| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3433020
[patent_doc_number] => 05463245
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-31
[patent_title] => 'Semiconductor integrated circuit device having sealing means'
[patent_app_type] => 1
[patent_app_number] => 8/151176
[patent_app_country] => US
[patent_app_date] => 1993-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 29
[patent_no_of_words] => 7155
[patent_no_of_claims] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/463/05463245.pdf
[firstpage_image] =>[orig_patent_app_number] => 151176
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/151176 | Semiconductor integrated circuit device having sealing means | Nov 11, 1993 | Issued |
Array
(
[id] => 3420369
[patent_doc_number] => 05394014
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-02-28
[patent_title] => 'Semiconductor device improved in light shielding property and light shielding package'
[patent_app_type] => 1
[patent_app_number] => 8/149893
[patent_app_country] => US
[patent_app_date] => 1993-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 3182
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/394/05394014.pdf
[firstpage_image] =>[orig_patent_app_number] => 149893
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/149893 | Semiconductor device improved in light shielding property and light shielding package | Nov 9, 1993 | Issued |
Array
(
[id] => 3561805
[patent_doc_number] => 05502334
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-03-26
[patent_title] => 'Metal wiring'
[patent_app_type] => 1
[patent_app_number] => 8/149946
[patent_app_country] => US
[patent_app_date] => 1993-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 4460
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/502/05502334.pdf
[firstpage_image] =>[orig_patent_app_number] => 149946
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/149946 | Metal wiring | Nov 9, 1993 | Issued |
Array
(
[id] => 3414204
[patent_doc_number] => 05461256
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-24
[patent_title] => 'Portable semiconductor device with resin'
[patent_app_type] => 1
[patent_app_number] => 8/145224
[patent_app_country] => US
[patent_app_date] => 1993-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 27
[patent_no_of_words] => 5640
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/461/05461256.pdf
[firstpage_image] =>[orig_patent_app_number] => 145224
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/145224 | Portable semiconductor device with resin | Nov 2, 1993 | Issued |
Array
(
[id] => 3457536
[patent_doc_number] => 05441809
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-08-15
[patent_title] => 'Dissipative cover tape surface mount device packaging'
[patent_app_type] => 1
[patent_app_number] => 8/144650
[patent_app_country] => US
[patent_app_date] => 1993-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 3322
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/441/05441809.pdf
[firstpage_image] =>[orig_patent_app_number] => 144650
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/144650 | Dissipative cover tape surface mount device packaging | Oct 27, 1993 | Issued |
Array
(
[id] => 3498801
[patent_doc_number] => 05508558
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-16
[patent_title] => 'High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion'
[patent_app_type] => 1
[patent_app_number] => 8/144842
[patent_app_country] => US
[patent_app_date] => 1993-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 1844
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/508/05508558.pdf
[firstpage_image] =>[orig_patent_app_number] => 144842
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/144842 | High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion | Oct 27, 1993 | Issued |
Array
(
[id] => 3557399
[patent_doc_number] => 05519251
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-21
[patent_title] => 'Semiconductor device and method of producing the same'
[patent_app_type] => 1
[patent_app_number] => 8/136462
[patent_app_country] => US
[patent_app_date] => 1993-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 31
[patent_no_of_words] => 6265
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 13
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/519/05519251.pdf
[firstpage_image] =>[orig_patent_app_number] => 136462
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/136462 | Semiconductor device and method of producing the same | Oct 14, 1993 | Issued |
Array
(
[id] => 3453164
[patent_doc_number] => 05424576
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-06-13
[patent_title] => 'Semiconductor device having x-shaped die support member and method for making the same'
[patent_app_type] => 1
[patent_app_number] => 8/133947
[patent_app_country] => US
[patent_app_date] => 1993-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 5839
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/424/05424576.pdf
[firstpage_image] =>[orig_patent_app_number] => 133947
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/133947 | Semiconductor device having x-shaped die support member and method for making the same | Oct 11, 1993 | Issued |
Array
(
[id] => 3119502
[patent_doc_number] => 05410184
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-04-25
[patent_title] => 'Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same'
[patent_app_type] => 1
[patent_app_number] => 8/130830
[patent_app_country] => US
[patent_app_date] => 1993-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1977
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/410/05410184.pdf
[firstpage_image] =>[orig_patent_app_number] => 130830
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/130830 | Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same | Oct 3, 1993 | Issued |
| 08/128576 | A SEMICONDUCTOR DEVICE HAVING A MULTI-LAYERED CONDUCTIVE STRUCTURE WHICH INCLUDES AN ALUMINUM ALLOY LAYER A HIGH MELTING TEMPERATURE METAL LAYER AND A HIGH MELTING TEMPERATURE NITRIDE LAYER | Sep 29, 1993 | Abandoned |
Array
(
[id] => 3077269
[patent_doc_number] => 05365106
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-11-15
[patent_title] => 'Resin mold semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/127060
[patent_app_country] => US
[patent_app_date] => 1993-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1585
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/365/05365106.pdf
[firstpage_image] =>[orig_patent_app_number] => 127060
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/127060 | Resin mold semiconductor device | Sep 26, 1993 | Issued |
Array
(
[id] => 3116005
[patent_doc_number] => 05414299
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-09
[patent_title] => 'Semi-conductor device interconnect package assembly for improved package performance'
[patent_app_type] => 1
[patent_app_number] => 8/126288
[patent_app_country] => US
[patent_app_date] => 1993-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 5275
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 169
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/414/05414299.pdf
[firstpage_image] =>[orig_patent_app_number] => 126288
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/126288 | Semi-conductor device interconnect package assembly for improved package performance | Sep 23, 1993 | Issued |
| 08/120358 | INTEGRATED CIRCUIT PACKAGE | Sep 13, 1993 | Abandoned |
Array
(
[id] => 3466145
[patent_doc_number] => 05391924
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-02-21
[patent_title] => 'Plastic package type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/120336
[patent_app_country] => US
[patent_app_date] => 1993-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 5869
[patent_no_of_claims] => 8
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[patent_words_short_claim] => 153
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/391/05391924.pdf
[firstpage_image] =>[orig_patent_app_number] => 120336
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/120336 | Plastic package type semiconductor device | Sep 13, 1993 | Issued |
Array
(
[id] => 4310137
[patent_doc_number] => 06326678
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-04
[patent_title] => 'Molded plastic package with heat sink and enhanced electrical performance'
[patent_app_type] => 1
[patent_app_number] => 8/116305
[patent_app_country] => US
[patent_app_date] => 1993-09-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 3308
[patent_no_of_claims] => 19
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/326/06326678.pdf
[firstpage_image] =>[orig_patent_app_number] => 116305
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/116305 | Molded plastic package with heat sink and enhanced electrical performance | Sep 2, 1993 | Issued |
Array
(
[id] => 3023147
[patent_doc_number] => 05302850
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-04-12
[patent_title] => 'Semiconductor sealing mold'
[patent_app_type] => 1
[patent_app_number] => 8/114413
[patent_app_country] => US
[patent_app_date] => 1993-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 3058
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 297
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/302/05302850.pdf
[firstpage_image] =>[orig_patent_app_number] => 114413
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/114413 | Semiconductor sealing mold | Aug 29, 1993 | Issued |
Array
(
[id] => 3033389
[patent_doc_number] => 05349235
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-09-20
[patent_title] => 'High density vertically mounted semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/111518
[patent_app_country] => US
[patent_app_date] => 1993-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 1857
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 121
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/349/05349235.pdf
[firstpage_image] =>[orig_patent_app_number] => 111518
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/111518 | High density vertically mounted semiconductor package | Aug 24, 1993 | Issued |
| 08/102434 | INTEGRATED CIRCUIT WITH ACTIVE DEVICES UNDER BOND PADS | Aug 4, 1993 | Abandoned |
Array
(
[id] => 3491836
[patent_doc_number] => 05475264
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-12-12
[patent_title] => 'Arrangement having multilevel wiring structure used for electronic component module'
[patent_app_type] => 1
[patent_app_number] => 8/098074
[patent_app_country] => US
[patent_app_date] => 1993-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 18
[patent_no_of_words] => 5349
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 283
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/475/05475264.pdf
[firstpage_image] =>[orig_patent_app_number] => 098074
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/098074 | Arrangement having multilevel wiring structure used for electronic component module | Jul 27, 1993 | Issued |
| 08/098656 | PERIMETER INDEPENDENT PRECISION LOCATING MEMBER FOR A SEMICONDUCTOR CHIP | Jul 27, 1993 | Pending |