
Roy Karl Potter
Examiner (ID: 13991, Phone: (571)272-1842 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822, 2508, 2811, 3621 |
| Total Applications | 2584 |
| Issued Applications | 2409 |
| Pending Applications | 46 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3023217
[patent_doc_number] => 05302854
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-04-12
[patent_title] => 'Packaging structure of a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/779280
[patent_app_country] => US
[patent_app_date] => 1991-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 2600
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/302/05302854.pdf
[firstpage_image] =>[orig_patent_app_number] => 779280
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/779280 | Packaging structure of a semiconductor device | Oct 17, 1991 | Issued |
Array
(
[id] => 2899603
[patent_doc_number] => 05241211
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-31
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/773788
[patent_app_country] => US
[patent_app_date] => 1991-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 6435
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/241/05241211.pdf
[firstpage_image] =>[orig_patent_app_number] => 773788
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/773788 | Semiconductor device | Oct 10, 1991 | Issued |
Array
(
[id] => 2959439
[patent_doc_number] => 05243217
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-09-07
[patent_title] => 'Sealed semiconductor device with protruding portion'
[patent_app_type] => 1
[patent_app_number] => 7/773219
[patent_app_country] => US
[patent_app_date] => 1991-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 3010
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/243/05243217.pdf
[firstpage_image] =>[orig_patent_app_number] => 773219
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/773219 | Sealed semiconductor device with protruding portion | Oct 8, 1991 | Issued |
Array
(
[id] => 3023255
[patent_doc_number] => 05302856
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-04-12
[patent_title] => 'Semiconductor rectifying device and full-wave rectifier fabricated using the same'
[patent_app_type] => 1
[patent_app_number] => 7/772871
[patent_app_country] => US
[patent_app_date] => 1991-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 4474
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/302/05302856.pdf
[firstpage_image] =>[orig_patent_app_number] => 772871
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/772871 | Semiconductor rectifying device and full-wave rectifier fabricated using the same | Oct 7, 1991 | Issued |
Array
(
[id] => 3092983
[patent_doc_number] => 05278451
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-11
[patent_title] => 'Semiconductor device sealed with mold resin'
[patent_app_type] => 1
[patent_app_number] => 7/767276
[patent_app_country] => US
[patent_app_date] => 1991-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 13
[patent_no_of_words] => 4619
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/278/05278451.pdf
[firstpage_image] =>[orig_patent_app_number] => 767276
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/767276 | Semiconductor device sealed with mold resin | Sep 29, 1991 | Issued |
Array
(
[id] => 2791542
[patent_doc_number] => 05164818
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-11-17
[patent_title] => 'Removable VLSI assembly'
[patent_app_type] => 1
[patent_app_number] => 7/765072
[patent_app_country] => US
[patent_app_date] => 1991-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 1862
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/164/05164818.pdf
[firstpage_image] =>[orig_patent_app_number] => 765072
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/765072 | Removable VLSI assembly | Sep 23, 1991 | Issued |
| 07/762460 | PRESS-CONTACT TYPE SEMICONDUCTOR DEVICE | Sep 18, 1991 | Abandoned |
| 07/757426 | SEMICONDUCTOR SEALING MOLD WITH OPPOSED OPENINGS | Sep 9, 1991 | Abandoned |
Array
(
[id] => 3079979
[patent_doc_number] => 05296737
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-22
[patent_title] => 'Semiconductor device with a plurality of face to face chips'
[patent_app_type] => 1
[patent_app_number] => 7/755655
[patent_app_country] => US
[patent_app_date] => 1991-09-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 5102
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 38
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/296/05296737.pdf
[firstpage_image] =>[orig_patent_app_number] => 755655
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/755655 | Semiconductor device with a plurality of face to face chips | Sep 5, 1991 | Issued |
Array
(
[id] => 2925171
[patent_doc_number] => 05235209
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-10
[patent_title] => 'Multi-layer lead frame for a semiconductor device with contact geometry'
[patent_app_type] => 1
[patent_app_number] => 7/753794
[patent_app_country] => US
[patent_app_date] => 1991-09-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 2417
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 204
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/235/05235209.pdf
[firstpage_image] =>[orig_patent_app_number] => 753794
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/753794 | Multi-layer lead frame for a semiconductor device with contact geometry | Sep 2, 1991 | Issued |
Array
(
[id] => 3070046
[patent_doc_number] => 05294825
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-15
[patent_title] => 'High breakdown voltage semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/753433
[patent_app_country] => US
[patent_app_date] => 1991-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 50
[patent_figures_cnt] => 61
[patent_no_of_words] => 14388
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/294/05294825.pdf
[firstpage_image] =>[orig_patent_app_number] => 753433
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/753433 | High breakdown voltage semiconductor device | Aug 29, 1991 | Issued |
Array
(
[id] => 3493850
[patent_doc_number] => 05471091
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-28
[patent_title] => 'Techniques for via formation and filling'
[patent_app_type] => 1
[patent_app_number] => 7/750832
[patent_app_country] => US
[patent_app_date] => 1991-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 4128
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 168
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/471/05471091.pdf
[firstpage_image] =>[orig_patent_app_number] => 750832
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/750832 | Techniques for via formation and filling | Aug 25, 1991 | Issued |
Array
(
[id] => 2939763
[patent_doc_number] => 05247195
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-09-21
[patent_title] => 'PLDs with high drive capability'
[patent_app_type] => 1
[patent_app_number] => 7/736205
[patent_app_country] => US
[patent_app_date] => 1991-07-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 4561
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/247/05247195.pdf
[firstpage_image] =>[orig_patent_app_number] => 736205
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/736205 | PLDs with high drive capability | Jul 25, 1991 | Issued |
Array
(
[id] => 2845267
[patent_doc_number] => 05160995
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-11-03
[patent_title] => 'Semiconductor IC device with dummy wires'
[patent_app_type] => 1
[patent_app_number] => 7/737605
[patent_app_country] => US
[patent_app_date] => 1991-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 3031
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 181
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/160/05160995.pdf
[firstpage_image] =>[orig_patent_app_number] => 737605
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/737605 | Semiconductor IC device with dummy wires | Jul 24, 1991 | Issued |
Array
(
[id] => 3460951
[patent_doc_number] => 05402002
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-03-28
[patent_title] => 'Bipolar transistor with reduced base/collector capacitance'
[patent_app_type] => 1
[patent_app_number] => 7/737607
[patent_app_country] => US
[patent_app_date] => 1991-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 17
[patent_no_of_words] => 5028
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/402/05402002.pdf
[firstpage_image] =>[orig_patent_app_number] => 737607
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/737607 | Bipolar transistor with reduced base/collector capacitance | Jul 23, 1991 | Issued |
Array
(
[id] => 2938102
[patent_doc_number] => 05220200
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-06-15
[patent_title] => 'Provision of substrate pillars to maintain chip standoff'
[patent_app_type] => 1
[patent_app_number] => 7/734706
[patent_app_country] => US
[patent_app_date] => 1991-07-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 7669
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/220/05220200.pdf
[firstpage_image] =>[orig_patent_app_number] => 734706
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/734706 | Provision of substrate pillars to maintain chip standoff | Jul 22, 1991 | Issued |
Array
(
[id] => 3092816
[patent_doc_number] => 05278442
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-11
[patent_title] => 'Electronic packages and smart structures formed by thermal spray deposition'
[patent_app_type] => 1
[patent_app_number] => 7/730226
[patent_app_country] => US
[patent_app_date] => 1991-07-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 18
[patent_no_of_words] => 5001
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/278/05278442.pdf
[firstpage_image] =>[orig_patent_app_number] => 730226
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/730226 | Electronic packages and smart structures formed by thermal spray deposition | Jul 14, 1991 | Issued |
Array
(
[id] => 2979759
[patent_doc_number] => 05208481
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-05-04
[patent_title] => 'Lead-frame for manufacturing semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 7/728350
[patent_app_country] => US
[patent_app_date] => 1991-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 18
[patent_no_of_words] => 4932
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/208/05208481.pdf
[firstpage_image] =>[orig_patent_app_number] => 728350
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/728350 | Lead-frame for manufacturing semiconductor devices | Jul 10, 1991 | Issued |
Array
(
[id] => 2980492
[patent_doc_number] => 05225710
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-07-06
[patent_title] => 'Highly integrated electronic component with heat-conducting plate'
[patent_app_type] => 1
[patent_app_number] => 7/727048
[patent_app_country] => US
[patent_app_date] => 1991-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1837
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/225/05225710.pdf
[firstpage_image] =>[orig_patent_app_number] => 727048
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/727048 | Highly integrated electronic component with heat-conducting plate | Jul 8, 1991 | Issued |
| 07/726660 | MOISTURE RELIEF FOR CHIP CARRIERS | Jul 7, 1991 | Abandoned |