1994 | Issued |
Array
(
[id] => 3602870
[patent_doc_number] => 05559366
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-24
[patent_title] => 'Lead finger tread for a semiconductor lead package system'
[patent_app_type] => 1
[patent_app_number] => 8/285974
[patent_app_country] => US
[patent_app_date] => 1994-08-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 1850
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/559/05559366.pdf
[firstpage_image] =>[orig_patent_app_number] => 285974
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/285974 | Lead finger tread for a semiconductor lead package system | Aug 3, 1994 | Issued |
Array
(
[id] => 3594908
[patent_doc_number] => 05567989
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-22
[patent_title] => 'Highly integrated semiconductor wiring structure'
[patent_app_type] => 1
[patent_app_number] => 8/280887
[patent_app_country] => US
[patent_app_date] => 1994-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 17
[patent_no_of_words] => 3472
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/567/05567989.pdf
[firstpage_image] =>[orig_patent_app_number] => 280887
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/280887 | Highly integrated semiconductor wiring structure | Jul 26, 1994 | Issued |
Array
(
[id] => 3593037
[patent_doc_number] => 05497013
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-03-05
[patent_title] => 'Semi-conductor chip having interdigitated gate runners with gate bonding pads'
[patent_app_type] => 1
[patent_app_number] => 8/276464
[patent_app_country] => US
[patent_app_date] => 1994-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 3090
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/497/05497013.pdf
[firstpage_image] =>[orig_patent_app_number] => 276464
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/276464 | Semi-conductor chip having interdigitated gate runners with gate bonding pads | Jul 17, 1994 | Issued |
Array
(
[id] => 3465796
[patent_doc_number] => 05468995
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-21
[patent_title] => 'Semiconductor device having compliant columnar electrical connections'
[patent_app_type] => 1
[patent_app_number] => 8/270548
[patent_app_country] => US
[patent_app_date] => 1994-07-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 3694
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/468/05468995.pdf
[firstpage_image] =>[orig_patent_app_number] => 270548
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/270548 | Semiconductor device having compliant columnar electrical connections | Jul 4, 1994 | Issued |
Array
(
[id] => 3694317
[patent_doc_number] => 05604376
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-18
[patent_title] => 'Paddleless molded plastic semiconductor chip package'
[patent_app_type] => 1
[patent_app_number] => 8/269294
[patent_app_country] => US
[patent_app_date] => 1994-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 13
[patent_no_of_words] => 2922
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/604/05604376.pdf
[firstpage_image] =>[orig_patent_app_number] => 269294
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/269294 | Paddleless molded plastic semiconductor chip package | Jun 29, 1994 | Issued |
Array
(
[id] => 3707281
[patent_doc_number] => 05675180
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-07
[patent_title] => 'Vertical interconnect process for silicon segments'
[patent_app_type] => 1
[patent_app_number] => 8/265081
[patent_app_country] => US
[patent_app_date] => 1994-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 24
[patent_no_of_words] => 7251
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 47
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/675/05675180.pdf
[firstpage_image] =>[orig_patent_app_number] => 265081
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/265081 | Vertical interconnect process for silicon segments | Jun 22, 1994 | Issued |
Array
(
[id] => 3607045
[patent_doc_number] => 05578874
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-26
[patent_title] => 'Hermetically self-sealing flip chip'
[patent_app_type] => 1
[patent_app_number] => 8/260056
[patent_app_country] => US
[patent_app_date] => 1994-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1552
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 324
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/578/05578874.pdf
[firstpage_image] =>[orig_patent_app_number] => 260056
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/260056 | Hermetically self-sealing flip chip | Jun 13, 1994 | Issued |