| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3515135
[patent_doc_number] => 05563448
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-08
[patent_title] => 'Ohmic contact structure of a highly integrated semiconductor device having two resistance control layers formed between a metal electrode and the substrate'
[patent_app_type] => 1
[patent_app_number] => 8/204568
[patent_app_country] => US
[patent_app_date] => 1994-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 3205
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/563/05563448.pdf
[firstpage_image] =>[orig_patent_app_number] => 204568
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/204568 | Ohmic contact structure of a highly integrated semiconductor device having two resistance control layers formed between a metal electrode and the substrate | Mar 1, 1994 | Issued |
Array
(
[id] => 3568311
[patent_doc_number] => 05483103
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-09
[patent_title] => 'Means for clamping a semi-conductor to a support'
[patent_app_type] => 1
[patent_app_number] => 8/201612
[patent_app_country] => US
[patent_app_date] => 1994-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 3168
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 241
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/483/05483103.pdf
[firstpage_image] =>[orig_patent_app_number] => 201612
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/201612 | Means for clamping a semi-conductor to a support | Feb 23, 1994 | Issued |
Array
(
[id] => 3665372
[patent_doc_number] => 05656863
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-12
[patent_title] => 'Resin seal semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/198078
[patent_app_country] => US
[patent_app_date] => 1994-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 67
[patent_figures_cnt] => 115
[patent_no_of_words] => 22780
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/656/05656863.pdf
[firstpage_image] =>[orig_patent_app_number] => 198078
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/198078 | Resin seal semiconductor package | Feb 16, 1994 | Issued |
Array
(
[id] => 3112487
[patent_doc_number] => 05408123
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-04-18
[patent_title] => 'Functional chip to be used while stacked on another chip and stack structure formed by the same'
[patent_app_type] => 1
[patent_app_number] => 8/197932
[patent_app_country] => US
[patent_app_date] => 1994-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 3525
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/408/05408123.pdf
[firstpage_image] =>[orig_patent_app_number] => 197932
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/197932 | Functional chip to be used while stacked on another chip and stack structure formed by the same | Feb 16, 1994 | Issued |
Array
(
[id] => 3491820
[patent_doc_number] => 05475263
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-12-12
[patent_title] => 'Thick film hybrid multilayer circuit'
[patent_app_type] => 1
[patent_app_number] => 8/195430
[patent_app_country] => US
[patent_app_date] => 1994-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3554
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/475/05475263.pdf
[firstpage_image] =>[orig_patent_app_number] => 195430
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/195430 | Thick film hybrid multilayer circuit | Feb 13, 1994 | Issued |
Array
(
[id] => 3529673
[patent_doc_number] => 05504374
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-02
[patent_title] => 'Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material'
[patent_app_type] => 1
[patent_app_number] => 8/196628
[patent_app_country] => US
[patent_app_date] => 1994-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1948
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 237
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/504/05504374.pdf
[firstpage_image] =>[orig_patent_app_number] => 196628
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/196628 | Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material | Feb 13, 1994 | Issued |
Array
(
[id] => 3692266
[patent_doc_number] => 05696386
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-09
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/193748
[patent_app_country] => US
[patent_app_date] => 1994-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 28
[patent_no_of_words] => 10345
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/696/05696386.pdf
[firstpage_image] =>[orig_patent_app_number] => 193748
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/193748 | Semiconductor device | Feb 8, 1994 | Issued |
Array
(
[id] => 3121142
[patent_doc_number] => 05449954
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-09-12
[patent_title] => 'Interconnection structure with TiON layers'
[patent_app_type] => 1
[patent_app_number] => 8/193531
[patent_app_country] => US
[patent_app_date] => 1994-02-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 2993
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 183
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/449/05449954.pdf
[firstpage_image] =>[orig_patent_app_number] => 193531
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/193531 | Interconnection structure with TiON layers | Feb 7, 1994 | Issued |
| 08/193359 | ELECTRONIC CHIP COMPONENT | Feb 2, 1994 | Abandoned |
| 08/189530 | METHOD FOR JOINING A SEMICONDUCTOR CHIP TO A CHIP CARRIER SUBSTRATE AND RESULTING CHIP PACKAGE | Jan 30, 1994 | Abandoned |
Array
(
[id] => 3515102
[patent_doc_number] => 05563446
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-08
[patent_title] => 'Surface mount peripheral leaded and ball grid array package'
[patent_app_type] => 1
[patent_app_number] => 8/187238
[patent_app_country] => US
[patent_app_date] => 1994-01-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2819
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/563/05563446.pdf
[firstpage_image] =>[orig_patent_app_number] => 187238
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/187238 | Surface mount peripheral leaded and ball grid array package | Jan 24, 1994 | Issued |
| 08/180344 | RESIN SEALING TYPE SEMICONDUCTOR DEVICE | Jan 11, 1994 | Abandoned |
Array
(
[id] => 3128342
[patent_doc_number] => 05436473
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-07-25
[patent_title] => 'Gate lead for center gate pressure assembled thyristor'
[patent_app_type] => 1
[patent_app_number] => 8/175784
[patent_app_country] => US
[patent_app_date] => 1993-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 11
[patent_no_of_words] => 1605
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 293
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/436/05436473.pdf
[firstpage_image] =>[orig_patent_app_number] => 175784
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/175784 | Gate lead for center gate pressure assembled thyristor | Dec 29, 1993 | Issued |
Array
(
[id] => 3463950
[patent_doc_number] => 05442235
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-08-15
[patent_title] => 'Semiconductor device having an improved metal interconnect structure'
[patent_app_type] => 1
[patent_app_number] => 8/172320
[patent_app_country] => US
[patent_app_date] => 1993-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 4259
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/442/05442235.pdf
[firstpage_image] =>[orig_patent_app_number] => 172320
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/172320 | Semiconductor device having an improved metal interconnect structure | Dec 22, 1993 | Issued |
| 08/171890 | LEAD FRAME PACKAGE FOR ELECTRONIC DEVICES | Dec 21, 1993 | Abandoned |
Array
(
[id] => 3585761
[patent_doc_number] => 05498900
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-03-12
[patent_title] => 'Semiconductor package with weldable ceramic lid'
[patent_app_type] => 1
[patent_app_number] => 8/171958
[patent_app_country] => US
[patent_app_date] => 1993-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1203
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/498/05498900.pdf
[firstpage_image] =>[orig_patent_app_number] => 171958
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/171958 | Semiconductor package with weldable ceramic lid | Dec 21, 1993 | Issued |
Array
(
[id] => 1316281
[patent_doc_number] => 06611054
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-08-26
[patent_title] => 'IC package lid for dose enhancement protection'
[patent_app_type] => B1
[patent_app_number] => 08/171998
[patent_app_country] => US
[patent_app_date] => 1993-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 1304
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 61
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/611/06611054.pdf
[firstpage_image] =>[orig_patent_app_number] => 08171998
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/171998 | IC package lid for dose enhancement protection | Dec 21, 1993 | Issued |
Array
(
[id] => 3565334
[patent_doc_number] => 05525812
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-11
[patent_title] => 'Retractable pin dual in-line package test clip'
[patent_app_type] => 1
[patent_app_number] => 8/162828
[patent_app_country] => US
[patent_app_date] => 1993-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2594
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/525/05525812.pdf
[firstpage_image] =>[orig_patent_app_number] => 162828
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/162828 | Retractable pin dual in-line package test clip | Dec 6, 1993 | Issued |
Array
(
[id] => 3518034
[patent_doc_number] => 05512778
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-30
[patent_title] => 'Semicondcutor device with improved contact'
[patent_app_type] => 1
[patent_app_number] => 8/161236
[patent_app_country] => US
[patent_app_date] => 1993-12-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 1650
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/512/05512778.pdf
[firstpage_image] =>[orig_patent_app_number] => 161236
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/161236 | Semicondcutor device with improved contact | Dec 1, 1993 | Issued |
Array
(
[id] => 3416644
[patent_doc_number] => 05444296
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-08-22
[patent_title] => 'Ball grid array packages for high speed applications'
[patent_app_type] => 1
[patent_app_number] => 8/156576
[patent_app_country] => US
[patent_app_date] => 1993-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3464
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/444/05444296.pdf
[firstpage_image] =>[orig_patent_app_number] => 156576
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/156576 | Ball grid array packages for high speed applications | Nov 21, 1993 | Issued |