Search

Roy Karl Potter

Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822, 2508, 2811, 3621
Total Applications
2584
Issued Applications
2409
Pending Applications
46
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3433020 [patent_doc_number] => 05463245 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-31 [patent_title] => 'Semiconductor integrated circuit device having sealing means' [patent_app_type] => 1 [patent_app_number] => 8/151176 [patent_app_country] => US [patent_app_date] => 1993-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 29 [patent_no_of_words] => 7155 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/463/05463245.pdf [firstpage_image] =>[orig_patent_app_number] => 151176 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/151176
Semiconductor integrated circuit device having sealing means Nov 11, 1993 Issued
Array ( [id] => 3420369 [patent_doc_number] => 05394014 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-02-28 [patent_title] => 'Semiconductor device improved in light shielding property and light shielding package' [patent_app_type] => 1 [patent_app_number] => 8/149893 [patent_app_country] => US [patent_app_date] => 1993-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 3182 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/394/05394014.pdf [firstpage_image] =>[orig_patent_app_number] => 149893 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/149893
Semiconductor device improved in light shielding property and light shielding package Nov 9, 1993 Issued
Array ( [id] => 3561805 [patent_doc_number] => 05502334 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-03-26 [patent_title] => 'Metal wiring' [patent_app_type] => 1 [patent_app_number] => 8/149946 [patent_app_country] => US [patent_app_date] => 1993-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 4460 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/502/05502334.pdf [firstpage_image] =>[orig_patent_app_number] => 149946 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/149946
Metal wiring Nov 9, 1993 Issued
Array ( [id] => 3414204 [patent_doc_number] => 05461256 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-24 [patent_title] => 'Portable semiconductor device with resin' [patent_app_type] => 1 [patent_app_number] => 8/145224 [patent_app_country] => US [patent_app_date] => 1993-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 27 [patent_no_of_words] => 5640 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/461/05461256.pdf [firstpage_image] =>[orig_patent_app_number] => 145224 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/145224
Portable semiconductor device with resin Nov 2, 1993 Issued
Array ( [id] => 3457536 [patent_doc_number] => 05441809 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-15 [patent_title] => 'Dissipative cover tape surface mount device packaging' [patent_app_type] => 1 [patent_app_number] => 8/144650 [patent_app_country] => US [patent_app_date] => 1993-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3322 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/441/05441809.pdf [firstpage_image] =>[orig_patent_app_number] => 144650 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/144650
Dissipative cover tape surface mount device packaging Oct 27, 1993 Issued
Array ( [id] => 3498801 [patent_doc_number] => 05508558 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-04-16 [patent_title] => 'High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion' [patent_app_type] => 1 [patent_app_number] => 8/144842 [patent_app_country] => US [patent_app_date] => 1993-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 1844 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/508/05508558.pdf [firstpage_image] =>[orig_patent_app_number] => 144842 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/144842
High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion Oct 27, 1993 Issued
Array ( [id] => 3557399 [patent_doc_number] => 05519251 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-05-21 [patent_title] => 'Semiconductor device and method of producing the same' [patent_app_type] => 1 [patent_app_number] => 8/136462 [patent_app_country] => US [patent_app_date] => 1993-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 31 [patent_no_of_words] => 6265 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/519/05519251.pdf [firstpage_image] =>[orig_patent_app_number] => 136462 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/136462
Semiconductor device and method of producing the same Oct 14, 1993 Issued
Array ( [id] => 3453164 [patent_doc_number] => 05424576 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-06-13 [patent_title] => 'Semiconductor device having x-shaped die support member and method for making the same' [patent_app_type] => 1 [patent_app_number] => 8/133947 [patent_app_country] => US [patent_app_date] => 1993-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 5839 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/424/05424576.pdf [firstpage_image] =>[orig_patent_app_number] => 133947 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/133947
Semiconductor device having x-shaped die support member and method for making the same Oct 11, 1993 Issued
Array ( [id] => 3119502 [patent_doc_number] => 05410184 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-04-25 [patent_title] => 'Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same' [patent_app_type] => 1 [patent_app_number] => 8/130830 [patent_app_country] => US [patent_app_date] => 1993-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1977 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/410/05410184.pdf [firstpage_image] =>[orig_patent_app_number] => 130830 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/130830
Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same Oct 3, 1993 Issued
08/128576 A SEMICONDUCTOR DEVICE HAVING A MULTI-LAYERED CONDUCTIVE STRUCTURE WHICH INCLUDES AN ALUMINUM ALLOY LAYER A HIGH MELTING TEMPERATURE METAL LAYER AND A HIGH MELTING TEMPERATURE NITRIDE LAYER Sep 29, 1993 Abandoned
Array ( [id] => 3077269 [patent_doc_number] => 05365106 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-11-15 [patent_title] => 'Resin mold semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/127060 [patent_app_country] => US [patent_app_date] => 1993-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1585 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/365/05365106.pdf [firstpage_image] =>[orig_patent_app_number] => 127060 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/127060
Resin mold semiconductor device Sep 26, 1993 Issued
Array ( [id] => 3116005 [patent_doc_number] => 05414299 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-09 [patent_title] => 'Semi-conductor device interconnect package assembly for improved package performance' [patent_app_type] => 1 [patent_app_number] => 8/126288 [patent_app_country] => US [patent_app_date] => 1993-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 5275 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/414/05414299.pdf [firstpage_image] =>[orig_patent_app_number] => 126288 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/126288
Semi-conductor device interconnect package assembly for improved package performance Sep 23, 1993 Issued
08/120358 INTEGRATED CIRCUIT PACKAGE Sep 13, 1993 Abandoned
Array ( [id] => 3466145 [patent_doc_number] => 05391924 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-02-21 [patent_title] => 'Plastic package type semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/120336 [patent_app_country] => US [patent_app_date] => 1993-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 5869 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/391/05391924.pdf [firstpage_image] =>[orig_patent_app_number] => 120336 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/120336
Plastic package type semiconductor device Sep 13, 1993 Issued
Array ( [id] => 4310137 [patent_doc_number] => 06326678 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-04 [patent_title] => 'Molded plastic package with heat sink and enhanced electrical performance' [patent_app_type] => 1 [patent_app_number] => 8/116305 [patent_app_country] => US [patent_app_date] => 1993-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3308 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/326/06326678.pdf [firstpage_image] =>[orig_patent_app_number] => 116305 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/116305
Molded plastic package with heat sink and enhanced electrical performance Sep 2, 1993 Issued
Array ( [id] => 3023147 [patent_doc_number] => 05302850 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-04-12 [patent_title] => 'Semiconductor sealing mold' [patent_app_type] => 1 [patent_app_number] => 8/114413 [patent_app_country] => US [patent_app_date] => 1993-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3058 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 297 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/302/05302850.pdf [firstpage_image] =>[orig_patent_app_number] => 114413 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/114413
Semiconductor sealing mold Aug 29, 1993 Issued
Array ( [id] => 3033389 [patent_doc_number] => 05349235 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-09-20 [patent_title] => 'High density vertically mounted semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/111518 [patent_app_country] => US [patent_app_date] => 1993-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 1857 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/349/05349235.pdf [firstpage_image] =>[orig_patent_app_number] => 111518 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/111518
High density vertically mounted semiconductor package Aug 24, 1993 Issued
08/102434 INTEGRATED CIRCUIT WITH ACTIVE DEVICES UNDER BOND PADS Aug 4, 1993 Abandoned
Array ( [id] => 3491836 [patent_doc_number] => 05475264 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-12-12 [patent_title] => 'Arrangement having multilevel wiring structure used for electronic component module' [patent_app_type] => 1 [patent_app_number] => 8/098074 [patent_app_country] => US [patent_app_date] => 1993-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 18 [patent_no_of_words] => 5349 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 283 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/475/05475264.pdf [firstpage_image] =>[orig_patent_app_number] => 098074 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/098074
Arrangement having multilevel wiring structure used for electronic component module Jul 27, 1993 Issued
08/098656 PERIMETER INDEPENDENT PRECISION LOCATING MEMBER FOR A SEMICONDUCTOR CHIP Jul 27, 1993 Pending
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