Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3583792 [patent_doc_number] => 05491361 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-02-13 [patent_title] => 'Hydrogen out venting electronic package' [patent_app_type] => 1 [patent_app_number] => 8/324070 [patent_app_country] => US [patent_app_date] => 1994-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3260 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/491/05491361.pdf [firstpage_image] =>[orig_patent_app_number] => 324070 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/324070
Hydrogen out venting electronic package Oct 13, 1994 Issued
08/324118 HERMETICALLY SEALED HYBRID CERAMIC INTEGRATED CIRCUIT PACKAGE Oct 13, 1994 Abandoned
Array ( [id] => 3427560 [patent_doc_number] => 05459350 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-17 [patent_title] => 'Resin sealed type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/318447 [patent_app_country] => US [patent_app_date] => 1994-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 2166 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/459/05459350.pdf [firstpage_image] =>[orig_patent_app_number] => 318447 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/318447
Resin sealed type semiconductor device Oct 4, 1994 Issued
Array ( [id] => 3548488 [patent_doc_number] => 05554864 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-09-10 [patent_title] => 'Semiconductor device having improved coverage with increased wiring layers' [patent_app_type] => 1 [patent_app_number] => 8/314968 [patent_app_country] => US [patent_app_date] => 1994-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 31 [patent_no_of_words] => 6596 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/554/05554864.pdf [firstpage_image] =>[orig_patent_app_number] => 314968 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/314968
Semiconductor device having improved coverage with increased wiring layers Sep 28, 1994 Issued
Array ( [id] => 4333948 [patent_doc_number] => 06320257 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-20 [patent_title] => 'Chip packaging technique' [patent_app_type] => 1 [patent_app_number] => 8/312862 [patent_app_country] => US [patent_app_date] => 1994-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 31 [patent_no_of_words] => 5479 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/320/06320257.pdf [firstpage_image] =>[orig_patent_app_number] => 312862 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/312862
Chip packaging technique Sep 26, 1994 Issued
Array ( [id] => 3463882 [patent_doc_number] => 05442230 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-15 [patent_title] => 'High density integrated circuit assembly combining leadframe leads with conductive traces' [patent_app_type] => 1 [patent_app_number] => 8/307270 [patent_app_country] => US [patent_app_date] => 1994-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 3906 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/442/05442230.pdf [firstpage_image] =>[orig_patent_app_number] => 307270 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/307270
High density integrated circuit assembly combining leadframe leads with conductive traces Sep 15, 1994 Issued
Array ( [id] => 3624813 [patent_doc_number] => 05641997 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-24 [patent_title] => 'Plastic-encapsulated semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/305478 [patent_app_country] => US [patent_app_date] => 1994-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 26 [patent_no_of_words] => 28268 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/641/05641997.pdf [firstpage_image] =>[orig_patent_app_number] => 305478 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/305478
Plastic-encapsulated semiconductor device Sep 12, 1994 Issued
Array ( [id] => 3116022 [patent_doc_number] => 05414300 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-09 [patent_title] => 'Lid for semiconductor package and package having the lid' [patent_app_type] => 1 [patent_app_number] => 8/301186 [patent_app_country] => US [patent_app_date] => 1994-09-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 5114 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/414/05414300.pdf [firstpage_image] =>[orig_patent_app_number] => 301186 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/301186
Lid for semiconductor package and package having the lid Sep 5, 1994 Issued
08/299646 RESIN MOLD TYPE SEMICONDUCTOR DEVICE Sep 1, 1994 Abandoned
Array ( [id] => 3596012 [patent_doc_number] => 05488256 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-01-30 [patent_title] => 'Semiconductor device with interconnect substrates' [patent_app_type] => 1 [patent_app_number] => 8/299964 [patent_app_country] => US [patent_app_date] => 1994-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 18 [patent_no_of_words] => 4058 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/488/05488256.pdf [firstpage_image] =>[orig_patent_app_number] => 299964 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/299964
Semiconductor device with interconnect substrates Sep 1, 1994 Issued
Array ( [id] => 3698702 [patent_doc_number] => 05650662 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-22 [patent_title] => 'Direct bonded heat spreader' [patent_app_type] => 1 [patent_app_number] => 8/293510 [patent_app_country] => US [patent_app_date] => 1994-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 4915 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/650/05650662.pdf [firstpage_image] =>[orig_patent_app_number] => 293510 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/293510
Direct bonded heat spreader Aug 18, 1994 Issued
Array ( [id] => 3699924 [patent_doc_number] => 05596222 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-01-21 [patent_title] => 'Wafer of transducer chips' [patent_app_type] => 1 [patent_app_number] => 8/289688 [patent_app_country] => US [patent_app_date] => 1994-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 26 [patent_no_of_words] => 4093 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/596/05596222.pdf [firstpage_image] =>[orig_patent_app_number] => 289688 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/289688
Wafer of transducer chips Aug 11, 1994 Issued
Array ( [id] => 3735228 [patent_doc_number] => 05635764 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-03 [patent_title] => 'Surface treated structure for solder joint' [patent_app_type] => 1 [patent_app_number] => 8/284684 [patent_app_country] => US [patent_app_date] => 1994-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 9798 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/635/05635764.pdf [firstpage_image] =>[orig_patent_app_number] => 284684 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/284684
Surface treated structure for solder joint Aug 8, 1994 Issued
Array ( [id] => 3602870 [patent_doc_number] => 05559366 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-09-24 [patent_title] => 'Lead finger tread for a semiconductor lead package system' [patent_app_type] => 1 [patent_app_number] => 8/285974 [patent_app_country] => US [patent_app_date] => 1994-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 1850 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/559/05559366.pdf [firstpage_image] =>[orig_patent_app_number] => 285974 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/285974
Lead finger tread for a semiconductor lead package system Aug 3, 1994 Issued
Array ( [id] => 3594908 [patent_doc_number] => 05567989 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-22 [patent_title] => 'Highly integrated semiconductor wiring structure' [patent_app_type] => 1 [patent_app_number] => 8/280887 [patent_app_country] => US [patent_app_date] => 1994-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 3472 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/567/05567989.pdf [firstpage_image] =>[orig_patent_app_number] => 280887 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/280887
Highly integrated semiconductor wiring structure Jul 26, 1994 Issued
Array ( [id] => 3593037 [patent_doc_number] => 05497013 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-03-05 [patent_title] => 'Semi-conductor chip having interdigitated gate runners with gate bonding pads' [patent_app_type] => 1 [patent_app_number] => 8/276464 [patent_app_country] => US [patent_app_date] => 1994-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3090 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/497/05497013.pdf [firstpage_image] =>[orig_patent_app_number] => 276464 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/276464
Semi-conductor chip having interdigitated gate runners with gate bonding pads Jul 17, 1994 Issued
Array ( [id] => 3465796 [patent_doc_number] => 05468995 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-11-21 [patent_title] => 'Semiconductor device having compliant columnar electrical connections' [patent_app_type] => 1 [patent_app_number] => 8/270548 [patent_app_country] => US [patent_app_date] => 1994-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3694 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/468/05468995.pdf [firstpage_image] =>[orig_patent_app_number] => 270548 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/270548
Semiconductor device having compliant columnar electrical connections Jul 4, 1994 Issued
Array ( [id] => 3694317 [patent_doc_number] => 05604376 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-18 [patent_title] => 'Paddleless molded plastic semiconductor chip package' [patent_app_type] => 1 [patent_app_number] => 8/269294 [patent_app_country] => US [patent_app_date] => 1994-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 2922 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/604/05604376.pdf [firstpage_image] =>[orig_patent_app_number] => 269294 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/269294
Paddleless molded plastic semiconductor chip package Jun 29, 1994 Issued
Array ( [id] => 3707281 [patent_doc_number] => 05675180 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-10-07 [patent_title] => 'Vertical interconnect process for silicon segments' [patent_app_type] => 1 [patent_app_number] => 8/265081 [patent_app_country] => US [patent_app_date] => 1994-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 7251 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/675/05675180.pdf [firstpage_image] =>[orig_patent_app_number] => 265081 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/265081
Vertical interconnect process for silicon segments Jun 22, 1994 Issued
Array ( [id] => 3607045 [patent_doc_number] => 05578874 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-11-26 [patent_title] => 'Hermetically self-sealing flip chip' [patent_app_type] => 1 [patent_app_number] => 8/260056 [patent_app_country] => US [patent_app_date] => 1994-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1552 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 324 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/578/05578874.pdf [firstpage_image] =>[orig_patent_app_number] => 260056 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/260056
Hermetically self-sealing flip chip Jun 13, 1994 Issued
Menu