Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3515135 [patent_doc_number] => 05563448 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-08 [patent_title] => 'Ohmic contact structure of a highly integrated semiconductor device having two resistance control layers formed between a metal electrode and the substrate' [patent_app_type] => 1 [patent_app_number] => 8/204568 [patent_app_country] => US [patent_app_date] => 1994-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 3205 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/563/05563448.pdf [firstpage_image] =>[orig_patent_app_number] => 204568 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/204568
Ohmic contact structure of a highly integrated semiconductor device having two resistance control layers formed between a metal electrode and the substrate Mar 1, 1994 Issued
Array ( [id] => 3568311 [patent_doc_number] => 05483103 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-01-09 [patent_title] => 'Means for clamping a semi-conductor to a support' [patent_app_type] => 1 [patent_app_number] => 8/201612 [patent_app_country] => US [patent_app_date] => 1994-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3168 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 241 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/483/05483103.pdf [firstpage_image] =>[orig_patent_app_number] => 201612 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/201612
Means for clamping a semi-conductor to a support Feb 23, 1994 Issued
Array ( [id] => 3665372 [patent_doc_number] => 05656863 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-12 [patent_title] => 'Resin seal semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/198078 [patent_app_country] => US [patent_app_date] => 1994-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 67 [patent_figures_cnt] => 115 [patent_no_of_words] => 22780 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/656/05656863.pdf [firstpage_image] =>[orig_patent_app_number] => 198078 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/198078
Resin seal semiconductor package Feb 16, 1994 Issued
Array ( [id] => 3112487 [patent_doc_number] => 05408123 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-04-18 [patent_title] => 'Functional chip to be used while stacked on another chip and stack structure formed by the same' [patent_app_type] => 1 [patent_app_number] => 8/197932 [patent_app_country] => US [patent_app_date] => 1994-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3525 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/408/05408123.pdf [firstpage_image] =>[orig_patent_app_number] => 197932 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/197932
Functional chip to be used while stacked on another chip and stack structure formed by the same Feb 16, 1994 Issued
Array ( [id] => 3491820 [patent_doc_number] => 05475263 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-12-12 [patent_title] => 'Thick film hybrid multilayer circuit' [patent_app_type] => 1 [patent_app_number] => 8/195430 [patent_app_country] => US [patent_app_date] => 1994-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3554 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/475/05475263.pdf [firstpage_image] =>[orig_patent_app_number] => 195430 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/195430
Thick film hybrid multilayer circuit Feb 13, 1994 Issued
Array ( [id] => 3529673 [patent_doc_number] => 05504374 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-04-02 [patent_title] => 'Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material' [patent_app_type] => 1 [patent_app_number] => 8/196628 [patent_app_country] => US [patent_app_date] => 1994-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1948 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 237 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/504/05504374.pdf [firstpage_image] =>[orig_patent_app_number] => 196628 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/196628
Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material Feb 13, 1994 Issued
Array ( [id] => 3692266 [patent_doc_number] => 05696386 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-09 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/193748 [patent_app_country] => US [patent_app_date] => 1994-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 28 [patent_no_of_words] => 10345 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/696/05696386.pdf [firstpage_image] =>[orig_patent_app_number] => 193748 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/193748
Semiconductor device Feb 8, 1994 Issued
Array ( [id] => 3121142 [patent_doc_number] => 05449954 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-09-12 [patent_title] => 'Interconnection structure with TiON layers' [patent_app_type] => 1 [patent_app_number] => 8/193531 [patent_app_country] => US [patent_app_date] => 1994-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2993 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/449/05449954.pdf [firstpage_image] =>[orig_patent_app_number] => 193531 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/193531
Interconnection structure with TiON layers Feb 7, 1994 Issued
08/193359 ELECTRONIC CHIP COMPONENT Feb 2, 1994 Abandoned
08/189530 METHOD FOR JOINING A SEMICONDUCTOR CHIP TO A CHIP CARRIER SUBSTRATE AND RESULTING CHIP PACKAGE Jan 30, 1994 Abandoned
Array ( [id] => 3515102 [patent_doc_number] => 05563446 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-08 [patent_title] => 'Surface mount peripheral leaded and ball grid array package' [patent_app_type] => 1 [patent_app_number] => 8/187238 [patent_app_country] => US [patent_app_date] => 1994-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2819 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/563/05563446.pdf [firstpage_image] =>[orig_patent_app_number] => 187238 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/187238
Surface mount peripheral leaded and ball grid array package Jan 24, 1994 Issued
08/180344 RESIN SEALING TYPE SEMICONDUCTOR DEVICE Jan 11, 1994 Abandoned
Array ( [id] => 3128342 [patent_doc_number] => 05436473 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-07-25 [patent_title] => 'Gate lead for center gate pressure assembled thyristor' [patent_app_type] => 1 [patent_app_number] => 8/175784 [patent_app_country] => US [patent_app_date] => 1993-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 1605 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 293 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/436/05436473.pdf [firstpage_image] =>[orig_patent_app_number] => 175784 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/175784
Gate lead for center gate pressure assembled thyristor Dec 29, 1993 Issued
Array ( [id] => 3463950 [patent_doc_number] => 05442235 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-15 [patent_title] => 'Semiconductor device having an improved metal interconnect structure' [patent_app_type] => 1 [patent_app_number] => 8/172320 [patent_app_country] => US [patent_app_date] => 1993-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 4259 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/442/05442235.pdf [firstpage_image] =>[orig_patent_app_number] => 172320 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/172320
Semiconductor device having an improved metal interconnect structure Dec 22, 1993 Issued
08/171890 LEAD FRAME PACKAGE FOR ELECTRONIC DEVICES Dec 21, 1993 Abandoned
Array ( [id] => 3585761 [patent_doc_number] => 05498900 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-03-12 [patent_title] => 'Semiconductor package with weldable ceramic lid' [patent_app_type] => 1 [patent_app_number] => 8/171958 [patent_app_country] => US [patent_app_date] => 1993-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1203 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/498/05498900.pdf [firstpage_image] =>[orig_patent_app_number] => 171958 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/171958
Semiconductor package with weldable ceramic lid Dec 21, 1993 Issued
Array ( [id] => 1316281 [patent_doc_number] => 06611054 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-08-26 [patent_title] => 'IC package lid for dose enhancement protection' [patent_app_type] => B1 [patent_app_number] => 08/171998 [patent_app_country] => US [patent_app_date] => 1993-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1304 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/611/06611054.pdf [firstpage_image] =>[orig_patent_app_number] => 08171998 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/171998
IC package lid for dose enhancement protection Dec 21, 1993 Issued
Array ( [id] => 3565334 [patent_doc_number] => 05525812 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-06-11 [patent_title] => 'Retractable pin dual in-line package test clip' [patent_app_type] => 1 [patent_app_number] => 8/162828 [patent_app_country] => US [patent_app_date] => 1993-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2594 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/525/05525812.pdf [firstpage_image] =>[orig_patent_app_number] => 162828 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/162828
Retractable pin dual in-line package test clip Dec 6, 1993 Issued
Array ( [id] => 3518034 [patent_doc_number] => 05512778 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-04-30 [patent_title] => 'Semicondcutor device with improved contact' [patent_app_type] => 1 [patent_app_number] => 8/161236 [patent_app_country] => US [patent_app_date] => 1993-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 1650 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/512/05512778.pdf [firstpage_image] =>[orig_patent_app_number] => 161236 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/161236
Semicondcutor device with improved contact Dec 1, 1993 Issued
Array ( [id] => 3416644 [patent_doc_number] => 05444296 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-22 [patent_title] => 'Ball grid array packages for high speed applications' [patent_app_type] => 1 [patent_app_number] => 8/156576 [patent_app_country] => US [patent_app_date] => 1993-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3464 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/444/05444296.pdf [firstpage_image] =>[orig_patent_app_number] => 156576 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/156576
Ball grid array packages for high speed applications Nov 21, 1993 Issued
Menu